METHOD OF FORMING NICKEL FILM

To provide a method of forming a nickel film, capable of forming a nickel film of a uniform surface.SOLUTION: There is provided a method of forming a nickel film by a solid phase electrodeposition process according to one embodiment of the present invention, comprising an electrolyte membrane attaching process of attaching a solid electrolyte membrane to the surface of each of a first nickel electrode and a second nickel electrode respectively, an electrode installation process of installing the first nickel electrode and the second nickel electrode in an electrolytic nickel plating solution, a first energizing process of applying a first energizing process to the electrolytic nickel plating solution at a temperature of not lower than the glass transition temperature of the solid electrolyte membrane and not higher than the boiling point of water, and a film forming process of forming a nickel film by a solid phase electrodeposition process using the electrolytic nickel plating solution, at a prescribed current density and at a prescribed electric capacity, subsequent to the first energizing process.SELECTED DRAWING: Figure 1 【課題】本開示の目的の一つは、表面が均一なニッケル膜を形成可能なニッケル膜の形成方法を提供することである。【解決手段】本実施形態の一態様は、固相電析法によりニッケル膜を形成する方法であって、第一のニッケル電極及び第二のニッケル電極のそれぞれの表面上に固体電解質膜を取り付ける電解質膜設置工程と、電解ニッケルめっき液中に前記第一のニッケル電極及び前記第二のニッケル電極を配置する電極配置工程と、前記電解ニッケルめっき液に、前記固体電解質膜のガラス転移点以上且つ水の沸点以下の温度で第一の通電処理を施す第一の通電工程と、前記第一の通電工程の後、前記電解ニッケルめっき液を用いて、固相電析法により所定の電流密度及び所定の電気容量でニッケル膜を形成する成膜工程と、を含む、方法である。【選択図】図１