RESIN COMPOSITION AND RESIN FILM
To provide a resin composition that further improves dielectric properties of an aliphatic thermoplastic resin, enabling coping with higher frequency electronic apparatuses, and a resin film.SOLUTION: A resin composition contains: (A) a thermoplastic resin containing a constitutional unit induced fr...
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| creator | NISHIYAMA TEPPEI NAKAJIMA SHOTO KAKIZAKA KOTA |
| description | To provide a resin composition that further improves dielectric properties of an aliphatic thermoplastic resin, enabling coping with higher frequency electronic apparatuses, and a resin film.SOLUTION: A resin composition contains: (A) a thermoplastic resin containing a constitutional unit induced from a diamine component that contains, based on the total amount of it, a dimer diamine composition of 40 mol% or more, the dimer diamine composition predominantly composed of a dimer diamine in which two terminal carboxylic acid groups of a dimer acid are substituted with a primary aminomethyl group or amino group; and (B) a liquid crystalline polymer filler. The (B) component content is 15-50 vol.% relative to the total content of the (A) component and the (B) component.SELECTED DRAWING: None
【課題】脂肪族系熱可塑性樹脂の誘電特性をさらに改善することによって、電子機器の高周波化への対応が可能な樹脂組成物及び樹脂フィルムを提供する。【解決手段】（Ａ）全ジアミン成分に対し、ダイマー酸の二つの末端カルボン酸基が１級のアミノメチル基又はアミノ基に置換されてなるダイマージアミンを主成分とするダイマージアミン組成物を４０モル％以上含有するジアミン成分から誘導される構造単位を含有する熱可塑性樹脂及び（Ｂ）液晶性高分子フィラーを含有するとともに、（Ｂ）成分が（Ａ）成分及び（Ｂ）成分の合計に対し１５〜５０体積％の範囲内である樹脂組成物。【選択図】なし |
| format | Patent |
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【課題】脂肪族系熱可塑性樹脂の誘電特性をさらに改善することによって、電子機器の高周波化への対応が可能な樹脂組成物及び樹脂フィルムを提供する。【解決手段】（Ａ）全ジアミン成分に対し、ダイマー酸の二つの末端カルボン酸基が１級のアミノメチル基又はアミノ基に置換されてなるダイマージアミンを主成分とするダイマージアミン組成物を４０モル％以上含有するジアミン成分から誘導される構造単位を含有する熱可塑性樹脂及び（Ｂ）液晶性高分子フィラーを含有するとともに、（Ｂ）成分が（Ａ）成分及び（Ｂ）成分の合計に対し１５〜５０体積％の範囲内である樹脂組成物。【選択図】なし</description><language>eng ; jpn</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210726&DB=EPODOC&CC=JP&NR=2021105147A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210726&DB=EPODOC&CC=JP&NR=2021105147A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NISHIYAMA TEPPEI</creatorcontrib><creatorcontrib>NAKAJIMA SHOTO</creatorcontrib><creatorcontrib>KAKIZAKA KOTA</creatorcontrib><title>RESIN COMPOSITION AND RESIN FILM</title><description>To provide a resin composition that further improves dielectric properties of an aliphatic thermoplastic resin, enabling coping with higher frequency electronic apparatuses, and a resin film.SOLUTION: A resin composition contains: (A) a thermoplastic resin containing a constitutional unit induced from a diamine component that contains, based on the total amount of it, a dimer diamine composition of 40 mol% or more, the dimer diamine composition predominantly composed of a dimer diamine in which two terminal carboxylic acid groups of a dimer acid are substituted with a primary aminomethyl group or amino group; and (B) a liquid crystalline polymer filler. The (B) component content is 15-50 vol.% relative to the total content of the (A) component and the (B) component.SELECTED DRAWING: None
【課題】脂肪族系熱可塑性樹脂の誘電特性をさらに改善することによって、電子機器の高周波化への対応が可能な樹脂組成物及び樹脂フィルムを提供する。【解決手段】（Ａ）全ジアミン成分に対し、ダイマー酸の二つの末端カルボン酸基が１級のアミノメチル基又はアミノ基に置換されてなるダイマージアミンを主成分とするダイマージアミン組成物を４０モル％以上含有するジアミン成分から誘導される構造単位を含有する熱可塑性樹脂及び（Ｂ）液晶性高分子フィラーを含有するとともに、（Ｂ）成分が（Ａ）成分及び（Ｂ）成分の合計に対し１５〜５０体積％の範囲内である樹脂組成物。【選択図】なし</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAIcg329FNw9vcN8A_2DPH091Nw9HOBirp5-vjyMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAyNDQwNTQxNzR2OiFAEAM9giOg</recordid><startdate>20210726</startdate><enddate>20210726</enddate><creator>NISHIYAMA TEPPEI</creator><creator>NAKAJIMA SHOTO</creator><creator>KAKIZAKA KOTA</creator><scope>EVB</scope></search><sort><creationdate>20210726</creationdate><title>RESIN COMPOSITION AND RESIN FILM</title><author>NISHIYAMA TEPPEI ; NAKAJIMA SHOTO ; KAKIZAKA KOTA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021105147A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>NISHIYAMA TEPPEI</creatorcontrib><creatorcontrib>NAKAJIMA SHOTO</creatorcontrib><creatorcontrib>KAKIZAKA KOTA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NISHIYAMA TEPPEI</au><au>NAKAJIMA SHOTO</au><au>KAKIZAKA KOTA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION AND RESIN FILM</title><date>2021-07-26</date><risdate>2021</risdate><abstract>To provide a resin composition that further improves dielectric properties of an aliphatic thermoplastic resin, enabling coping with higher frequency electronic apparatuses, and a resin film.SOLUTION: A resin composition contains: (A) a thermoplastic resin containing a constitutional unit induced from a diamine component that contains, based on the total amount of it, a dimer diamine composition of 40 mol% or more, the dimer diamine composition predominantly composed of a dimer diamine in which two terminal carboxylic acid groups of a dimer acid are substituted with a primary aminomethyl group or amino group; and (B) a liquid crystalline polymer filler. The (B) component content is 15-50 vol.% relative to the total content of the (A) component and the (B) component.SELECTED DRAWING: None
【課題】脂肪族系熱可塑性樹脂の誘電特性をさらに改善することによって、電子機器の高周波化への対応が可能な樹脂組成物及び樹脂フィルムを提供する。【解決手段】（Ａ）全ジアミン成分に対し、ダイマー酸の二つの末端カルボン酸基が１級のアミノメチル基又はアミノ基に置換されてなるダイマージアミンを主成分とするダイマージアミン組成物を４０モル％以上含有するジアミン成分から誘導される構造単位を含有する熱可塑性樹脂及び（Ｂ）液晶性高分子フィラーを含有するとともに、（Ｂ）成分が（Ａ）成分及び（Ｂ）成分の合計に対し１５〜５０体積％の範囲内である樹脂組成物。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | RESIN COMPOSITION AND RESIN FILM |
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