CONDUCTIVE COMPOSITION

To provide a conductive composition capable of forming a cured product having good solder wettability.SOLUTION: The conductive composition of the present invention contains: a binder component containing a thermosetting compound; metal particles; and a fluorine-based surfactant. The metal particles...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUJIKAWA RYOTA, YAMAMOTO MASAHIRO, YAMAGUCHI NORIHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a conductive composition capable of forming a cured product having good solder wettability.SOLUTION: The conductive composition of the present invention contains: a binder component containing a thermosetting compound; metal particles; and a fluorine-based surfactant. The metal particles contain low melting point metal particles having a melting point of 240°C or lower and high melting point metal particles having a melting point of 800°C or higher. The content of the metal particles is 1,000-2,000 pts.mass and the content of the low melting point metal particles is 10-900 pts.mass based on 100 pts.mass of the binder component.SELECTED DRAWING: Figure 1 【課題】はんだの濡れ性が良好である硬化物を形成可能な導電性組成物を提供する。【解決手段】本発明の導電性組成物は、熱硬化性化合物を含むバインダー成分、金属粒子、及びフッ素系界面活性剤を含有し、前記金属粒子は、融点２４０℃以下の低融点金属粒子及び融点８００℃以上の高融点金属粒子を含有し、前記バインダー成分１００質量部に対し、前記金属粒子の含有量が１０００〜２０００質量部、前記低融点金属粒子の含有量が１０〜９００質量部である。【選択図】図１