BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD OF THE SAME
To provide a bulk acoustic wave resonator that can form a piezoelectric film on a surface of a lower layer electrode with a flat surface and improve its characteristics.SOLUTION: The bulk acoustic wave resonator includes a support substrate and a lower layer electrode film 2, a piezoelectric film 3,...
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creator | TAKEUCHI OSAMU MASUMOTO NAOMI KIKUCHI TOSHIKATSU KOUCHI HIROYUKI |
description | To provide a bulk acoustic wave resonator that can form a piezoelectric film on a surface of a lower layer electrode with a flat surface and improve its characteristics.SOLUTION: The bulk acoustic wave resonator includes a support substrate and a lower layer electrode film 2, a piezoelectric film 3, and an upper layer electrode film 4 stacked on the support substrate. The lower layer electrode film 2 has a flat surface. The piezoelectric film 3 is stacked on the lower electrode film 2. A recess 7 is provided on a surface of the periphery, and a part of the surface is cut out. The upper layer electrode film 4 covers the recess 7 and is stacked on top of the piezoelectric film 3.SELECTED DRAWING: Figure 5
【課題】平坦な表面を有する下層電極表面に圧電膜を形成し、特性向上を図ることができるバルク弾性波共振器を提供する。【解決手段】支持基板と、該支持基板上に積層した下層電極膜2、圧電膜3および上層電極膜4とを備えたバルク弾性波共振器において、下層電極膜2は表面が平坦であり、圧電膜3は下層電極膜2上に積層し、周縁部の表面に、該表面の一部を切り欠いた凹部7を備え、上層電極膜4は凹部7を被覆し、圧電膜3上に積層する。【選択図】図5 |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021057797A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021057797A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021057797A3</originalsourceid><addsrcrecordid>eNrjZHB0CvXxVnB09g8NDvF0Vgh3DHNVCHIN9vdzDPEPUnD0c1HwdfQLdXN0DgkN8vRzV_B1DfHwd1Hwd1MI8XBVCHb0deVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoYGpubmluaOxkQpAgAgHCtJ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD OF THE SAME</title><source>esp@cenet</source><creator>TAKEUCHI OSAMU ; MASUMOTO NAOMI ; KIKUCHI TOSHIKATSU ; KOUCHI HIROYUKI</creator><creatorcontrib>TAKEUCHI OSAMU ; MASUMOTO NAOMI ; KIKUCHI TOSHIKATSU ; KOUCHI HIROYUKI</creatorcontrib><description>To provide a bulk acoustic wave resonator that can form a piezoelectric film on a surface of a lower layer electrode with a flat surface and improve its characteristics.SOLUTION: The bulk acoustic wave resonator includes a support substrate and a lower layer electrode film 2, a piezoelectric film 3, and an upper layer electrode film 4 stacked on the support substrate. The lower layer electrode film 2 has a flat surface. The piezoelectric film 3 is stacked on the lower electrode film 2. A recess 7 is provided on a surface of the periphery, and a part of the surface is cut out. The upper layer electrode film 4 covers the recess 7 and is stacked on top of the piezoelectric film 3.SELECTED DRAWING: Figure 5
【課題】平坦な表面を有する下層電極表面に圧電膜を形成し、特性向上を図ることができるバルク弾性波共振器を提供する。【解決手段】支持基板と、該支持基板上に積層した下層電極膜2、圧電膜3および上層電極膜4とを備えたバルク弾性波共振器において、下層電極膜2は表面が平坦であり、圧電膜3は下層電極膜2上に積層し、周縁部の表面に、該表面の一部を切り欠いた凹部7を備え、上層電極膜4は凹部7を被覆し、圧電膜3上に積層する。