METHOD OF MANUFACTURING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR ELECTRIC POWER, AND SUBSTRATE
To provide a substrate capable of enhancing joining reliability of an electronic component bonded to a mounting surface of a metal circuit board.SOLUTION: In a method of manufacturing a substrate 10, the substrate 10 includes: a ceramic plate 11 having a first surface F1 and a second surface F2 oppo...
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| creator | TSUJINO MASAYUKI |
| description | To provide a substrate capable of enhancing joining reliability of an electronic component bonded to a mounting surface of a metal circuit board.SOLUTION: In a method of manufacturing a substrate 10, the substrate 10 includes: a ceramic plate 11 having a first surface F1 and a second surface F2 opposite to the first surface F1; a metal heat sink 12 provided on the first surface F1 of a ceramic plate 11; and a metal circuit board 13 provided on the second surface F2 of the ceramic plate 11 and having a mounting surface MS on which an electronic component 30 is mounted. The method of manufacturing the substrate 10 includes the following steps. The metal circuit board 13 is formed. A shot peening process is performed on the mounting surface MS of the metal circuit board 13.SELECTED DRAWING: Figure 1
【課題】金属回路板の実装面に接合された電子部品の接合信頼性を高めることができる基板を提供する。【解決手段】基板１０の製造方法は、第１の面Ｆ１と第１の面Ｆ１と反対の第２の面Ｆ２とを有するセラミック板１１と、セラミック板１１の第１の面Ｆ１上に設けられた金属放熱板１２と、セラミック板１１の第２の面Ｆ２上に設けられ、電子部品３０が実装されることになる実装面ＭＳを有する金属回路板１３と、を有する基板１０に関するものである。基板１０の製造方法は、以下の工程を有している。金属回路板１３が形成される。金属回路板１３の実装面ＭＳへショットピーニング加工が施される。【選択図】図１ |
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【課題】金属回路板の実装面に接合された電子部品の接合信頼性を高めることができる基板を提供する。【解決手段】基板１０の製造方法は、第１の面Ｆ１と第１の面Ｆ１と反対の第２の面Ｆ２とを有するセラミック板１１と、セラミック板１１の第１の面Ｆ１上に設けられた金属放熱板１２と、セラミック板１１の第２の面Ｆ２上に設けられ、電子部品３０が実装されることになる実装面ＭＳを有する金属回路板１３と、を有する基板１０に関するものである。基板１０の製造方法は、以下の工程を有している。金属回路板１３が形成される。金属回路板１３の実装面ＭＳへショットピーニング加工が施される。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200611&DB=EPODOC&CC=JP&NR=2020092134A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200611&DB=EPODOC&CC=JP&NR=2020092134A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUJINO MASAYUKI</creatorcontrib><title>METHOD OF MANUFACTURING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR ELECTRIC POWER, AND SUBSTRATE</title><description>To provide a substrate capable of enhancing joining reliability of an electronic component bonded to a mounting surface of a metal circuit board.SOLUTION: In a method of manufacturing a substrate 10, the substrate 10 includes: a ceramic plate 11 having a first surface F1 and a second surface F2 opposite to the first surface F1; a metal heat sink 12 provided on the first surface F1 of a ceramic plate 11; and a metal circuit board 13 provided on the second surface F2 of the ceramic plate 11 and having a mounting surface MS on which an electronic component 30 is mounted. The method of manufacturing the substrate 10 includes the following steps. The metal circuit board 13 is formed. A shot peening process is performed on the mounting surface MS of the metal circuit board 13.SELECTED DRAWING: Figure 1
【課題】金属回路板の実装面に接合された電子部品の接合信頼性を高めることができる基板を提供する。【解決手段】基板１０の製造方法は、第１の面Ｆ１と第１の面Ｆ１と反対の第２の面Ｆ２とを有するセラミック板１１と、セラミック板１１の第１の面Ｆ１上に設けられた金属放熱板１２と、セラミック板１１の第２の面Ｆ２上に設けられ、電子部品３０が実装されることになる実装面ＭＳを有する金属回路板１３と、を有する基板１０に関するものである。基板１０の製造方法は、以下の工程を有している。金属回路板１３が形成される。金属回路板１３の実装面ＭＳへショットピーニング加工が施される。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCj0dQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1cIDnUKDglyDHHVUcCpxNXX09nfzyXUOcQ_SMHFNczT2VXBDch09XF1DgnydFYI8A93DdJRcPRzQZjHw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvivQKMDIwMDCyNDI1NHI2JUgQAl6M4oQ</recordid><startdate>20200611</startdate><enddate>20200611</enddate><creator>TSUJINO MASAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20200611</creationdate><title>METHOD OF MANUFACTURING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR ELECTRIC POWER, AND SUBSTRATE</title><author>TSUJINO MASAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020092134A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUJINO MASAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUJINO MASAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR ELECTRIC POWER, AND SUBSTRATE</title><date>2020-06-11</date><risdate>2020</risdate><abstract>To provide a substrate capable of enhancing joining reliability of an electronic component bonded to a mounting surface of a metal circuit board.SOLUTION: In a method of manufacturing a substrate 10, the substrate 10 includes: a ceramic plate 11 having a first surface F1 and a second surface F2 opposite to the first surface F1; a metal heat sink 12 provided on the first surface F1 of a ceramic plate 11; and a metal circuit board 13 provided on the second surface F2 of the ceramic plate 11 and having a mounting surface MS on which an electronic component 30 is mounted. The method of manufacturing the substrate 10 includes the following steps. The metal circuit board 13 is formed. A shot peening process is performed on the mounting surface MS of the metal circuit board 13.SELECTED DRAWING: Figure 1
【課題】金属回路板の実装面に接合された電子部品の接合信頼性を高めることができる基板を提供する。【解決手段】基板１０の製造方法は、第１の面Ｆ１と第１の面Ｆ１と反対の第２の面Ｆ２とを有するセラミック板１１と、セラミック板１１の第１の面Ｆ１上に設けられた金属放熱板１２と、セラミック板１１の第２の面Ｆ２上に設けられ、電子部品３０が実装されることになる実装面ＭＳを有する金属回路板１３と、を有する基板１０に関するものである。基板１０の製造方法は、以下の工程を有している。金属回路板１３が形成される。金属回路板１３の実装面ＭＳへショットピーニング加工が施される。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | METHOD OF MANUFACTURING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FOR ELECTRIC POWER, AND SUBSTRATE |
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