VACUUM DEVICE, CONVEYOR AND ALIGNMENT METHOD
To provide a conveyor capable of fixing a substrate to a mask without generating a chip in a substrate, and without generating dust; and to provide a vacuum device having the same.SOLUTION: In the state where a magnetic field formed between the tip of a magnetic core 36 and the tip of a yoke part 35...
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creator | NAKAO HIROTOSHI |
description | To provide a conveyor capable of fixing a substrate to a mask without generating a chip in a substrate, and without generating dust; and to provide a vacuum device having the same.SOLUTION: In the state where a magnetic field formed between the tip of a magnetic core 36 and the tip of a yoke part 35 by a permanent magnet part 17 of an adsorption part 321 provided on a frame body 31 for a mask is weakened by a magnetic field induced by sending a release current in an electromagnet part 14, the frame body 31 for the mask and a frame body 41 for a substrate are brought close to each other, to thereby achieve positioning between the mask 15 and the substrate 16. After positioning, the release current is stopped, and the frame body 41 for the substrate is magnetically adsorbed to the frame body 31 for the mask by the magnetic field of the electromagnet part 14, and both are moved together.SELECTED DRAWING: Figure 11
【課題】基板に欠けが生じず、ダストを発生させずに基板とマスクとを固定することが可能な運搬装置、及びそれを有する真空装置を提供する。【解決手段】マスク用枠体31に設けられた吸着部321の永久磁石部17が磁芯36の先端とヨーク部35の先端との間に形成する磁界を、電磁石部14に解除電流を流して誘起された磁界によって弱めた状態で、マスク用枠体31と基板用枠体41とを近接させ、マスク15と基板16との位置合わせを行う。位置合わせ後解除電流を停止し、電磁石部14の磁界で基板用枠体41をマスク用枠体31に磁気吸着させ、一緒に移動する。【選択図】図11 |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2020164943A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2020164943A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2020164943A3</originalsourceid><addsrcrecordid>eNrjZNAJc3QODfVVcHEN83R21VFw9vcLc430D1Jw9HNRcPTxdPfzdfULUfB1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRgaGZiaWJsaOxkQpAgDRKiV6</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VACUUM DEVICE, CONVEYOR AND ALIGNMENT METHOD</title><source>esp@cenet</source><creator>NAKAO HIROTOSHI</creator><creatorcontrib>NAKAO HIROTOSHI</creatorcontrib><description>To provide a conveyor capable of fixing a substrate to a mask without generating a chip in a substrate, and without generating dust; and to provide a vacuum device having the same.SOLUTION: In the state where a magnetic field formed between the tip of a magnetic core 36 and the tip of a yoke part 35 by a permanent magnet part 17 of an adsorption part 321 provided on a frame body 31 for a mask is weakened by a magnetic field induced by sending a release current in an electromagnet part 14, the frame body 31 for the mask and a frame body 41 for a substrate are brought close to each other, to thereby achieve positioning between the mask 15 and the substrate 16. After positioning, the release current is stopped, and the frame body 41 for the substrate is magnetically adsorbed to the frame body 31 for the mask by the magnetic field of the electromagnet part 14, and both are moved together.SELECTED DRAWING: Figure 11