【選択図】図5</description><language>eng ; jpn</language><subject>BASIC ELECTRONIC CIRCUITRY ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210408&DB=EPODOC&CC=JP&NR=2021057797A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210408&DB=EPODOC&CC=JP&NR=2021057797A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEUCHI OSAMU</creatorcontrib><creatorcontrib>MASUMOTO NAOMI</creatorcontrib><creatorcontrib>KIKUCHI TOSHIKATSU</creatorcontrib><creatorcontrib>KOUCHI HIROYUKI</creatorcontrib><title>BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD OF THE SAME</title><description>To provide a bulk acoustic wave resonator that can form a piezoelectric film on a surface of a lower layer electrode with a flat surface and improve its characteristics.SOLUTION: The bulk acoustic wave resonator includes a support substrate and a lower layer electrode film 2, a piezoelectric film 3, and an upper layer electrode film 4 stacked on the support substrate. The lower layer electrode film 2 has a flat surface. The piezoelectric film 3 is stacked on the lower electrode film 2. A recess 7 is provided on a surface of the periphery, and a part of the surface is cut out. The upper layer electrode film 4 covers the recess 7 and is stacked on top of the piezoelectric film 3.SELECTED DRAWING: Figure 5
【課題】平坦な表面を有する下層電極表面に圧電膜を形成し、特性向上を図ることができるバルク弾性波共振器を提供する。【解決手段】支持基板と、該支持基板上に積層した下層電極膜2、圧電膜3および上層電極膜4とを備えたバルク弾性波共振器において、下層電極膜2は表面が平坦であり、圧電膜3は下層電極膜2上に積層し、周縁部の表面に、該表面の一部を切り欠いた凹部7を備え、上層電極膜4は凹部7を被覆し、圧電膜3上に積層する。【選択図】図5</description><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB0CvXxVnB09g8NDvF0Vgh3DHNVCHIN9vdzDPEPUnD0c1HwdfQLdXN0DgkN8vRzV_B1DfHwd1Hwd1MI8XBVCHb0deVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoYGpubmluaOxkQpAgAgHCtJ</recordid><startdate>20210408</startdate><enddate>20210408</enddate><creator>TAKEUCHI OSAMU</creator><creator>MASUMOTO NAOMI</creator><creator>KIKUCHI TOSHIKATSU</creator><creator>KOUCHI HIROYUKI</creator><scope>EVB</scope></search><sort><creationdate>20210408</creationdate><title>BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD OF THE SAME</title><author>TAKEUCHI OSAMU ; MASUMOTO NAOMI ; KIKUCHI TOSHIKATSU ; KOUCHI HIROYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021057797A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEUCHI OSAMU</creatorcontrib><creatorcontrib>MASUMOTO NAOMI</creatorcontrib><creatorcontrib>KIKUCHI TOSHIKATSU</creatorcontrib><creatorcontrib>KOUCHI HIROYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEUCHI OSAMU</au><au>MASUMOTO NAOMI</au><au>KIKUCHI TOSHIKATSU</au><au>KOUCHI HIROYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD OF THE SAME</title><date>2021-04-08</date><risdate>2021</risdate><abstract>To provide a bulk acoustic wave resonator that can form a piezoelectric film on a surface of a lower layer electrode with a flat surface and improve its characteristics.SOLUTION: The bulk acoustic wave resonator includes a support substrate and a lower layer electrode film 2, a piezoelectric film 3, and an upper layer electrode film 4 stacked on the support substrate. The lower layer electrode film 2 has a flat surface. The piezoelectric film 3 is stacked on the lower electrode film 2. A recess 7 is provided on a surface of the periphery, and a part of the surface is cut out. The upper layer electrode film 4 covers the recess 7 and is stacked on top of the piezoelectric film 3.SELECTED DRAWING: Figure 5
【課題】平坦な表面を有する下層電極表面に圧電膜を形成し、特性向上を図ることができるバルク弾性波共振器を提供する。【解決手段】支持基板と、該支持基板上に積層した下層電極膜2、圧電膜3および上層電極膜4とを備えたバルク弾性波共振器において、下層電極膜2は表面が平坦であり、圧電膜3は下層電極膜2上に積層し、周縁部の表面に、該表面の一部を切り欠いた凹部7を備え、上層電極膜4は凹部7を被覆し、圧電膜3上に積層する。【選択図】図5</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS |
title | BULK ACOUSTIC WAVE RESONATOR AND MANUFACTURING METHOD OF THE SAME |
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