CONTROL DEVICE, AND LASER PROCESSING SYSTEM AND LAER PROCESSING METHOD PROVIDED WITH THE SAME
To provide a control device which can appropriately correct a laser processing device when positional deviation in a height direction and a plane direction occurs irrespective of the shape of a workpiece, and a laser processing system and a laser processing method provided with the same.SOLUTION: A...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ISHIZU YUICHI FUKUI HIROSHI SHIICHI KOJI OGAMI YOJI |
| description | To provide a control device which can appropriately correct a laser processing device when positional deviation in a height direction and a plane direction occurs irrespective of the shape of a workpiece, and a laser processing system and a laser processing method provided with the same.SOLUTION: A control device 10 includes a processing control part 11, an image processing part 12, and a storage part 13. The storage part 13 stores a registration pattern RP including a partial shape of a workpiece 50, object reference positions (P0 and Q0) corresponding to the RP which are set in the state where the workpiece 50 is at the reference position and the reference height, and reference coordinates (X0 and Y0) at a position where the workpiece 50 irradiated with guide light is present. The processing control part 11 corrects a processing position on a processing surface 50c of the workpiece 50 by laser light by referring to the reference coordinates (X0 and Y0) stored in the storage part 13 and the object reference positions (P0 and Q0) corresponding to the registration pattern RP.SELECTED DRAWING: Figure 3
【課題】ワークの形状に関わらず、高さ方向および平面方向における位置ずれが生じた場合に、レーザ加工位置を適切に補正することが可能な制御装置およびこれを備えたレーザ加工システム、レーザ加工方法を提供する。【解決手段】制御装置１０は、加工制御部１１と、画像処理部１２と、記憶部１３と、を備えている。記憶部１３は、ワーク５０が基準位置および基準高さにある状態で設定される、ワーク５０の一部の形状を含む登録パターンＲＰおよびこれに対応する対象基準位置（Ｐ０，Ｑ０）と、ガイド光が照射されたワーク５０が存在する位置の基準座標（Ｘ０，Ｙ０）とを保存する。加工制御部１１は、記憶部１３に保存された基準座標（Ｘ０，Ｙ０）と、登録パターンＲＰに対応する対象基準位置（Ｐ０，Ｑ０）とを参照して、レーザ光によるワーク５０の加工面５０ｃ上における加工位置を補正する。【選択図】図３ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2021013940A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2021013940A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2021013940A3</originalsourceid><addsrcrecordid>eNrjZIh19vcLCfL3UXBxDfN0dtVRcPRzUfBxDHYNUggI8nd2DQ729HNXCI4MDnH1hcqhSvm6hnj4u4BEwjxdXF0Uwj1DPBRCPFwVgh19XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBkaGBobGliYGjMVGKAC7oMsI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONTROL DEVICE, AND LASER PROCESSING SYSTEM AND LAER PROCESSING METHOD PROVIDED WITH THE SAME</title><source>esp@cenet</source><creator>ISHIZU YUICHI ; FUKUI HIROSHI ; SHIICHI KOJI ; OGAMI YOJI</creator><creatorcontrib>ISHIZU YUICHI ; FUKUI HIROSHI ; SHIICHI KOJI ; OGAMI YOJI</creatorcontrib><description>To provide a control device which can appropriately correct a laser processing device when positional deviation in a height direction and a plane direction occurs irrespective of the shape of a workpiece, and a laser processing system and a laser processing method provided with the same.SOLUTION: A control device 10 includes a processing control part 11, an image processing part 12, and a storage part 13. The storage part 13 stores a registration pattern RP including a partial shape of a workpiece 50, object reference positions (P0 and Q0) corresponding to the RP which are set in the state where the workpiece 50 is at the reference position and the reference height, and reference coordinates (X0 and Y0) at a position where the workpiece 50 irradiated with guide light is present. The processing control part 11 corrects a processing position on a processing surface 50c of the workpiece 50 by laser light by referring to the reference coordinates (X0 and Y0) stored in the storage part 13 and the object reference positions (P0 and Q0) corresponding to the registration pattern RP.SELECTED DRAWING: Figure 3
【課題】ワークの形状に関わらず、高さ方向および平面方向における位置ずれが生じた場合に、レーザ加工位置を適切に補正することが可能な制御装置およびこれを備えたレーザ加工システム、レーザ加工方法を提供する。【解決手段】制御装置１０は、加工制御部１１と、画像処理部１２と、記憶部１３と、を備えている。記憶部１３は、ワーク５０が基準位置および基準高さにある状態で設定される、ワーク５０の一部の形状を含む登録パターンＲＰおよびこれに対応する対象基準位置（Ｐ０，Ｑ０）と、ガイド光が照射されたワーク５０が存在する位置の基準座標（Ｘ０，Ｙ０）とを保存する。加工制御部１１は、記憶部１３に保存された基準座標（Ｘ０，Ｙ０）と、登録パターンＲＰに対応する対象基準位置（Ｐ０，Ｑ０）とを参照して、レーザ光によるワーク５０の加工面５０ｃ上における加工位置を補正する。