METHOD OF POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP

To detect the end point position of polishing in order to finish polishing at an appropriate position.SOLUTION: According to an embodiment, a method of chemical-mechanically polishing a substrate provided with a functional chip includes a step of placing a functional chip on a substrate, a step of p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HATAKEYAMA MASAKI, TOGAWA TETSUJI, SOFUGAWA TAKUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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