PATTERN INSPECTION DEVICE AND PATTERN INSPECTION METHOD
To provide an inspection device that can reduce pseudo defects arising from an originally not-existing streaky or band-like pseudo pattern outside a graphic pattern in an electron beam inspection.SOLUTION: An inspection device 100 comprises: an image acquisition mechanism 150 that scans on a substra...
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creator | SHIRATO MASATAKA HIRANO RYOICHI HASHIMOTO HIDEAKI INOUE HIROSHI OGAWA TSUTOMU |
description | To provide an inspection device that can reduce pseudo defects arising from an originally not-existing streaky or band-like pseudo pattern outside a graphic pattern in an electron beam inspection.SOLUTION: An inspection device 100 comprises: an image acquisition mechanism 150 that scans on a substrate having a graphic pattern formed by an electron beam, and acquires a secondary electronic image to be discharged in accordance with irradiation of the electron beam by the scan; a reference image preparation circuit 112 that prepares a reference image of an area corresponding to an image to be inspected, using design pattern data serving as a basis of the graphic pattern; a spatial frequency distribution preparation circuit 173 that prepares a two-dimensional spatial frequency distribution of the reference image; a filter circuit 174 that performs filter processing of eliminating a spatial frequency component other than a low spatial frequency component; a regeneration circuit 176 that regenerates an image in the area of the reference image having the low spatial frequency component left; and a comparison circuit 108 that compares the image to be inspected with the reference image on the basis of the regenerated image.SELECTED DRAWING: Figure 1
【課題】電子ビーム検査において、図形パターンの外側に、本来は存在しない筋状、或いは帯状の疑似パターンに起因する疑似欠陥を低減することが可能な検査装置を提供する。【解決手段】検査装置100は、図形パターンが形成された基板上を電子ビームでスキャンして、スキャンによる電子ビームの照射に応じて放出される2次電子画像を取得する画像取得機構150と、図形パターンの基になる設計パターンデータを用いて、被検査画像に対応する領域の参照画像を作成する参照画像作成回路112と、参照画像の2次元の空間周波数分布を作成する空間周波数分布作成回路173と、低空間周波数成分以外の空間周波数成分を除去するフィルタ処理を行うフィルタ回路174と、低空間周波数成分が残された参照画像の領域の画像を再生する再生回路176と、再生された画像に基づいて、被検査画像と、参照画像とを比較する比較回路108と、を備えたことを特徴とする。【選択図】図1 |
format | Patent |
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【課題】電子ビーム検査において、図形パターンの外側に、本来は存在しない筋状、或いは帯状の疑似パターンに起因する疑似欠陥を低減することが可能な検査装置を提供する。【解決手段】検査装置100は、図形パターンが形成された基板上を電子ビームでスキャンして、スキャンによる電子ビームの照射に応じて放出される2次電子画像を取得する画像取得機構150と、図形パターンの基になる設計パターンデータを用いて、被検査画像に対応する領域の参照画像を作成する参照画像作成回路112と、参照画像の2次元の空間周波数分布を作成する空間周波数分布作成回路173と、低空間周波数成分以外の空間周波数成分を除去するフィルタ処理を行うフィルタ回路174と、低空間周波数成分が残された参照画像の領域の画像を再生する再生回路176と、再生された画像に基づいて、被検査画像と、参照画像とを比較する比較回路108と、を備えたことを特徴とする。【選択図】図1</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210318&DB=EPODOC&CC=JP&NR=2021043127A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210318&DB=EPODOC&CC=JP&NR=2021043127A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIRATO MASATAKA</creatorcontrib><creatorcontrib>HIRANO RYOICHI</creatorcontrib><creatorcontrib>HASHIMOTO HIDEAKI</creatorcontrib><creatorcontrib>INOUE HIROSHI</creatorcontrib><creatorcontrib>OGAWA TSUTOMU</creatorcontrib><title>PATTERN INSPECTION DEVICE AND PATTERN INSPECTION METHOD</title><description>To provide an inspection device that can reduce pseudo defects arising from an originally not-existing streaky or band-like pseudo pattern outside a graphic pattern in an electron beam inspection.SOLUTION: An inspection device 100 comprises: an image acquisition mechanism 150 that scans on a substrate having a graphic pattern formed by an electron beam, and acquires a secondary electronic image to be discharged in accordance with irradiation of the electron beam by the scan; a reference image preparation circuit 112 that prepares a reference image of an area corresponding to an image to be inspected, using design pattern data serving as a basis of the graphic pattern; a spatial frequency distribution preparation circuit 173 that prepares a two-dimensional spatial frequency distribution of the reference image; a filter circuit 174 that performs filter processing of eliminating a spatial frequency component other than a low spatial frequency component; a regeneration circuit 176 that regenerates an image in the area of the reference image having the low spatial frequency component left; and a comparison circuit 108 that compares the image to be inspected with the reference image on the basis of the regenerated image.SELECTED DRAWING: Figure 1
