METHOD OF POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP
To detect the end point position of polishing in order to finish polishing at an appropriate position.SOLUTION: According to an embodiment, a method of chemical-mechanically polishing a substrate provided with a functional chip includes a step of placing a functional chip on a substrate, a step of p...
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| creator | HATAKEYAMA MASAKI TOGAWA TETSUJI SOFUGAWA TAKUJI |
| description | To detect the end point position of polishing in order to finish polishing at an appropriate position.SOLUTION: According to an embodiment, a method of chemical-mechanically polishing a substrate provided with a functional chip includes a step of placing a functional chip on a substrate, a step of placing an end point detection element on the substrate, a step of sealing the substrate on which the functional chip and the end point detection element are disposed with an insulating material, a step of polishing the insulating material, and a step of detecting the end point of polishing based on the end point detection element while polishing the insulating material.SELECTED DRAWING: Figure 1
【課題】適切な位置で研磨を終了するために、研磨の終点位置を検知する。【解決手段】一実施形態によれば、機能性チップを備える基板を化学機械的に研磨する方法が提供され、かかる方法は、基板に機能性チップを配置するステップと、前記基板に終点検知要素を配置するステップと、前記機能性チップおよび前記終点検知要素が配置された基板を絶縁材で封止するステップと、前記絶縁材を研磨するステップと、前記絶縁材を研磨しているときに、前記終点検知要素に基づいて研磨の終点を検知するステップと、を有する。【選択図】図１ |
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【課題】適切な位置で研磨を終了するために、研磨の終点位置を検知する。【解決手段】一実施形態によれば、機能性チップを備える基板を化学機械的に研磨する方法が提供され、かかる方法は、基板に機能性チップを配置するステップと、前記基板に終点検知要素を配置するステップと、前記機能性チップおよび前記終点検知要素が配置された基板を絶縁材で封止するステップと、前記絶縁材を研磨するステップと、前記絶縁材を研磨しているときに、前記終点検知要素に基づいて研磨の終点を検知するステップと、を有する。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=JP&NR=2021103789A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=JP&NR=2021103789A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HATAKEYAMA MASAKI</creatorcontrib><creatorcontrib>TOGAWA TETSUJI</creatorcontrib><creatorcontrib>SOFUGAWA TAKUJI</creatorcontrib><title>METHOD OF POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP</title><description>To detect the end point position of polishing in order to finish polishing at an appropriate position.SOLUTION: According to an embodiment, a method of chemical-mechanically polishing a substrate provided with a functional chip includes a step of placing a functional chip on a substrate, a step of placing an end point detection element on the substrate, a step of sealing the substrate on which the functional chip and the end point detection element are disposed with an insulating material, a step of polishing the insulating material, and a step of detecting the end point of polishing based on the end point detection element while polishing the insulating material.SELECTED DRAWING: Figure 1
【課題】適切な位置で研磨を終了するために、研磨の終点位置を検知する。【解決手段】一実施形態によれば、機能性チップを備える基板を化学機械的に研磨する方法が提供され、かかる方法は、基板に機能性チップを配置するステップと、前記基板に終点検知要素を配置するステップと、前記機能性チップおよび前記終点検知要素が配置された基板を絶縁材で封止するステップと、前記絶縁材を研磨するステップと、前記絶縁材を研磨しているときに、前記終点検知要素に基づいて研磨の終点を検知するステップと、を有する。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD2dQ3x8HdR8HdTCPD38Qz28PRzVwgOdQoOCXIMcVUICPIP83RxdVEI9wzxUHAL9XMO8fT3c_RRcPbwDOBhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoaGBsbmFpaOxkQpAgBDIyno</recordid><startdate>20210715</startdate><enddate>20210715</enddate><creator>HATAKEYAMA MASAKI</creator><creator>TOGAWA TETSUJI</creator><creator>SOFUGAWA TAKUJI</creator><scope>EVB</scope></search><sort><creationdate>20210715</creationdate><title>METHOD OF POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP</title><author>HATAKEYAMA MASAKI ; TOGAWA TETSUJI ; SOFUGAWA TAKUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021103789A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HATAKEYAMA MASAKI</creatorcontrib><creatorcontrib>TOGAWA TETSUJI</creatorcontrib><creatorcontrib>SOFUGAWA TAKUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HATAKEYAMA MASAKI</au><au>TOGAWA TETSUJI</au><au>SOFUGAWA TAKUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP</title><date>2021-07-15</date><risdate>2021</risdate><abstract>To detect the end point position of polishing in order to finish polishing at an appropriate position.SOLUTION: According to an embodiment, a method of chemical-mechanically polishing a substrate provided with a functional chip includes a step of placing a functional chip on a substrate, a step of placing an end point detection element on the substrate, a step of sealing the substrate on which the functional chip and the end point detection element are disposed with an insulating material, a step of polishing the insulating material, and a step of detecting the end point of polishing based on the end point detection element while polishing the insulating material.SELECTED DRAWING: Figure 1
【課題】適切な位置で研磨を終了するために、研磨の終点位置を検知する。【解決手段】一実施形態によれば、機能性チップを備える基板を化学機械的に研磨する方法が提供され、かかる方法は、基板に機能性チップを配置するステップと、前記基板に終点検知要素を配置するステップと、前記機能性チップおよび前記終点検知要素が配置された基板を絶縁材で封止するステップと、前記絶縁材を研磨するステップと、前記絶縁材を研磨しているときに、前記終点検知要素に基づいて研磨の終点を検知するステップと、を有する。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | METHOD OF POLISHING SUBSTRATE PROVIDED WITH FUNCTIONAL CHIP |
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