DISCHARGE MATERIAL DISCHARGE DEVICE AND IMPRINT DEVICE
To maintain electric connection between a discharge device and an electric substrate.SOLUTION: A discharge material discharge device 10 has a discharge portion 13 which has a discharge port discharging a discharge material, an electric substrate 50 for controlling the discharge material, a first fle...
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| creator | HASEGAWA TAKAYASU KURI MASAHIRO |
| description | To maintain electric connection between a discharge device and an electric substrate.SOLUTION: A discharge material discharge device 10 has a discharge portion 13 which has a discharge port discharging a discharge material, an electric substrate 50 for controlling the discharge material, a first flexible cable 53 connected to the discharge portion, a second flexible cable 51 connected to an electric substrate 50, and a joint portion 63 in which the first flexible cable 53 and the second flexible cable 51 are joined by an anisotropic conductive film 52. In the discharge material 10, the joint portion 63 is covered by a sealing material 60 having durability to the discharge material.SELECTED DRAWING: Figure 5
【課題】吐出部と電気基板との電気的な接続を維持すること。【解決手段】吐出材を吐出する吐出口を有する吐出部１３と、吐出材の吐出を制御するための電気基板５０と、前記吐出部に接続された第１のフレキシブルケーブル５３と、電気基板５０に接続された第２のフレキシブルケーブル５１と、第１のフレキシブルケーブル５３と第２のフレキシブルケーブル５１とが異方性導電フイルム５２によって接合されている接合部６３と、を有している吐出材吐出装置１０において、接合部６３は吐出材に耐性のある封止材６０により被覆されていることを特徴とする吐出材吐出装置１０。【選択図】図５ |
| format | Patent |
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【課題】吐出部と電気基板との電気的な接続を維持すること。【解決手段】吐出材を吐出する吐出口を有する吐出部１３と、吐出材の吐出を制御するための電気基板５０と、前記吐出部に接続された第１のフレキシブルケーブル５３と、電気基板５０に接続された第２のフレキシブルケーブル５１と、第１のフレキシブルケーブル５３と第２のフレキシブルケーブル５１とが異方性導電フイルム５２によって接合されている接合部６３と、を有している吐出材吐出装置１０において、接合部６３は吐出材に耐性のある封止材６０により被覆されていることを特徴とする吐出材吐出装置１０。【選択図】図５</description><language>eng ; jpn</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CORRECTION OF TYPOGRAPHICAL ERRORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PRINTING ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SELECTIVE PRINTING MECHANISMS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; SPRAYING OR ATOMISING IN GENERAL ; STAMPS ; TRANSPORTING ; TYPEWRITERS ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201105&DB=EPODOC&CC=JP&NR=2020179370A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201105&DB=EPODOC&CC=JP&NR=2020179370A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASEGAWA TAKAYASU</creatorcontrib><creatorcontrib>KURI MASAHIRO</creatorcontrib><title>DISCHARGE MATERIAL DISCHARGE DEVICE AND IMPRINT DEVICE</title><description>To maintain electric connection between a discharge device and an electric substrate.SOLUTION: A discharge material discharge device 10 has a discharge portion 13 which has a discharge port discharging a discharge material, an electric substrate 50 for controlling the discharge material, a first flexible cable 53 connected to the discharge portion, a second flexible cable 51 connected to an electric substrate 50, and a joint portion 63 in which the first flexible cable 53 and the second flexible cable 51 are joined by an anisotropic conductive film 52. In the discharge material 10, the joint portion 63 is covered by a sealing material 60 having durability to the discharge material.SELECTED DRAWING: Figure 5
【課題】吐出部と電気基板との電気的な接続を維持すること。【解決手段】吐出材を吐出する吐出口を有する吐出部１３と、吐出材の吐出を制御するための電気基板５０と、前記吐出部に接続された第１のフレキシブルケーブル５３と、電気基板５０に接続された第２のフレキシブルケーブル５１と、第１のフレキシブルケーブル５３と第２のフレキシブルケーブル５１とが異方性導電フイルム５２によって接合されている接合部６３と、を有している吐出材吐出装置１０において、接合部６３は吐出材に耐性のある封止材６０により被覆されていることを特徴とする吐出材吐出装置１０。【選択図】図５</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBz8Qx29nAMcndV8HUMcQ3ydPRRQAi5uIZ5OrsqOPq5KHj6BgR5-oVAhXgYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBkYGhuaWxuYGjMVGKAD42KAg</recordid><startdate>20201105</startdate><enddate>20201105</enddate><creator>HASEGAWA TAKAYASU</creator><creator>KURI MASAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20201105</creationdate><title>DISCHARGE MATERIAL DISCHARGE DEVICE AND IMPRINT DEVICE</title><author>HASEGAWA TAKAYASU ; KURI MASAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020179370A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>HASEGAWA TAKAYASU</creatorcontrib><creatorcontrib>KURI MASAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HASEGAWA TAKAYASU</au><au>KURI MASAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DISCHARGE MATERIAL DISCHARGE DEVICE AND IMPRINT DEVICE</title><date>2020-11-05</date><risdate>2020</risdate><abstract>To maintain electric connection between a discharge device and an electric substrate.SOLUTION: A discharge material discharge device 10 has a discharge portion 13 which has a discharge port discharging a discharge material, an electric substrate 50 for controlling the discharge material, a first flexible cable 53 connected to the discharge portion, a second flexible cable 51 connected to an electric substrate 50, and a joint portion 63 in which the first flexible cable 53 and the second flexible cable 51 are joined by an anisotropic conductive film 52. In the discharge material 10, the joint portion 63 is covered by a sealing material 60 having durability to the discharge material.SELECTED DRAWING: Figure 5
【課題】吐出部と電気基板との電気的な接続を維持すること。【解決手段】吐出材を吐出する吐出口を有する吐出部１３と、吐出材の吐出を制御するための電気基板５０と、前記吐出部に接続された第１のフレキシブルケーブル５３と、電気基板５０に接続された第２のフレキシブルケーブル５１と、第１のフレキシブルケーブル５３と第２のフレキシブルケーブル５１とが異方性導電フイルム５２によって接合されている接合部６３と、を有している吐出材吐出装置１０において、接合部６３は吐出材に耐性のある封止材６０により被覆されていることを特徴とする吐出材吐出装置１０。【選択図】図５</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PRINTING PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING OR ATOMISING IN GENERAL STAMPS TRANSPORTING TYPEWRITERS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | DISCHARGE MATERIAL DISCHARGE DEVICE AND IMPRINT DEVICE |
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