DEVICE AND METHOD FOR SUBSTRATE BEAM PROCESSING
To provide a device and a method for substrate beam processing.SOLUTION: A substrate processing system includes: a processing chamber; a substrate holder configured to hold the substrate and rotate the substrate around an axis perpendicular to a working surface of the substrate; an electron emitter...
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| creator | MIRKO VUKOVIC |
| description | To provide a device and a method for substrate beam processing.SOLUTION: A substrate processing system includes: a processing chamber; a substrate holder configured to hold the substrate and rotate the substrate around an axis perpendicular to a working surface of the substrate; an electron emitter which is adapted to emit a first electron beam guided to a first surface in a peripheral region of the substrate, and in which the first electron beam includes first beam energy and a first beam current sufficient to volatilize the material from the first surface in the peripheral region of the substrate; an air flow system configured to guide the flow of gas over the working surface of the substrate; and an exhaust system configured to recover the gas containing the volatilized material from the peripheral region.SELECTED DRAWING: Figure 4
【課題】基板のビーム処理のための機器および方法。【解決手段】基板処理システムは、処理チャンバと、基板を保持し、該基板の作動表面に垂直な軸の周りで基板を回転させるように構成された基板ホルダと、前記基板の周囲領域の第1の表面に誘導される第1の電子ビームを放射するように適合された電子エミッタであって、前記第1の電子ビームは、前記基板の前記周囲領域の第1の表面から材料を揮発させる上で充分な、第1のビームエネルギーおよび第1のビーム電流を有する、電子エミッタと、前記基板の前記作動表面にわたってガスの流れを誘導するように構成された空気流システムと、前記周囲領域から揮発した材料を含むガスを回収するように構成された排気システムとを有する。【選択図】図４ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021064786A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021064786A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021064786A3</originalsourceid><addsrcrecordid>eNrjZNB3cQ3zdHZVcPRzUfB1DfHwd1Fw8w9SCA51Cg4JcgxxVXBydfRVCAjyd3YNDvb0c-dhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoYGZibmFmaOxkQpAgA5dCZM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEVICE AND METHOD FOR SUBSTRATE BEAM PROCESSING</title><source>esp@cenet</source><creator>MIRKO VUKOVIC</creator><creatorcontrib>MIRKO VUKOVIC</creatorcontrib><description>To provide a device and a method for substrate beam processing.SOLUTION: A substrate processing system includes: a processing chamber; a substrate holder configured to hold the substrate and rotate the substrate around an axis perpendicular to a working surface of the substrate; an electron emitter which is adapted to emit a first electron beam guided to a first surface in a peripheral region of the substrate, and in which the first electron beam includes first beam energy and a first beam current sufficient to volatilize the material from the first surface in the peripheral region of the substrate; an air flow system configured to guide the flow of gas over the working surface of the substrate; and an exhaust system configured to recover the gas containing the volatilized material from the peripheral region.SELECTED DRAWING: Figure 4
【課題】基板のビーム処理のための機器および方法。【解決手段】基板処理システムは、処理チャンバと、基板を保持し、該基板の作動表面に垂直な軸の周りで基板を回転させるように構成された基板ホルダと、前記基板の周囲領域の第1の表面に誘導される第1の電子ビームを放射するように適合された電子エミッタであって、前記第1の電子ビームは、前記基板の前記周囲領域の第1の表面から材料を揮発させる上で充分な、第1のビームエネルギーおよび第1のビーム電流を有する、電子エミッタと、前記基板の前記作動表面にわたってガスの流れを誘導するように構成された空気流システムと、前記周囲領域から揮発した材料を含むガスを回収するように構成された排気システムとを有する。【選択図】図４</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210422&DB=EPODOC&CC=JP&NR=2021064786A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210422&DB=EPODOC&CC=JP&NR=2021064786A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIRKO VUKOVIC</creatorcontrib><title>DEVICE AND METHOD FOR SUBSTRATE BEAM PROCESSING</title><description>To provide a device and a method for substrate beam processing.SOLUTION: A substrate processing system includes: a processing chamber; a substrate holder configured to hold the substrate and rotate the substrate around an axis perpendicular to a working surface of the substrate; an electron emitter which is adapted to emit a first electron beam guided to a first surface in a peripheral region of the substrate, and in which the first electron beam includes first beam energy and a first beam current sufficient to volatilize the material from the first surface in the peripheral region of the substrate; an air flow system configured to guide the flow of gas over the working surface of the substrate; and an exhaust system configured to recover the gas containing the volatilized material from the peripheral region.SELECTED DRAWING: Figure 4
【課題】基板のビーム処理のための機器および方法。【解決手段】基板処理システムは、処理チャンバと、基板を保持し、該基板の作動表面に垂直な軸の周りで基板を回転させるように構成された基板ホルダと、前記基板の周囲領域の第1の表面に誘導される第1の電子ビームを放射するように適合された電子エミッタであって、前記第1の電子ビームは、前記基板の前記周囲領域の第1の表面から材料を揮発させる上で充分な、第1のビームエネルギーおよび第1のビーム電流を有する、電子エミッタと、前記基板の前記作動表面にわたってガスの流れを誘導するように構成された空気流システムと、前記周囲領域から揮発した材料を含むガスを回収するように構成された排気システムとを有する。【選択図】図４</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB3cQ3zdHZVcPRzUfB1DfHwd1Fw8w9SCA51Cg4JcgxxVXBydfRVCAjyd3YNDvb0c-dhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoYGZibmFmaOxkQpAgA5dCZM</recordid><startdate>20210422</startdate><enddate>20210422</enddate><creator>MIRKO VUKOVIC</creator><scope>EVB</scope></search><sort><creationdate>20210422</creationdate><title>DEVICE AND METHOD FOR SUBSTRATE BEAM PROCESSING</title><author>MIRKO VUKOVIC</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021064786A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MIRKO VUKOVIC</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIRKO VUKOVIC</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE AND METHOD FOR SUBSTRATE BEAM PROCESSING</title><date>2021-04-22</date><risdate>2021</risdate><abstract>To provide a device and a method for substrate beam processing.SOLUTION: A substrate processing system includes: a processing chamber; a substrate holder configured to hold the substrate and rotate the substrate around an axis perpendicular to a working surface of the substrate; an electron emitter which is adapted to emit a first electron beam guided to a first surface in a peripheral region of the substrate, and in which the first electron beam includes first beam energy and a first beam current sufficient to volatilize the material from the first surface in the peripheral region of the substrate; an air flow system configured to guide the flow of gas over the working surface of the substrate; and an exhaust system configured to recover the gas containing the volatilized material from the peripheral region.SELECTED DRAWING: Figure 4
【課題】基板のビーム処理のための機器および方法。【解決手段】基板処理システムは、処理チャンバと、基板を保持し、該基板の作動表面に垂直な軸の周りで基板を回転させるように構成された基板ホルダと、前記基板の周囲領域の第1の表面に誘導される第1の電子ビームを放射するように適合された電子エミッタであって、前記第1の電子ビームは、前記基板の前記周囲領域の第1の表面から材料を揮発させる上で充分な、第1のビームエネルギーおよび第1のビーム電流を有する、電子エミッタと、前記基板の前記作動表面にわたってガスの流れを誘導するように構成された空気流システムと、前記周囲領域から揮発した材料を含むガスを回収するように構成された排気システムとを有する。【選択図】図４</abstract><oa>free_for_read</oa></addata></record> |
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| title | DEVICE AND METHOD FOR SUBSTRATE BEAM PROCESSING |
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