CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT
To provide a curable resin composition that has excellent developability without delamination and other failure in resolution and thin film deposition and gives a cured product having excellent HAST resistance and crack resistance, a dry film having a resin layer obtained from the composition, a cur...
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| creator | UEDA CHIHO OKADA KAZUYA KUDOU TOMOYA SHIMADA SAWAKO |
| description | To provide a curable resin composition that has excellent developability without delamination and other failure in resolution and thin film deposition and gives a cured product having excellent HAST resistance and crack resistance, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of the dry film, and an electronic component having the cured product.SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, and (C) an inorganic filler, the (C) inorganic filler having a particle size distribution that satisfies the following conditions (1)-(3): (1) D50 particle size value=1.0 μm or less; (2) (D90 particle size value)/(D10 particle size value)=5.0 or less; (3) ((D90 particle size value)-(D50 particle size value))/((D50 particle size value)-(D10 particle size value))=0.5-5.0.SELECTED DRAWING: Figure 1
【課題】解像性および薄膜形成においてデラミなどの問題なく現像性に優れ、かつＨＡＳＴ耐性やクラック耐性に優れた硬化物が得られる硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、該組成物または該ドライフィルムの樹脂層の硬化物、および、該硬化物を有する電子部品を提供する。【解決手段】（Ａ）カルボキシル基含有樹脂、（Ｂ）光重合開始剤、および、（Ｃ）無機フィラーを含有する硬化性樹脂組成物であって、前記（Ｃ）無機フィラーの粒度分布が下記条件（１）〜（３）を満たすことを特徴とする硬化性樹脂組成物等である。（１）Ｄ５０粒径値＝１．０μｍ以下（２）（Ｄ９０粒径値）／（Ｄ１０粒径値）＝５．０以下（３）（（Ｄ９０粒径値）−（Ｄ５０粒径値））／（（Ｄ５０粒径値）−（Ｄ１０粒径値））＝０．５〜５．０【選択図】図１ |
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【課題】解像性および薄膜形成においてデラミなどの問題なく現像性に優れ、かつＨＡＳＴ耐性やクラック耐性に優れた硬化物が得られる硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、該組成物または該ドライフィルムの樹脂層の硬化物、および、該硬化物を有する電子部品を提供する。【解決手段】（Ａ）カルボキシル基含有樹脂、（Ｂ）光重合開始剤、および、（Ｃ）無機フィラーを含有する硬化性樹脂組成物であって、前記（Ｃ）無機フィラーの粒度分布が下記条件（１）〜（３）を満たすことを特徴とする硬化性樹脂組成物等である。（１）Ｄ５０粒径値＝１．０μｍ以下（２）（Ｄ９０粒径値）／（Ｄ１０粒径値）＝５．０以下（３）（（Ｄ９０粒径値）−（Ｄ５０粒径値））／（（Ｄ５０粒径値）−（Ｄ１０粒径値））＝０．５〜５．０【選択図】図１</description><language>eng ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CINEMATOGRAPHY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=JP&NR=2021051263A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210401&DB=EPODOC&CC=JP&NR=2021051263A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UEDA CHIHO</creatorcontrib><creatorcontrib>OKADA KAZUYA</creatorcontrib><creatorcontrib>KUDOU TOMOYA</creatorcontrib><creatorcontrib>SHIMADA SAWAKO</creatorcontrib><title>CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT</title><description>To provide a curable resin composition that has excellent developability without delamination and other failure in resolution and thin film deposition and gives a cured product having excellent HAST resistance and crack resistance, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of the dry film, and an electronic component having the cured product.SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, and (C) an inorganic filler, the (C) inorganic filler having a particle size distribution that satisfies the following conditions (1)-(3): (1) D50 particle size value=1.0 μm or less; (2) (D90 particle size value)/(D10 particle size value)=5.0 or less; (3) ((D90 particle size value)-(D50 particle size value))/((D50 particle size value)-(D10 particle size value))=0.5-5.0.SELECTED DRAWING: Figure 1
