HEAT SINK

To fully exert a heat transfer function of a heat pipe to improve a cooling performance even when a size of a heating element is small.SOLUTION: A heat sink 1 comprises a heat receiving member 2 and first and second heat pipes 3 and 4. The first and second heat pipes 3 and 4 are laminated in an orde...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOGASHI KENGO, KONISHI KAZUHIRO, HAGIWARA TAKAYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!