CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

To provide a circuit board which can eliminate influence of environmental humidity in use as much as possible, and in which an insulating resin layer can maintain the initial dielectric properties for a long period of time.SOLUTION: A circuit board 101 includes: an insulating resin layer 10; a patte...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISHIYAMA TEPPEI, HIRAISHI KATSUFUMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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