SUBSTRATE STRUCTURE, MANUFACTURING METHOD FOR THE SAME, AND LIQUID DISCHARGE HEAD
To provide a substrate structure, a manufacturing method for the same and a liquid discharger head, which can suppress erosion of metal layers constituting a laminated film while suppressing a chip size from being enlarged.SOLUTION: A substrate structure comprises a substrate 1 and a laminated film...
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| creator | YASUDA KEN TAKEUCHI SOTA SHIBATA KAZUAKI YONEMOTO TAICHI |
| description | To provide a substrate structure, a manufacturing method for the same and a liquid discharger head, which can suppress erosion of metal layers constituting a laminated film while suppressing a chip size from being enlarged.SOLUTION: A substrate structure comprises a substrate 1 and a laminated film 2 constituted of a plurality of layers formed on the substrate 1. The plurality of layers constituting the laminates film 2 include a plurality of metal layers 6 and 7 being directly contacted and overlapped with each other and having ionization tendencies different from each other. In at least parts of the substrate 1 and the layers positioned below the metal layer 6 having a higher ionization tendency of the plurality of metal layers 6 and 7 in a lamination direction of the laminated film 2 are provided groove parts 8. The metal layer 6 having the higher ionization tendency has a part which is formed along an inner surface of the groove part 8 and is extended along a face direction of the substrate 1 and a part which is extended along the lamination direction inside the groove part.SELECTED DRAWING: Figure 2
【課題】チップサイズの大型化を抑制しつつ、積層膜を構成する金属層の侵食を抑制することが可能な、基板構造体とその製造方法と液体吐出ヘッドを提供する。【解決手段】基板構造体が、基板１と、基板１の上に設けられた複数の層からなる積層膜２とを有する。積層膜２を構成する複数の層には、互いに直接接して重なり合っておりイオン化傾向が互いに異なる複数の金属層６，７が含まれている。積層膜２の積層方向において複数の金属層６，７のうちイオン化傾向が高い金属層６の下方に位置する、基板１と層とのうちの少なくとも一部に、溝部８が設けられている。イオン化傾向が高い金属層６は、溝部８の内面に沿って形成されて、基板１の面方向に沿って延びる部分と、溝部の内部で積層方向に沿って延びる部分とを有している。【選択図】図２ |
| format | Patent |
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【課題】チップサイズの大型化を抑制しつつ、積層膜を構成する金属層の侵食を抑制することが可能な、基板構造体とその製造方法と液体吐出ヘッドを提供する。【解決手段】基板構造体が、基板１と、基板１の上に設けられた複数の層からなる積層膜２とを有する。積層膜２を構成する複数の層には、互いに直接接して重なり合っておりイオン化傾向が互いに異なる複数の金属層６，７が含まれている。積層膜２の積層方向において複数の金属層６，７のうちイオン化傾向が高い金属層６の下方に位置する、基板１と層とのうちの少なくとも一部に、溝部８が設けられている。イオン化傾向が高い金属層６は、溝部８の内面に沿って形成されて、基板１の面方向に沿って延びる部分と、溝部の内部で積層方向に沿って延びる部分とを有している。【選択図】図２</description><language>eng ; jpn</language><subject>CORRECTION OF TYPOGRAPHICAL ERRORS ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200625&DB=EPODOC&CC=JP&NR=2020097116A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200625&DB=EPODOC&CC=JP&NR=2020097116A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YASUDA KEN</creatorcontrib><creatorcontrib>TAKEUCHI SOTA</creatorcontrib><creatorcontrib>SHIBATA KAZUAKI</creatorcontrib><creatorcontrib>YONEMOTO TAICHI</creatorcontrib><title>SUBSTRATE STRUCTURE, MANUFACTURING METHOD FOR THE SAME, AND LIQUID DISCHARGE HEAD</title><description>To provide a substrate structure, a manufacturing method for the same and a liquid discharger head, which can suppress erosion of metal layers constituting a laminated film while suppressing a chip size from being enlarged.SOLUTION: A substrate structure comprises a substrate 1 and a laminated film 2 constituted of a plurality of layers formed on the substrate 1. The plurality of layers constituting the laminates film 2 include a plurality of metal layers 6 and 7 being directly contacted and overlapped with each other and having ionization tendencies different from each other. In at least parts of the substrate 1 and the layers positioned below the metal layer 6 having a higher ionization tendency of the plurality of metal layers 6 and 7 in a lamination direction of the laminated film 2 are provided groove parts 8. The metal layer 6 having the higher ionization tendency has a part which is formed along an inner surface of the groove part 8 and is extended along a face direction of the substrate 1 and a part which is extended along the lamination direction inside the groove part.SELECTED DRAWING: Figure 2