【課題】基板に欠けが生じず、ダストを発生させずに基板とマスクとを固定することが可能な運搬装置、及びそれを有する真空装置を提供する。【解決手段】マスク用枠体31に設けられた吸着部321の永久磁石部17が磁芯36の先端とヨーク部35の先端との間に形成する磁界を、電磁石部14に解除電流を流して誘起された磁界によって弱めた状態で、マスク用枠体31と基板用枠体41とを近接させ、マスク15と基板16との位置合わせを行う。位置合わせ後解除電流を停止し、電磁石部14の磁界で基板用枠体41をマスク用枠体31に磁気吸着させ、一緒に移動する。【選択図】図11</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201008&DB=EPODOC&CC=JP&NR=2020164943A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76292</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201008&DB=EPODOC&CC=JP&NR=2020164943A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAO HIROTOSHI</creatorcontrib><title>VACUUM DEVICE, CONVEYOR AND ALIGNMENT METHOD</title><description>To provide a conveyor capable of fixing a substrate to a mask without generating a chip in a substrate, and without generating dust; and to provide a vacuum device having the same.SOLUTION: In the state where a magnetic field formed between the tip of a magnetic core 36 and the tip of a yoke part 35 by a permanent magnet part 17 of an adsorption part 321 provided on a frame body 31 for a mask is weakened by a magnetic field induced by sending a release current in an electromagnet part 14, the frame body 31 for the mask and a frame body 41 for a substrate are brought close to each other, to thereby achieve positioning between the mask 15 and the substrate 16. After positioning, the release current is stopped, and the frame body 41 for the substrate is magnetically adsorbed to the frame body 31 for the mask by the magnetic field of the electromagnet part 14, and both are moved together.SELECTED DRAWING: Figure 11
【課題】基板に欠けが生じず、ダストを発生させずに基板とマスクとを固定することが可能な運搬装置、及びそれを有する真空装置を提供する。【解決手段】マスク用枠体31に設けられた吸着部321の永久磁石部17が磁芯36の先端とヨーク部35の先端との間に形成する磁界を、電磁石部14に解除電流を流して誘起された磁界によって弱めた状態で、マスク用枠体31と基板用枠体41とを近接させ、マスク15と基板16との位置合わせを行う。位置合わせ後解除電流を停止し、電磁石部14の磁界で基板用枠体41をマスク用枠体31に磁気吸着させ、一緒に移動する。【選択図】図11</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJc3QODfVVcHEN83R21VFw9vcLc430D1Jw9HNRcPTxdPfzdfULUfB1DfHwd-FhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRgaGZiaWJsaOxkQpAgDRKiV6</recordid><startdate>20201008</startdate><enddate>20201008</enddate><creator>NAKAO HIROTOSHI</creator><scope>EVB</scope></search><sort><creationdate>20201008</creationdate><title>VACUUM DEVICE, CONVEYOR AND ALIGNMENT METHOD</title><author>NAKAO HIROTOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020164943A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAO HIROTOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAO HIROTOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VACUUM DEVICE, CONVEYOR AND ALIGNMENT METHOD</title><date>2020-10-08</date><risdate>2020</risdate><abstract>To provide a conveyor capable of fixing a substrate to a mask without generating a chip in a substrate, and without generating dust; and to provide a vacuum device having the same.SOLUTION: In the state where a magnetic field formed between the tip of a magnetic core 36 and the tip of a yoke part 35 by a permanent magnet part 17 of an adsorption part 321 provided on a frame body 31 for a mask is weakened by a magnetic field induced by sending a release current in an electromagnet part 14, the frame body 31 for the mask and a frame body 41 for a substrate are brought close to each other, to thereby achieve positioning between the mask 15 and the substrate 16. After positioning, the release current is stopped, and the frame body 41 for the substrate is magnetically adsorbed to the frame body 31 for the mask by the magnetic field of the electromagnet part 14, and both are moved together.SELECTED DRAWING: Figure 11
【課題】基板に欠けが生じず、ダストを発生させずに基板とマスクとを固定することが可能な運搬装置、及びそれを有する真空装置を提供する。【解決手段】マスク用枠体31に設けられた吸着部321の永久磁石部17が磁芯36の先端とヨーク部35の先端との間に形成する磁界を、電磁石部14に解除電流を流して誘起された磁界によって弱めた状態で、マスク用枠体31と基板用枠体41とを近接させ、マスク15と基板16との位置合わせを行う。位置合わせ後解除電流を停止し、電磁石部14の磁界で基板用枠体41をマスク用枠体31に磁気吸着させ、一緒に移動する。【選択図】図11</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | VACUUM DEVICE, CONVEYOR AND ALIGNMENT METHOD |
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