MANUFACTURING METHOD OF ELECTRONIC DEVICE
To provide a manufacturing method of an electronic device which can easily form a rounded concave portion at the bottom.SOLUTION: A concave mask portion 7 having a rounded bottom is formed in a desired region of a silicon substrate 1, and a trench is formed so as to trace the shape of the surface of...
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| creator | USUI TAKAHIDE |
| description | To provide a manufacturing method of an electronic device which can easily form a rounded concave portion at the bottom.SOLUTION: A concave mask portion 7 having a rounded bottom is formed in a desired region of a silicon substrate 1, and a trench is formed so as to trace the shape of the surface of the concave mask portion. The concave mask portion can be formed by etching a porous film 5.SELECTED DRAWING: Figure 2
【課題】簡便に底部が丸みを帯びた凹部を形成することができる電子デバイスの製造方法を提供する。【解決手段】シリコン基板１の所望の領域に底面が丸みを帯びた凹状マスク部７を形成し、この凹状マスク部表面の形状をトレースするようにトレンチを形成する。凹状マスク部は、多孔質膜５をエッチングすることで形成することができる。【選択図】図２ |
| format | Patent |
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【課題】簡便に底部が丸みを帯びた凹部を形成することができる電子デバイスの製造方法を提供する。【解決手段】シリコン基板１の所望の領域に底面が丸みを帯びた凹状マスク部７を形成し、この凹状マスク部表面の形状をトレースするようにトレンチを形成する。凹状マスク部は、多孔質膜５をエッチングすることで形成することができる。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200618&DB=EPODOC&CC=JP&NR=2020096131A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200618&DB=EPODOC&CC=JP&NR=2020096131A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>USUI TAKAHIDE</creatorcontrib><title>MANUFACTURING METHOD OF ELECTRONIC DEVICE</title><description>To provide a manufacturing method of an electronic device which can easily form a rounded concave portion at the bottom.SOLUTION: A concave mask portion 7 having a rounded bottom is formed in a desired region of a silicon substrate 1, and a trench is formed so as to trace the shape of the surface of the concave mask portion. The concave mask portion can be formed by etching a porous film 5.SELECTED DRAWING: Figure 2
【課題】簡便に底部が丸みを帯びた凹部を形成することができる電子デバイスの製造方法を提供する。【解決手段】シリコン基板１の所望の領域に底面が丸みを帯びた凹状マスク部７を形成し、この凹状マスク部表面の形状をトレースするようにトレンチを形成する。凹状マスク部は、多孔質膜５をエッチングすることで形成することができる。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND0dfQLdXN0DgkN8vRzV_B1DfHwd1Hwd1Nw9XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGRgYGlmaGxoaOxkQpAgByDSS2</recordid><startdate>20200618</startdate><enddate>20200618</enddate><creator>USUI TAKAHIDE</creator><scope>EVB</scope></search><sort><creationdate>20200618</creationdate><title>MANUFACTURING METHOD OF ELECTRONIC DEVICE</title><author>USUI TAKAHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020096131A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>USUI TAKAHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>USUI TAKAHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING METHOD OF ELECTRONIC DEVICE</title><date>2020-06-18</date><risdate>2020</risdate><abstract>To provide a manufacturing method of an electronic device which can easily form a rounded concave portion at the bottom.SOLUTION: A concave mask portion 7 having a rounded bottom is formed in a desired region of a silicon substrate 1, and a trench is formed so as to trace the shape of the surface of the concave mask portion. The concave mask portion can be formed by etching a porous film 5.SELECTED DRAWING: Figure 2
【課題】簡便に底部が丸みを帯びた凹部を形成することができる電子デバイスの製造方法を提供する。【解決手段】シリコン基板１の所望の領域に底面が丸みを帯びた凹状マスク部７を形成し、この凹状マスク部表面の形状をトレースするようにトレンチを形成する。凹状マスク部は、多孔質膜５をエッチングすることで形成することができる。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | MANUFACTURING METHOD OF ELECTRONIC DEVICE |
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