WAFER EXTENSION DEVICE

To provide a wafer extension device containing a wafer extension ring, a mounting stage, a wafer extension assembly, and a fixing mechanism.SOLUTION: A wafer expansion ring contains an outer frame and a film, in which the film is connected to the outer frame, and attaches a wafer. A mounting stage m...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WU QIN DA, LIU JIN CHENG, TSENG JENTUNG, XU KUN JI, TSENG SHENG-TOU, QIU CHUI LIANG
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator WU QIN DA
LIU JIN CHENG
TSENG JENTUNG
XU KUN JI
TSENG SHENG-TOU
QIU CHUI LIANG
description To provide a wafer extension device containing a wafer extension ring, a mounting stage, a wafer extension assembly, and a fixing mechanism.SOLUTION: A wafer expansion ring contains an outer frame and a film, in which the film is connected to the outer frame, and attaches a wafer. A mounting stage mounts the wafer expansion ring. A wafer expansion assembly is for pressing the film to be expanded, and the wafer expansion assembly contains a pressing roll having a different size or a pressing roll having a different distance until a center of a wafer. The fixing mechanism fixes the outer frame of the wafer expansion ring with the mounting stage, and expands the wafer by expanding the film at the time when the wafer expansion assembly presses the film to an upper side. The present invention further provides a force application assembly, applying a power to the film to change a local tension of the film.SELECTED DRAWING: Figure 3 【課題】ウエハー拡張リング、搭載台、ウエハー拡張アセンブリ及び固定機構を含むウエハー拡張装置を提供する。【解決手段】ウエハー拡張リングは外枠及びフィルムを含み、フィルムが外枠に接続され、かつウエハーを貼附つける。搭載台はウエハー拡張リングを搭載する。ウエハー拡張アセンブリはフィルムを押え付けて拡張させるものであり、かつウエハー拡張アセンブリは異なるサイズの押え付けロール、またはウエハーの中心までの距離が異なる押え付けロールを含む。固定機構は搭載台と共にウエハー拡張リングの外枠を固定し、かつ、ウエハー拡張アセンブリがフィルムを上へ押え付けた時に、フィルムを拡張してウエハーを拡張する。本発明はさらに加力アセンブリを提供し、フィルムに加力して、フィルムの局部張力を変える。【選択図】図3
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021077841A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021077841A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021077841A3</originalsourceid><addsrcrecordid>eNrjZBALd3RzDVJwjQhx9Qv29PdTcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGhgbm5hYmho7GRCkCAPFCH5M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WAFER EXTENSION DEVICE</title><source>esp@cenet</source><creator>WU QIN DA ; LIU JIN CHENG ; TSENG JENTUNG ; XU KUN JI ; TSENG SHENG-TOU ; QIU CHUI LIANG</creator><creatorcontrib>WU QIN DA ; LIU JIN CHENG ; TSENG JENTUNG ; XU KUN JI ; TSENG SHENG-TOU ; QIU CHUI LIANG</creatorcontrib><description>To provide a wafer extension device containing a wafer extension ring, a mounting stage, a wafer extension assembly, and a fixing mechanism.SOLUTION: A wafer expansion ring contains an outer frame and a film, in which the film is connected to the outer frame, and attaches a wafer. A mounting stage mounts the wafer expansion ring. A wafer expansion assembly is for pressing the film to be expanded, and the wafer expansion assembly contains a pressing roll having a different size or a pressing roll having a different distance until a center of a wafer. The fixing mechanism fixes the outer frame of the wafer expansion ring with the mounting stage, and expands the wafer by expanding the film at the time when the wafer expansion assembly presses the film to an upper side. The present invention further provides a force application assembly, applying a power to the film to change a local tension of the film.SELECTED DRAWING: Figure 3 【課題】ウエハー拡張リング、搭載台、ウエハー拡張アセンブリ及び固定機構を含むウエハー拡張装置を提供する。【解決手段】ウエハー拡張リングは外枠及びフィルムを含み、フィルムが外枠に接続され、かつウエハーを貼附つける。搭載台はウエハー拡張リングを搭載する。ウエハー拡張アセンブリはフィルムを押え付けて拡張させるものであり、かつウエハー拡張アセンブリは異なるサイズの押え付けロール、またはウエハーの中心までの距離が異なる押え付けロールを含む。固定機構は搭載台と共にウエハー拡張リングの外枠を固定し、かつ、ウエハー拡張アセンブリがフィルムを上へ押え付けた時に、フィルムを拡張してウエハーを拡張する。本発明はさらに加力アセンブリを提供し、フィルムに加力して、フィルムの局部張力を変える。