【選択図】図３</description><language>eng ; jpn</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210212&DB=EPODOC&CC=JP&NR=2021013940A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210212&DB=EPODOC&CC=JP&NR=2021013940A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISHIZU YUICHI</creatorcontrib><creatorcontrib>FUKUI HIROSHI</creatorcontrib><creatorcontrib>SHIICHI KOJI</creatorcontrib><creatorcontrib>OGAMI YOJI</creatorcontrib><title>CONTROL DEVICE, AND LASER PROCESSING SYSTEM AND LAER PROCESSING METHOD PROVIDED WITH THE SAME</title><description>To provide a control device which can appropriately correct a laser processing device when positional deviation in a height direction and a plane direction occurs irrespective of the shape of a workpiece, and a laser processing system and a laser processing method provided with the same.SOLUTION: A control device 10 includes a processing control part 11, an image processing part 12, and a storage part 13. The storage part 13 stores a registration pattern RP including a partial shape of a workpiece 50, object reference positions (P0 and Q0) corresponding to the RP which are set in the state where the workpiece 50 is at the reference position and the reference height, and reference coordinates (X0 and Y0) at a position where the workpiece 50 irradiated with guide light is present. The processing control part 11 corrects a processing position on a processing surface 50c of the workpiece 50 by laser light by referring to the reference coordinates (X0 and Y0) stored in the storage part 13 and the object reference positions (P0 and Q0) corresponding to the registration pattern RP.SELECTED DRAWING: Figure 3
【課題】ワークの形状に関わらず、高さ方向および平面方向における位置ずれが生じた場合に、レーザ加工位置を適切に補正することが可能な制御装置およびこれを備えたレーザ加工システム、レーザ加工方法を提供する。【解決手段】制御装置１０は、加工制御部１１と、画像処理部１２と、記憶部１３と、を備えている。記憶部１３は、ワーク５０が基準位置および基準高さにある状態で設定される、ワーク５０の一部の形状を含む登録パターンＲＰおよびこれに対応する対象基準位置（Ｐ０，Ｑ０）と、ガイド光が照射されたワーク５０が存在する位置の基準座標（Ｘ０，Ｙ０）とを保存する。加工制御部１１は、記憶部１３に保存された基準座標（Ｘ０，Ｙ０）と、登録パターンＲＰに対応する対象基準位置（Ｐ０，Ｑ０）とを参照して、レーザ光によるワーク５０の加工面５０ｃ上における加工位置を補正する。【選択図】図３</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh19vcLCfL3UXBxDfN0dtVRcPRzUfBxDHYNUggI8nd2DQ729HNXCI4MDnH1hcqhSvm6hnj4u4BEwjxdXF0Uwj1DPBRCPFwVgh19XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBkaGBobGliYGjMVGKAC7oMsI</recordid><startdate>20210212</startdate><enddate>20210212</enddate><creator>ISHIZU YUICHI</creator><creator>FUKUI HIROSHI</creator><creator>SHIICHI KOJI</creator><creator>OGAMI YOJI</creator><scope>EVB</scope></search><sort><creationdate>20210212</creationdate><title>CONTROL DEVICE, AND LASER PROCESSING SYSTEM AND LAER PROCESSING METHOD PROVIDED WITH THE SAME</title><author>ISHIZU YUICHI ; FUKUI HIROSHI ; SHIICHI KOJI ; OGAMI YOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2021013940A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2021</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ISHIZU YUICHI</creatorcontrib><creatorcontrib>FUKUI HIROSHI</creatorcontrib><creatorcontrib>SHIICHI KOJI</creatorcontrib><creatorcontrib>OGAMI YOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ISHIZU YUICHI</au><au>FUKUI HIROSHI</au><au>SHIICHI KOJI</au><au>OGAMI YOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONTROL DEVICE, AND LASER PROCESSING SYSTEM AND LAER PROCESSING METHOD PROVIDED WITH THE SAME</title><date>2021-02-12</date><risdate>2021</risdate><abstract>To provide a control device which can appropriately correct a laser processing device when positional deviation in a height direction and a plane direction occurs irrespective of the shape of a workpiece, and a laser processing system and a laser processing method provided with the same.SOLUTION: A control device 10 includes a processing control part 11, an image processing part 12, and a storage part 13. The storage part 13 stores a registration pattern RP including a partial shape of a workpiece 50, object reference positions (P0 and Q0) corresponding to the RP which are set in the state where the workpiece 50 is at the reference position and the reference height, and reference coordinates (X0 and Y0) at a position where the workpiece 50 irradiated with guide light is present. The processing control part 11 corrects a processing position on a processing surface 50c of the workpiece 50 by laser light by referring to the reference coordinates (X0 and Y0) stored in the storage part 13 and the object reference positions (P0 and Q0) corresponding to the registration pattern RP.SELECTED DRAWING: Figure 3
【課題】ワークの形状に関わらず、高さ方向および平面方向における位置ずれが生じた場合に、レーザ加工位置を適切に補正することが可能な制御装置およびこれを備えたレーザ加工システム、レーザ加工方法を提供する。【解決手段】制御装置１０は、加工制御部１１と、画像処理部１２と、記憶部１３と、を備えている。記憶部１３は、ワーク５０が基準位置および基準高さにある状態で設定される、ワーク５０の一部の形状を含む登録パターンＲＰおよびこれに対応する対象基準位置（Ｐ０，Ｑ０）と、ガイド光が照射されたワーク５０が存在する位置の基準座標（Ｘ０，Ｙ０）とを保存する。加工制御部１１は、記憶部１３に保存された基準座標（Ｘ０，Ｙ０）と、登録パターンＲＰに対応する対象基準位置（Ｐ０，Ｑ０）とを参照して、レーザ光によるワーク５０の加工面５０ｃ上における加工位置を補正する。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2021013940A |
| source | esp@cenet |
| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | CONTROL DEVICE, AND LASER PROCESSING SYSTEM AND LAER PROCESSING METHOD PROVIDED WITH THE SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T14%3A52%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ISHIZU%20YUICHI&rft.date=2021-02-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2021013940A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |