IMPRINT METHOD, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND IMPRINT DEVICE
To improve a defect of effusion of resist.SOLUTION: An imprint method according an embodiment includes the steps of disposing a first chemical solution that is photocurable in a first region on a substrate, disposing a second chemical solution that is non-photocurable in an outer periphery of the fi...
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Sprache: | eng ; jpn |
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Zusammenfassung: | To improve a defect of effusion of resist.SOLUTION: An imprint method according an embodiment includes the steps of disposing a first chemical solution that is photocurable in a first region on a substrate, disposing a second chemical solution that is non-photocurable in an outer periphery of the first region, curing the first chemical solution by delivering light while a surface of a template including a pattern is pressed to the first chemical solution, thereby forming a resist pattern to which the pattern is transferred, separating the resist pattern and the template, and selectively removing at least the second chemical solution.SELECTED DRAWING: Figure 2
【課題】レジストの浸み出し欠陥を改善すること。【解決手段】実施形態のインプリント方法は、基板上の第1の領域に光硬化性の第1の薬液を配置するステップと、第1の領域の外周部に非光硬化性の第2の薬液を配置するステップと、テンプレートのパターンを有する面を第1の薬液に押し当てた状態で光を照射して第1の薬液を硬化させ、パターンが転写されたレジストパターンを形成するステップと、レジストパターンとテンプレートとを離間させるステップと、少なくとも第2の薬液を選択的に除去するステップと、を含む。【選択図】図2 |
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