SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
To provide a substrate treatment method that can suppress damage to a substrate while enhancing the effect of ozone on the substrate.SOLUTION: A substrate WF having a first surface S1 and a second surface S2 opposite to the first surface S1 is held so that the second surface S2 faces downward. A pre...
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| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a substrate treatment method that can suppress damage to a substrate while enhancing the effect of ozone on the substrate.SOLUTION: A substrate WF having a first surface S1 and a second surface S2 opposite to the first surface S1 is held so that the second surface S2 faces downward. A pressurized treatment liquid LQ is arranged to face the second surface S2 of the substrate WF through a space. A space GP is made to contain ozone gas and pressurized. An interface between the second surface S2 of the substrate WF and the space GP is heated.SELECTED DRAWING: Figure 3
【課題】基板へのオゾンの作用を強めつつ、基板へのダメージを抑制することができる基板処理方法を提供する。【解決手段】第１の面Ｓ１と第１の面Ｓ１と反対の第２の面Ｓ２とを有する基板ＷＦが、第２の面Ｓ２が下方を向くように保持される。基板ＷＦの第２の面Ｓ２に空間を介して対向するように、加圧されている処理液ＬＱが配置される。空間ＧＰが、オゾンガスを含有し加圧された状態とされる。基板ＷＦの第２の面Ｓ２と空間ＧＰとの界面が加熱される。【選択図】図３ |
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