THREE-DIMENSIONAL MOLDING DEVICE AND METHOD FOR MOLDING THREE-DIMENSIONAL MOLDED OBJECT

To suppress energy consumption for improving an interlayer adhesion of a molded object.SOLUTION: A three-dimensional molding device comprises: a discharge unit that discharges a molding material; a heating unit that heats the discharge unit; a temperature acquisition unit that acquires a temperature of the molding material placed on a stage; and a control unit. The control unit controls the heating unit so as to satisfy a relation of the following expression (1) with the following items: a temperature Tb and a path cross-sectional area Sb of an existing layer; a specific gravity ρb and a specific heat Cb of a first thermoplastic resin contained in the existing layer; a temperature Tu of the heating unit; a path cross-sectional area Su of a subsequent layer; a specific gravity ρu and a specific heat Cu of a second thermoplastic resin contained in the subsequent layer; a thermal decomposition temperature Td that is a lower thermal decomposition temperature between a thermal decomposition temperature of the first thermoplastic resin and a thermal decomposition temperature of the second thermoplastic resin; and a glass transition temperature Tg that is a higher glass transition point between a glass transition point of the first thermoplastic resin and a glass transition point of the second thermoplastic resin. Expression (1):Td>(Tu×Su×ρu×Cu+Tb×Sb×ρb×Cb)/(Su×ρu×Cu+Sb×ρb×Cb)>Tg.SELECTED DRAWING: Figure 1 【課題】造形物の層間密着性を高めるためのエネルギー消費を抑制する。【解決手段】三次元造形装置は、造形材料をステージに向かって吐出する吐出部と、吐出部を加熱する加熱部と、ステージ上に配置された造形材料の温度を取得する温度取得部と、制御部を備える。制御部は、既設層の温度Ｔｂとパス断面積Ｓｂと、既設層に含まれる第１熱可塑性樹脂の比重ρｂと比熱Ｃｂと、加熱部の温度Ｔｕと、後続層のパス断面積Ｓｕと、後続層に含まれる第２熱可塑性樹脂の比重ρｕと比熱Ｃｕと、第１熱可塑性樹脂の熱分解温度と第２熱可塑性樹脂の熱分解温度とのうち低い方の温度Ｔｄと、第１熱可塑性樹脂のガラス転移点と第２熱可塑性樹脂のガラス転移点とのうち高い方の温度Ｔｇとの関係が式（１）を満たすように加熱部を制御する。Ｔｄ＞（Ｔｕ×Ｓｕ×ρｕ×Ｃｕ＋Ｔｂ×Ｓｂ×ρｂ×Ｃｂ）／（Ｓｕ×ρｕ×Ｃｕ＋Ｓｂ×ρｂ×Ｃｂ）＞Ｔｇ ・・・（１）【選択図】図１