BALL GRID ARRAY (BGA) PACKAGE WITH DIFFERENT BALL

To provide an electronics package.SOLUTION: An electronics package according to an embodiment includes a first board, a second board, and an array of interconnects that electrically couple the first board to the second board. The array of the interconnect according to the embodiment includes a first...

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Bibliographische Detailangaben
Hauptverfasser:	ALEXANDER HUETTIS, JOHN HARPER, NACHIKET R RARAVIKAR, PRAMOD MALATKAR, ZHANG JIEPING, CHRISTOPHER COMBS, LU JIONGXIN, STEVEN A KLEIN, MOHIT SOOD, LU XIAO, CARL DEPPISCH
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide an electronics package.SOLUTION: An electronics package according to an embodiment includes a first board, a second board, and an array of interconnects that electrically couple the first board to the second board. The array of the interconnect according to the embodiment includes a first interconnect having a first volume and a first material composition, and a second interconnect having a second volume and a second material composition, and the first volume is different from the second volume and/or the first material composition is different from the second material composition.SELECTED DRAWING: Figure 2C 【課題】ここに開示される実施形態は、エレクトロニクスパッケージを含む。【解決手段】一実施形態において、エレクトロニクスパッケージは、第１の基板と、第２の基板と、第１の基板を第２の基板に電気的に結合するインターコネクトのアレイとを有する。一実施形態において、インターコネクトのアレイは、第１の体積及び第１の材料組成を持つ第１のインターコネクトと、第２の体積及び第２の材料組成を持つ第２のインターコネクトとを有し、第１の体積は第２の体積とは異なり、且つ／或いは第１の材料組成は第２の材料組成とは異なる。【選択図】図２Ｃ