【選択図】図3</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210520&amp;DB=EPODOC&amp;CC=JP&amp;NR=2021077841A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210520&amp;DB=EPODOC&amp;CC=JP&amp;NR=2021077841A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU QIN DA</creatorcontrib><creatorcontrib>LIU JIN CHENG</creatorcontrib><creatorcontrib>TSENG JENTUNG</creatorcontrib><creatorcontrib>XU KUN JI</creatorcontrib><creatorcontrib>TSENG SHENG-TOU</creatorcontrib><creatorcontrib>QIU CHUI LIANG</creatorcontrib><title>WAFER EXTENSION DEVICE</title><description>To provide a wafer extension device containing a wafer extension ring, a mounting stage, a wafer extension assembly, and a fixing mechanism.SOLUTION: A wafer expansion ring contains an outer frame and a film, in which the film is connected to the outer frame, and attaches a wafer. A mounting stage mounts the wafer expansion ring. A wafer expansion assembly is for pressing the film to be expanded, and the wafer expansion assembly contains a pressing roll having a different size or a pressing roll having a different distance until a center of a wafer. The fixing mechanism fixes the outer frame of the wafer expansion ring with the mounting stage, and expands the wafer by expanding the film at the time when the wafer expansion assembly presses the film to an upper side. The present invention further provides a force application assembly, applying a power to the film to change a local tension of the film.SELECTED DRAWING: Figure 3 【課題】ウエハー拡張リング、搭載台、ウエハー拡張アセンブリ及び固定機構を含むウエハー拡張装置を提供する。【解決手段】ウエハー拡張リングは外枠及びフィルムを含み、フィルムが外枠に接続され、かつウエハーを貼附つける。搭載台はウエハー拡張リングを搭載する。ウエハー拡張アセンブリはフィルムを押え付けて拡張させるものであり、かつウエハー拡張アセンブリは異なるサイズの押え付けロール、またはウエハーの中心までの距離が異なる押え付けロールを含む。固定機構は搭載台と共にウエハー拡張リングの外枠を固定し、かつ、ウエハー拡張アセンブリがフィルムを上へ押え付けた時に、フィルムを拡張してウエハーを拡張する。本発明はさらに加力アセンブリを提供し、フィルムに加力して、フィルムの局部張力を変える。【選択図】図3</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBALd3RzDVJwjQhx9Qv29PdTcHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgZGhgbm5hYmho7GRCkCAPFCH5M</recordid><startdate>20210520</startdate><enddate>20210520</enddate><creator>WU QIN DA</creator><creator>LIU JIN CHENG</creator><creator>TSENG JENTUNG</creator><creator>XU KUN JI</creator><creator>TSENG SHENG-TOU</creator><creator>QIU CHUI LIANG</creator><scope>EVB</scope></search><sort><creationdate>20210520</creationdate><title>WAFER EXTENSION DEVICE</title><author>WU QIN DA ; LIU JIN CHENG ; TSENG JENTUNG ; XU KUN JI ; TSENG SHENG-TOU ; QIU CHUI LIANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021077841A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WU QIN DA</creatorcontrib><creatorcontrib>LIU JIN CHENG</creatorcontrib><creatorcontrib>TSENG JENTUNG</creatorcontrib><creatorcontrib>XU KUN JI</creatorcontrib><creatorcontrib>TSENG SHENG-TOU</creatorcontrib><creatorcontrib>QIU CHUI LIANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU QIN DA</au><au>LIU JIN CHENG</au><au>TSENG JENTUNG</au><au>XU KUN JI</au><au>TSENG SHENG-TOU</au><au>QIU CHUI LIANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER EXTENSION DEVICE</title><date>2021-05-20</date><risdate>2021</risdate><abstract>To provide a wafer extension device containing a wafer extension ring, a mounting stage, a wafer extension assembly, and a fixing mechanism.SOLUTION: A wafer expansion ring contains an outer frame and a film, in which the film is connected to the outer frame, and attaches a wafer. A mounting stage mounts the wafer expansion ring. A wafer expansion assembly is for pressing the film to be expanded, and the wafer expansion assembly contains a pressing roll having a different size or a pressing roll having a different distance until a center of a wafer. The fixing mechanism fixes the outer frame of the wafer expansion ring with the mounting stage, and expands the wafer by expanding the film at the time when the wafer expansion assembly presses the film to an upper side. The present invention further provides a force application assembly, applying a power to the film to change a local tension of the film.SELECTED DRAWING: Figure 3 【課題】ウエハー拡張リング、搭載台、ウエハー拡張アセンブリ及び固定機構を含むウエハー拡張装置を提供する。【解決手段】ウエハー拡張リングは外枠及びフィルムを含み、フィルムが外枠に接続され、かつウエハーを貼附つける。搭載台はウエハー拡張リングを搭載する。ウエハー拡張アセンブリはフィルムを押え付けて拡張させるものであり、かつウエハー拡張アセンブリは異なるサイズの押え付けロール、またはウエハーの中心までの距離が異なる押え付けロールを含む。固定機構は搭載台と共にウエハー拡張リングの外枠を固定し、かつ、ウエハー拡張アセンブリがフィルムを上へ押え付けた時に、フィルムを拡張してウエハーを拡張する。本発明はさらに加力アセンブリを提供し、フィルムに加力して、フィルムの局部張力を変える。【選択図】図3</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; jpn
recordid cdi_epo_espacenet_JP2021077841A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WAFER EXTENSION DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T05%3A44%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WU%20QIN%20DA&rft.date=2021-05-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2021077841A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true