SPUTTERING DEVICE
To provide a sputtering device that can deposit a film with a uniform thickness.SOLUTION: A sputtering device 1 includes: a film deposition roll 27; and multiple film deposition chambers 51, 61, 65, 71, 75. In the sputtering device 1, the multiple film deposition chambers respectively include: a tar...
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| creator | KAMIMARU TAKESHI MURAKAMI HISAFUMI KIRA RYUICHI |
| description | To provide a sputtering device that can deposit a film with a uniform thickness.SOLUTION: A sputtering device 1 includes: a film deposition roll 27; and multiple film deposition chambers 51, 61, 65, 71, 75. In the sputtering device 1, the multiple film deposition chambers respectively include: a target unit 55; and wall parts 52, 62, 66, 72, 76 for partitioning the film deposition chambers. The wall parts are provided with an exhaust port 15. The target unit 55 is disposed on a first virtual line L1 passing through a film deposition roll center C1 and an exhaust port center C2 in a first cross-sectional view.SELECTED DRAWING: Figure 1
【課題】均一な膜厚を形成することができるスパッタ装置を提供すること。【解決手段】スパッタ装置１は、成膜ロール２７と、複数の成膜室５１、６１、６５、７１、７５とを備えるスパッタ装置１であって、 複数の成膜室は、それぞれ、ターゲットユニット５５と、成膜室を区画する壁部５２、６２、６６、７２、７６とを備え、壁部には、排気口１５が設けられており、第１断面図において、成膜ロール中心Ｃ１と排気口中心Ｃ２とを通過する第１仮想線Ｌ１上に、ターゲットユニット５５が配置されている。【選択図】図１ |
| format | Patent |
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【課題】均一な膜厚を形成することができるスパッタ装置を提供すること。【解決手段】スパッタ装置１は、成膜ロール２７と、複数の成膜室５１、６１、６５、７１、７５とを備えるスパッタ装置１であって、 複数の成膜室は、それぞれ、ターゲットユニット５５と、成膜室を区画する壁部５２、６２、６６、７２、７６とを備え、壁部には、排気口１５が設けられており、第１断面図において、成膜ロール中心Ｃ１と排気口中心Ｃ２とを通過する第１仮想線Ｌ１上に、ターゲットユニット５５が配置されている。【選択図】図１</description><language>eng ; jpn</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201029&DB=EPODOC&CC=JP&NR=2020176316A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201029&DB=EPODOC&CC=JP&NR=2020176316A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMIMARU TAKESHI</creatorcontrib><creatorcontrib>MURAKAMI HISAFUMI</creatorcontrib><creatorcontrib>KIRA RYUICHI</creatorcontrib><title>SPUTTERING DEVICE</title><description>To provide a sputtering device that can deposit a film with a uniform thickness.SOLUTION: A sputtering device 1 includes: a film deposition roll 27; and multiple film deposition chambers 51, 61, 65, 71, 75. In the sputtering device 1, the multiple film deposition chambers respectively include: a target unit 55; and wall parts 52, 62, 66, 72, 76 for partitioning the film deposition chambers. The wall parts are provided with an exhaust port 15. The target unit 55 is disposed on a first virtual line L1 passing through a film deposition roll center C1 and an exhaust port center C2 in a first cross-sectional view.SELECTED DRAWING: Figure 1
【課題】均一な膜厚を形成することができるスパッタ装置を提供すること。【解決手段】スパッタ装置１は、成膜ロール２７と、複数の成膜室５１、６１、６５、７１、７５とを備えるスパッタ装置１であって、 複数の成膜室は、それぞれ、ターゲットユニット５５と、成膜室を区画する壁部５２、６２、６６、７２、７６とを備え、壁部には、排気口１５が設けられており、第１断面図において、成膜ロール中心Ｃ１と排気口中心Ｃ２とを通過する第１仮想線Ｌ１上に、ターゲットユニット５５が配置されている。【選択図】図１</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMDggNCXEN8vRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRgaG5mbGhmaOxkQpAgBlDR5J</recordid><startdate>20201029</startdate><enddate>20201029</enddate><creator>KAMIMARU TAKESHI</creator><creator>MURAKAMI HISAFUMI</creator><creator>KIRA RYUICHI</creator><scope>EVB</scope></search><sort><creationdate>20201029</creationdate><title>SPUTTERING DEVICE</title><author>KAMIMARU TAKESHI ; MURAKAMI HISAFUMI ; KIRA RYUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020176316A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMIMARU TAKESHI</creatorcontrib><creatorcontrib>MURAKAMI HISAFUMI</creatorcontrib><creatorcontrib>KIRA RYUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMIMARU TAKESHI</au><au>MURAKAMI HISAFUMI</au><au>KIRA RYUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SPUTTERING DEVICE</title><date>2020-10-29</date><risdate>2020</risdate><abstract>To provide a sputtering device that can deposit a film with a uniform thickness.SOLUTION: A sputtering device 1 includes: a film deposition roll 27; and multiple film deposition chambers 51, 61, 65, 71, 75. In the sputtering device 1, the multiple film deposition chambers respectively include: a target unit 55; and wall parts 52, 62, 66, 72, 76 for partitioning the film deposition chambers. The wall parts are provided with an exhaust port 15. The target unit 55 is disposed on a first virtual line L1 passing through a film deposition roll center C1 and an exhaust port center C2 in a first cross-sectional view.SELECTED DRAWING: Figure 1
【課題】均一な膜厚を形成することができるスパッタ装置を提供すること。【解決手段】スパッタ装置１は、成膜ロール２７と、複数の成膜室５１、６１、６５、７１、７５とを備えるスパッタ装置１であって、 複数の成膜室は、それぞれ、ターゲットユニット５５と、成膜室を区画する壁部５２、６２、６６、７２、７６とを備え、壁部には、排気口１５が設けられており、第１断面図において、成膜ロール中心Ｃ１と排気口中心Ｃ２とを通過する第１仮想線Ｌ１上に、ターゲットユニット５５が配置されている。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SPUTTERING DEVICE |
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