ROW REDUNDANCY WITH DISTRIBUTED SECTORS

To provide a technique for a flash memory with row redundancy.SOLUTION: A semiconductor device includes an embedded flash memory. The embedded flash memory includes a memory bank 300 including a plurality of physical sectors 302. Each physical sector 302 includes a plurality of erase sectors 302_0 t...

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Hauptverfasser: URI KOTLICKI, KOBI DANON, ARIEH FELDMAN, YORAM BETSER
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KOBI DANON
ARIEH FELDMAN
YORAM BETSER
description To provide a technique for a flash memory with row redundancy.SOLUTION: A semiconductor device includes an embedded flash memory. The embedded flash memory includes a memory bank 300 including a plurality of physical sectors 302. Each physical sector 302 includes a plurality of erase sectors 302_0 to 302_3. In the memory bank, a plurality of portions of the additional erase sector are respectively distributed among the plurality of physical sectors. The plurality of portions of the additional erase sector are configured as a row-redundancy sector for the memory bank.SELECTED DRAWING: Figure 3 【課題】行冗長性を有するフラッシュメモリのための技術を提供する。【解決手段】半導体デバイスは埋め込みフラッシュメモリを備える。埋め込みフラッシュメモリは、複数の物理セクタ302を含むメモリバンク300を備える。各物理セクタ302は、複数の消去セクタ302_0〜302_3を備える。メモリバンクにおいて、追加の消去セクタの複数の部分は、複数の物理セクタの間にそれぞれ分散される。追加の消去セクタの複数の部分は、メモリバンクのための行冗長性セクタとして構成される。【選択図】図3
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title ROW REDUNDANCY WITH DISTRIBUTED SECTORS
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