【課題】解像性および薄膜形成においてデラミなどの問題なく現像性に優れ、かつＨＡＳＴ耐性やクラック耐性に優れた硬化物が得られる硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、該組成物または該ドライフィルムの樹脂層の硬化物、および、該硬化物を有する電子部品を提供する。【解決手段】（Ａ）カルボキシル基含有樹脂、（Ｂ）光重合開始剤、および、（Ｃ）無機フィラーを含有する硬化性樹脂組成物であって、前記（Ｃ）無機フィラーの粒度分布が下記条件（１）〜（３）を満たすことを特徴とする硬化性樹脂組成物等である。（１）Ｄ５０粒径値＝１．０μｍ以下（２）（Ｄ９０粒径値）／（Ｄ１０粒径値）＝５．０以下（３）（（Ｄ９０粒径値）−（Ｄ５０粒径値））／（（Ｄ５０粒径値）−（Ｄ１０粒径値））＝０．５〜５．０【選択図】図１</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBxDg1ydPJxVQhyDfb0U3D29w3wD_YM8fT301FwCYpUcPP08dVRACpydVEICPJ3CXUO0VFw9HNRcPVxdQ4J8vfzdIZo8nP1C-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoYGpoZGZsaOxkQpAgD6oS4j</recordid><startdate>20210401</startdate><enddate>20210401</enddate><creator>UEDA CHIHO</creator><creator>OKADA KAZUYA</creator><creator>KUDOU TOMOYA</creator><creator>SHIMADA SAWAKO</creator><scope>EVB</scope></search><sort><creationdate>20210401</creationdate><title>CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT</title><author>UEDA CHIHO ; OKADA KAZUYA ; KUDOU TOMOYA ; SHIMADA SAWAKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021051263A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>UEDA CHIHO</creatorcontrib><creatorcontrib>OKADA KAZUYA</creatorcontrib><creatorcontrib>KUDOU TOMOYA</creatorcontrib><creatorcontrib>SHIMADA SAWAKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UEDA CHIHO</au><au>OKADA KAZUYA</au><au>KUDOU TOMOYA</au><au>SHIMADA SAWAKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT</title><date>2021-04-01</date><risdate>2021</risdate><abstract>To provide a curable resin composition that has excellent developability without delamination and other failure in resolution and thin film deposition and gives a cured product having excellent HAST resistance and crack resistance, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of the dry film, and an electronic component having the cured product.SOLUTION: A curable resin composition contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, and (C) an inorganic filler, the (C) inorganic filler having a particle size distribution that satisfies the following conditions (1)-(3): (1) D50 particle size value=1.0 μm or less; (2) (D90 particle size value)/(D10 particle size value)=5.0 or less; (3) ((D90 particle size value)-(D50 particle size value))/((D50 particle size value)-(D10 particle size value))=0.5-5.0.SELECTED DRAWING: Figure 1
【課題】解像性および薄膜形成においてデラミなどの問題なく現像性に優れ、かつＨＡＳＴ耐性やクラック耐性に優れた硬化物が得られる硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、該組成物または該ドライフィルムの樹脂層の硬化物、および、該硬化物を有する電子部品を提供する。【解決手段】（Ａ）カルボキシル基含有樹脂、（Ｂ）光重合開始剤、および、（Ｃ）無機フィラーを含有する硬化性樹脂組成物であって、前記（Ｃ）無機フィラーの粒度分布が下記条件（１）〜（３）を満たすことを特徴とする硬化性樹脂組成物等である。（１）Ｄ５０粒径値＝１．０μｍ以下（２）（Ｄ９０粒径値）／（Ｄ１０粒径値）＝５．０以下（３）（（Ｄ９０粒径値）−（Ｄ５０粒径値））／（（Ｄ５０粒径値）−（Ｄ１０粒径値））＝０．５〜５．０【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS TRANSPORTING |
| title | CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT |
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