【課題】チップサイズの大型化を抑制しつつ、積層膜を構成する金属層の侵食を抑制することが可能な、基板構造体とその製造方法と液体吐出ヘッドを提供する。【解決手段】基板構造体が、基板１と、基板１の上に設けられた複数の層からなる積層膜２とを有する。積層膜２を構成する複数の層には、互いに直接接して重なり合っておりイオン化傾向が互いに異なる複数の金属層６，７が含まれている。積層膜２の積層方向において複数の金属層６，７のうちイオン化傾向が高い金属層６の下方に位置する、基板１と層とのうちの少なくとも一部に、溝部８が設けられている。イオン化傾向が高い金属層６は、溝部８の内面に沿って形成されて、基板１の面方向に沿って延びる部分と、溝部の内部で積層方向に沿って延びる部分とを有している。【選択図】図２</description><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgMDnUKDglyDHFVAFKhziGhQa46Cr6OfqFujiCOp5-7gq9riIe_i4Kbf5BCiAdQnaMvUImjn4uCj2dgqKeLgotnsLOHY5C7q4KHq6MLDwNrWmJOcSovlOZmUHJzDXH20E0tyI9PLS5ITE7NSy2J9wowMjAyMLA0NzQ0czQmShEA-5MvhA</recordid><startdate>20200625</startdate><enddate>20200625</enddate><creator>YASUDA KEN</creator><creator>TAKEUCHI SOTA</creator><creator>SHIBATA KAZUAKI</creator><creator>YONEMOTO TAICHI</creator><scope>EVB</scope></search><sort><creationdate>20200625</creationdate><title>SUBSTRATE STRUCTURE, MANUFACTURING METHOD FOR THE SAME, AND LIQUID DISCHARGE HEAD</title><author>YASUDA KEN ; TAKEUCHI SOTA ; SHIBATA KAZUAKI ; YONEMOTO TAICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020097116A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>YASUDA KEN</creatorcontrib><creatorcontrib>TAKEUCHI SOTA</creatorcontrib><creatorcontrib>SHIBATA KAZUAKI</creatorcontrib><creatorcontrib>YONEMOTO TAICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YASUDA KEN</au><au>TAKEUCHI SOTA</au><au>SHIBATA KAZUAKI</au><au>YONEMOTO TAICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE STRUCTURE, MANUFACTURING METHOD FOR THE SAME, AND LIQUID DISCHARGE HEAD</title><date>2020-06-25</date><risdate>2020</risdate><abstract>To provide a substrate structure, a manufacturing method for the same and a liquid discharger head, which can suppress erosion of metal layers constituting a laminated film while suppressing a chip size from being enlarged.SOLUTION: A substrate structure comprises a substrate 1 and a laminated film 2 constituted of a plurality of layers formed on the substrate 1. The plurality of layers constituting the laminates film 2 include a plurality of metal layers 6 and 7 being directly contacted and overlapped with each other and having ionization tendencies different from each other. In at least parts of the substrate 1 and the layers positioned below the metal layer 6 having a higher ionization tendency of the plurality of metal layers 6 and 7 in a lamination direction of the laminated film 2 are provided groove parts 8. The metal layer 6 having the higher ionization tendency has a part which is formed along an inner surface of the groove part 8 and is extended along a face direction of the substrate 1 and a part which is extended along the lamination direction inside the groove part.SELECTED DRAWING: Figure 2
【課題】チップサイズの大型化を抑制しつつ、積層膜を構成する金属層の侵食を抑制することが可能な、基板構造体とその製造方法と液体吐出ヘッドを提供する。【解決手段】基板構造体が、基板１と、基板１の上に設けられた複数の層からなる積層膜２とを有する。積層膜２を構成する複数の層には、互いに直接接して重なり合っておりイオン化傾向が互いに異なる複数の金属層６，７が含まれている。積層膜２の積層方向において複数の金属層６，７のうちイオン化傾向が高い金属層６の下方に位置する、基板１と層とのうちの少なくとも一部に、溝部８が設けられている。イオン化傾向が高い金属層６は、溝部８の内面に沿って形成されて、基板１の面方向に沿って延びる部分と、溝部の内部で積層方向に沿って延びる部分とを有している。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
| title | SUBSTRATE STRUCTURE, MANUFACTURING METHOD FOR THE SAME, AND LIQUID DISCHARGE HEAD |
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