SEALING MATERIAL SHEET FOR ELECTRONIC DEVICE
To provide a sealing material sheet for an electronic device, which is a polyethylene system sealing material sheet, capable of resisting a long period use under an environment of a high temperature and high humidity, and which is suitable for a sealing material sheet for a solar battery module, or...
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creator | NAGINO SHINSUKE YONEDA SHINYA AKAZAWA NORITOSHI SAEKI KOSUKE |
description | To provide a sealing material sheet for an electronic device, which is a polyethylene system sealing material sheet, capable of resisting a long period use under an environment of a high temperature and high humidity, and which is suitable for a sealing material sheet for a solar battery module, or the like, capable of maintaining a power generation efficiency of the solar battery module by suppressing the generation of an acidic gas.SOLUTION: A sealing material sheet contains a hindered-amine light resistance stabilizer and a cross-linking agent by using a polyethylene-based resin as a base resin. All chemical structures of the hindered-amine light resistance stabilizer is a chemical structure of any one of following (i) to (iii): (i) a chemical structure not containing ester; (ii) a chemical structure containing ester, having a R1-COO-R2 structure, in which a molecular mass of R1 is 100 or more and R2 does not contain ester; and (iii) a chemical structure containing ester, having a R3-OCO-R4-COO-R5 structure, in which the molecular mass of R4 is 100 or more, and R3 and R5 do not contain ester.SELECTED DRAWING: Figure 1
【課題】高温多湿の環境下で長期使用にも耐えうるポリエチレン系の封止材シートであって、酸性ガスの発生を抑制して太陽電池モジュールの発電効率を維持できる太陽電池モジュール用封止材シート等に好適な電子デバイス用封止材シートを提供する。【解決手段】ポリエチレン系樹脂をベース樹脂とし、ヒンダードアミン系耐光安定剤と、架橋剤と、を含有し、ヒンダードアミン系耐光安定剤の化学構造が、いずれも以下の(i)から(iii)のいずれかの化学構造である、封止材シート。(i)エステルを含まない化学構造。(ii)エステルを含み、エステルが、R1−COO−R2構造であって、R1の分子量が100以上であり、R2がエステルを含まない化学構造。(iii)エステルを含み、エステルが、R3−OCO−R4−COO−R5構造であって、R4の分子量が100以上であり、R3及びR5がエステルを含まない化学構造。【選択図】図1 |
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【課題】高温多湿の環境下で長期使用にも耐えうるポリエチレン系の封止材シートであって、酸性ガスの発生を抑制して太陽電池モジュールの発電効率を維持できる太陽電池モジュール用封止材シート等に好適な電子デバイス用封止材シートを提供する。【解決手段】ポリエチレン系樹脂をベース樹脂とし、ヒンダードアミン系耐光安定剤と、架橋剤と、を含有し、ヒンダードアミン系耐光安定剤の化学構造が、いずれも以下の(i)から(iii)のいずれかの化学構造である、封止材シート。(i)エステルを含まない化学構造。(ii)エステルを含み、エステルが、R1−COO−R2構造であって、R1の分子量が100以上であり、R2がエステルを含まない化学構造。(iii)エステルを含み、エステルが、R3−OCO−R4−COO−R5構造であって、R4の分子量が100以上であり、R3及びR5がエステルを含まない化学構造。【選択図】図1</description><language>eng ; jpn</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210325&DB=EPODOC&CC=JP&NR=2021048398A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210325&DB=EPODOC&CC=JP&NR=2021048398A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGINO SHINSUKE</creatorcontrib><creatorcontrib>YONEDA SHINYA</creatorcontrib><creatorcontrib>AKAZAWA NORITOSHI</creatorcontrib><creatorcontrib>SAEKI KOSUKE</creatorcontrib><title>SEALING MATERIAL SHEET FOR ELECTRONIC DEVICE</title><description>To provide a sealing material sheet for an electronic device, which is a polyethylene system sealing material sheet, capable of resisting a long period use under an environment of a high temperature and high humidity, and which is suitable for a sealing material sheet for a solar battery module, or the like, capable of maintaining a power generation efficiency of the solar battery module by suppressing the generation of an acidic gas.SOLUTION: A sealing material sheet contains a hindered-amine light resistance stabilizer and a cross-linking agent by using a polyethylene-based resin as a base resin. All chemical structures of the hindered-amine light resistance stabilizer is a chemical structure of any one of following (i) to (iii): (i) a chemical structure not containing ester; (ii) a chemical structure containing ester, having a R1-COO-R2 structure, in which a molecular mass of R1 is 100 or more and R2 does not contain ester; and (iii) a chemical structure containing ester, having a R3-OCO-R4-COO-R5 structure, in which the molecular mass of R4 is 100 or more, and R3 and R5 do not contain ester.SELECTED DRAWING: Figure 1