【課題】電子ビーム検査において、図形パターンの外側に、本来は存在しない筋状、或いは帯状の疑似パターンに起因する疑似欠陥を低減することが可能な検査装置を提供する。【解決手段】検査装置100は、図形パターンが形成された基板上を電子ビームでスキャンして、スキャンによる電子ビームの照射に応じて放出される2次電子画像を取得する画像取得機構150と、図形パターンの基になる設計パターンデータを用いて、被検査画像に対応する領域の参照画像を作成する参照画像作成回路112と、参照画像の2次元の空間周波数分布を作成する空間周波数分布作成回路173と、低空間周波数成分以外の空間周波数成分を除去するフィルタ処理を行うフィルタ回路174と、低空間周波数成分が残された参照画像の領域の画像を再生する再生回路176と、再生された画像に基づいて、被検査画像と、参照画像とを比較する比較回路108と、を備えたことを特徴とする。【選択図】図1</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAPcAwJcQ3yU_D0Cw5wdQ7x9PdTcHEN83R2VXD0c1HAIuvrGuLh78LDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMjAwNTIwNjcwdjYlSBACchCi2</recordid><startdate>20210318</startdate><enddate>20210318</enddate><creator>SHIRATO MASATAKA</creator><creator>HIRANO RYOICHI</creator><creator>HASHIMOTO HIDEAKI</creator><creator>INOUE HIROSHI</creator><creator>OGAWA TSUTOMU</creator><scope>EVB</scope></search><sort><creationdate>20210318</creationdate><title>PATTERN INSPECTION DEVICE AND PATTERN INSPECTION METHOD</title><author>SHIRATO MASATAKA ; HIRANO RYOICHI ; HASHIMOTO HIDEAKI ; INOUE HIROSHI ; OGAWA TSUTOMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021043127A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIRATO MASATAKA</creatorcontrib><creatorcontrib>HIRANO RYOICHI</creatorcontrib><creatorcontrib>HASHIMOTO HIDEAKI</creatorcontrib><creatorcontrib>INOUE HIROSHI</creatorcontrib><creatorcontrib>OGAWA TSUTOMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIRATO MASATAKA</au><au>HIRANO RYOICHI</au><au>HASHIMOTO HIDEAKI</au><au>INOUE HIROSHI</au><au>OGAWA TSUTOMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PATTERN INSPECTION DEVICE AND PATTERN INSPECTION METHOD</title><date>2021-03-18</date><risdate>2021</risdate><abstract>To provide an inspection device that can reduce pseudo defects arising from an originally not-existing streaky or band-like pseudo pattern outside a graphic pattern in an electron beam inspection.SOLUTION: An inspection device 100 comprises: an image acquisition mechanism 150 that scans on a substrate having a graphic pattern formed by an electron beam, and acquires a secondary electronic image to be discharged in accordance with irradiation of the electron beam by the scan; a reference image preparation circuit 112 that prepares a reference image of an area corresponding to an image to be inspected, using design pattern data serving as a basis of the graphic pattern; a spatial frequency distribution preparation circuit 173 that prepares a two-dimensional spatial frequency distribution of the reference image; a filter circuit 174 that performs filter processing of eliminating a spatial frequency component other than a low spatial frequency component; a regeneration circuit 176 that regenerates an image in the area of the reference image having the low spatial frequency component left; and a comparison circuit 108 that compares the image to be inspected with the reference image on the basis of the regenerated image.SELECTED DRAWING: Figure 1
【課題】電子ビーム検査において、図形パターンの外側に、本来は存在しない筋状、或いは帯状の疑似パターンに起因する疑似欠陥を低減することが可能な検査装置を提供する。【解決手段】検査装置100は、図形パターンが形成された基板上を電子ビームでスキャンして、スキャンによる電子ビームの照射に応じて放出される2次電子画像を取得する画像取得機構150と、図形パターンの基になる設計パターンデータを用いて、被検査画像に対応する領域の参照画像を作成する参照画像作成回路112と、参照画像の2次元の空間周波数分布を作成する空間周波数分布作成回路173と、低空間周波数成分以外の空間周波数成分を除去するフィルタ処理を行うフィルタ回路174と、低空間周波数成分が残された参照画像の領域の画像を再生する再生回路176と、再生された画像に基づいて、被検査画像と、参照画像とを比較する比較回路108と、を備えたことを特徴とする。【選択図】図1</abstract><oa>free_for_read</oa></addata></record> |
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title | PATTERN INSPECTION DEVICE AND PATTERN INSPECTION METHOD |
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