HEAT PIPE

To provide a heat pipe that is improved in heat transport performance.SOLUTION: A heat pipe 10 includes: a container 14 in which working fluid 12 is encapsulated; and a wick structure 18 provided inside the container 14 and constituted of a hollow braided wire 16 that is formed by knitting fibers in...

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Hauptverfasser: FUJII SHIGETO, TSUCHIDE IKUHIRO, KAIBUCHI TOMOMI
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creator FUJII SHIGETO
TSUCHIDE IKUHIRO
KAIBUCHI TOMOMI
description To provide a heat pipe that is improved in heat transport performance.SOLUTION: A heat pipe 10 includes: a container 14 in which working fluid 12 is encapsulated; and a wick structure 18 provided inside the container 14 and constituted of a hollow braided wire 16 that is formed by knitting fibers into a cylindrical shape. A solid part 28 is provided in a hollow part 26 encircled by the hollow braided wire 16 of a heated part 20 heated from the outside of the container 14 to convert the hollow part 26 into solid.SELECTED DRAWING: Figure 1 【課題】熱輸送性能を向上したヒートパイプを提供する。【解決手段】作動流体12が内部に封入されたコンテナ14と、コンテナ14の内部に設けられ、繊維を筒状に編んだ中空編組線16からなるウィック構造18を備えたヒートパイプ10であって、コンテナ14の外部から加熱される加熱部20の中空編組線16に囲まれた中空部分26には、中空部分26を中実にする中実部28が設けられている。【選択図】図1
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A solid part 28 is provided in a hollow part 26 encircled by the hollow braided wire 16 of a heated part 20 heated from the outside of the container 14 to convert the hollow part 26 into solid.SELECTED DRAWING: Figure 1 【課題】熱輸送性能を向上したヒートパイプを提供する。【解決手段】作動流体12が内部に封入されたコンテナ14と、コンテナ14の内部に設けられ、繊維を筒状に編んだ中空編組線16からなるウィック構造18を備えたヒートパイプ10であって、コンテナ14の外部から加熱される加熱部20の中空編組線16に囲まれた中空部分26には、中空部分26を中実にする中実部28が設けられている。【選択図】図1</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200604&amp;DB=EPODOC&amp;CC=JP&amp;NR=2020085304A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200604&amp;DB=EPODOC&amp;CC=JP&amp;NR=2020085304A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJII SHIGETO</creatorcontrib><creatorcontrib>TSUCHIDE IKUHIRO</creatorcontrib><creatorcontrib>KAIBUCHI TOMOMI</creatorcontrib><title>HEAT PIPE</title><description>To provide a heat pipe that is improved in heat transport performance.SOLUTION: A heat pipe 10 includes: a container 14 in which working fluid 12 is encapsulated; and a wick structure 18 provided inside the container 14 and constituted of a hollow braided wire 16 that is formed by knitting fibers into a cylindrical shape. 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subjects BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
title HEAT PIPE
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