【課題】高温多湿の環境下で長期使用にも耐えうるポリエチレン系の封止材シートであって、酸性ガスの発生を抑制して太陽電池モジュールの発電効率を維持できる太陽電池モジュール用封止材シート等に好適な電子デバイス用封止材シートを提供する。【解決手段】ポリエチレン系樹脂をベース樹脂とし、ヒンダードアミン系耐光安定剤と、架橋剤と、を含有し、ヒンダードアミン系耐光安定剤の化学構造が、いずれも以下の(i)から(iii)のいずれかの化学構造である、封止材シート。(i)エステルを含まない化学構造。(ii)エステルを含み、エステルが、R1−COO−R2構造であって、R1の分子量が100以上であり、R2がエステルを含まない化学構造。(iii)エステルを含み、エステルが、R3−OCO−R4−COO−R5構造であって、R4の分子量が100以上であり、R3及びR5がエステルを含まない化学構造。【選択図】図1</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJdnX08fRzV_B1DHEN8nT0UQj2cHUNUXDzD1Jw9XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRoYGJhbGlhaOxkQpAgDOeyV7</recordid><startdate>20210325</startdate><enddate>20210325</enddate><creator>NAGINO SHINSUKE</creator><creator>YONEDA SHINYA</creator><creator>AKAZAWA NORITOSHI</creator><creator>SAEKI KOSUKE</creator><scope>EVB</scope></search><sort><creationdate>20210325</creationdate><title>SEALING MATERIAL SHEET FOR ELECTRONIC DEVICE</title><author>NAGINO SHINSUKE ; YONEDA SHINYA ; AKAZAWA NORITOSHI ; SAEKI KOSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021048398A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGINO SHINSUKE</creatorcontrib><creatorcontrib>YONEDA SHINYA</creatorcontrib><creatorcontrib>AKAZAWA NORITOSHI</creatorcontrib><creatorcontrib>SAEKI KOSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGINO SHINSUKE</au><au>YONEDA SHINYA</au><au>AKAZAWA NORITOSHI</au><au>SAEKI KOSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEALING MATERIAL SHEET FOR ELECTRONIC DEVICE</title><date>2021-03-25</date><risdate>2021</risdate><abstract>To provide a sealing material sheet for an electronic device, which is a polyethylene system sealing material sheet, capable of resisting a long period use under an environment of a high temperature and high humidity, and which is suitable for a sealing material sheet for a solar battery module, or the like, capable of maintaining a power generation efficiency of the solar battery module by suppressing the generation of an acidic gas.SOLUTION: A sealing material sheet contains a hindered-amine light resistance stabilizer and a cross-linking agent by using a polyethylene-based resin as a base resin. All chemical structures of the hindered-amine light resistance stabilizer is a chemical structure of any one of following (i) to (iii): (i) a chemical structure not containing ester; (ii) a chemical structure containing ester, having a R1-COO-R2 structure, in which a molecular mass of R1 is 100 or more and R2 does not contain ester; and (iii) a chemical structure containing ester, having a R3-OCO-R4-COO-R5 structure, in which the molecular mass of R4 is 100 or more, and R3 and R5 do not contain ester.SELECTED DRAWING: Figure 1
【課題】高温多湿の環境下で長期使用にも耐えうるポリエチレン系の封止材シートであって、酸性ガスの発生を抑制して太陽電池モジュールの発電効率を維持できる太陽電池モジュール用封止材シート等に好適な電子デバイス用封止材シートを提供する。【解決手段】ポリエチレン系樹脂をベース樹脂とし、ヒンダードアミン系耐光安定剤と、架橋剤と、を含有し、ヒンダードアミン系耐光安定剤の化学構造が、いずれも以下の(i)から(iii)のいずれかの化学構造である、封止材シート。(i)エステルを含まない化学構造。(ii)エステルを含み、エステルが、R1−COO−R2構造であって、R1の分子量が100以上であり、R2がエステルを含まない化学構造。(iii)エステルを含み、エステルが、R3−OCO−R4−COO−R5構造であって、R4の分子量が100以上であり、R3及びR5がエステルを含まない化学構造。【選択図】図1</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | SEALING MATERIAL SHEET FOR ELECTRONIC DEVICE |
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