DIVISION DEVICE

To correctly set an expanded amount if a chip interval is expanded by expanding a tape.SOLUTION: In a division device 1, a table 30 comprises: a transparent plate 300 having a suction port communicating an upper surface and a suction source so as to make the upper surface function as a holding surfa...

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Hauptverfasser: OKUBO HIROSHIGE, CHOU CHU-XUAN
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CHOU CHU-XUAN
description To correctly set an expanded amount if a chip interval is expanded by expanding a tape.SOLUTION: In a division device 1, a table 30 comprises: a transparent plate 300 having a suction port communicating an upper surface and a suction source so as to make the upper surface function as a holding surface; a support base 301 in the transparent plate 300; a lower illumination 302 that is distributed between the transparent plate 300 and the base 301 to illuminate the holding surface, and comprises: a storage part 90 that stores a coupling image GA indicating an upper surface of a processing material, obtained by coupling a plurality of imaging images formed by a part where the upper surface of the processed material in which a lower illumination 302 is illuminated and a calf is formed in imaging means 62 is imaged to form an image, and a light of the lower illumination 302 is penetrated and imaged in white and a part where the light of the lower illumination 302 is blocked with the processed material and is imaged in black; and a calculation part 92 that calculates an expand amount for expanding an interval between chips which having a device on the basis of the number of pixels of a white part of the coupling image GA stored in the image storage part 90.SELECTED DRAWING: Figure 1 【課題】テープエキスパンドしてチップ間隔を広げる場合、エキスパンド量が正しく設定されるようにする。【解決手段】テーブル30は、上面を保持面として機能させるように上面と吸引源とを連通させる吸引口を備える透明プレート300と、透明プレート300を支持基台301と、透明プレート300と基台301との間に配設され保持面を照らす下照明302と、を備え、下照明302が点灯され撮像手段62でカーフが形成され分割された被加工物の上面が撮像され画像が形成されていき、下照明302の光が透過し白く撮像された部分と下照明302の光が被加工物で遮光され黒く撮像された部分とからなる複数の撮像画像を結合した被加工物上面を示す結合画像GAを記憶する記憶部90と、画像記憶部90に記憶された結合画像GAの白部分のピクセル数により、デバイスを備えるチップとチップとの間隔を広げるエキスパンド量を算出する算出部92と、を備える分割装置1。【選択図】図1
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a support base 301 in the transparent plate 300; a lower illumination 302 that is distributed between the transparent plate 300 and the base 301 to illuminate the holding surface, and comprises: a storage part 90 that stores a coupling image GA indicating an upper surface of a processing material, obtained by coupling a plurality of imaging images formed by a part where the upper surface of the processed material in which a lower illumination 302 is illuminated and a calf is formed in imaging means 62 is imaged to form an image, and a light of the lower illumination 302 is penetrated and imaged in white and a part where the light of the lower illumination 302 is blocked with the processed material and is imaged in black; and a calculation part 92 that calculates an expand amount for expanding an interval between chips which having a device on the basis of the number of pixels of a white part of the coupling image GA stored in the image storage part 90.SELECTED DRAWING: Figure 1 【課題】テープエキスパンドしてチップ間隔を広げる場合、エキスパンド量が正しく設定されるようにする。【解決手段】テーブル30は、上面を保持面として機能させるように上面と吸引源とを連通させる吸引口を備える透明プレート300と、透明プレート300を支持基台301と、透明プレート300と基台301との間に配設され保持面を照らす下照明302と、を備え、下照明302が点灯され撮像手段62でカーフが形成され分割された被加工物の上面が撮像され画像が形成されていき、下照明302の光が透過し白く撮像された部分と下照明302の光が被加工物で遮光され黒く撮像された部分とからなる複数の撮像画像を結合した被加工物上面を示す結合画像GAを記憶する記憶部90と、画像記憶部90に記憶された結合画像GAの白部分のピクセル数により、デバイスを備えるチップとチップとの間隔を広げるエキスパンド量を算出する算出部92と、を備える分割装置1。【選択図】図1</description><language>eng ; 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CHOU CHU-XUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020178037A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>OKUBO HIROSHIGE</creatorcontrib><creatorcontrib>CHOU CHU-XUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKUBO HIROSHIGE</au><au>CHOU CHU-XUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIVISION DEVICE</title><date>2020-10-29</date><risdate>2020</risdate><abstract>To correctly set an expanded amount if a chip interval is expanded by expanding a tape.SOLUTION: In a division device 1, a table 30 comprises: a transparent plate 300 having a suction port communicating an upper surface and a suction source so as to make the upper surface function as a holding surface; a support base 301 in the transparent plate 300; a lower illumination 302 that is distributed between the transparent plate 300 and the base 301 to illuminate the holding surface, and comprises: a storage part 90 that stores a coupling image GA indicating an upper surface of a processing material, obtained by coupling a plurality of imaging images formed by a part where the upper surface of the processed material in which a lower illumination 302 is illuminated and a calf is formed in imaging means 62 is imaged to form an image, and a light of the lower illumination 302 is penetrated and imaged in white and a part where the light of the lower illumination 302 is blocked with the processed material and is imaged in black; and a calculation part 92 that calculates an expand amount for expanding an interval between chips which having a device on the basis of the number of pixels of a white part of the coupling image GA stored in the image storage part 90.SELECTED DRAWING: Figure 1 【課題】テープエキスパンドしてチップ間隔を広げる場合、エキスパンド量が正しく設定されるようにする。【解決手段】テーブル30は、上面を保持面として機能させるように上面と吸引源とを連通させる吸引口を備える透明プレート300と、透明プレート300を支持基台301と、透明プレート300と基台301との間に配設され保持面を照らす下照明302と、を備え、下照明302が点灯され撮像手段62でカーフが形成され分割された被加工物の上面が撮像され画像が形成されていき、下照明302の光が透過し白く撮像された部分と下照明302の光が被加工物で遮光され黒く撮像された部分とからなる複数の撮像画像を結合した被加工物上面を示す結合画像GAを記憶する記憶部90と、画像記憶部90に記憶された結合画像GAの白部分のピクセル数により、デバイスを備えるチップとチップとの間隔を広げるエキスパンド量を算出する算出部92と、を備える分割装置1。【選択図】図1</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
title DIVISION DEVICE
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