IMPRINT METHOD, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND IMPRINT DEVICE

To improve a defect of effusion of resist.SOLUTION: An imprint method according an embodiment includes the steps of disposing a first chemical solution that is photocurable in a first region on a substrate, disposing a second chemical solution that is non-photocurable in an outer periphery of the fi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HIGUCHI TSUYOSHI, KATO HIROKAZU, OKABE KASUMI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To improve a defect of effusion of resist.SOLUTION: An imprint method according an embodiment includes the steps of disposing a first chemical solution that is photocurable in a first region on a substrate, disposing a second chemical solution that is non-photocurable in an outer periphery of the first region, curing the first chemical solution by delivering light while a surface of a template including a pattern is pressed to the first chemical solution, thereby forming a resist pattern to which the pattern is transferred, separating the resist pattern and the template, and selectively removing at least the second chemical solution.SELECTED DRAWING: Figure 2 【課題】レジストの浸み出し欠陥を改善すること。【解決手段】実施形態のインプリント方法は、基板上の第1の領域に光硬化性の第1の薬液を配置するステップと、第1の領域の外周部に非光硬化性の第2の薬液を配置するステップと、テンプレートのパターンを有する面を第1の薬液に押し当てた状態で光を照射して第1の薬液を硬化させ、パターンが転写されたレジストパターンを形成するステップと、レジストパターンとテンプレートとを離間させるステップと、少なくとも第2の薬液を選択的に除去するステップと、を含む。【選択図】図2