COMPOSITION, SOLDER RESIST COMPOSITION, CURED PRODUCT AND METHOD FOR MANUFACTURING CURED PRODUCT

To provide a composition from which a cured film excellent in durability can be formed.SOLUTION: The composition comprises a compound represented by general formula (A) below and a curable component. In the formula, ring Arepresents a five-membered or six-membered hydrocarbon ring, a hetero ring, or the like; Rrepresents a halogen atom, cyano group, hydroxyl group, nitro group, carboxyl group, aliphatic group, aromatic hydrocarbon ring-containing group or a hetero ring-containing group; Rrepresents an aliphatic group, aromatic hydrocarbon ring-containing group, hetero ring-containing group or silyl group; a plurality of Rmay be bonded to form a benzene ring or a naphthalene ring; n represents an integer of 1 to 10; d represents an integer of 0 to 4; k represents an integer of 1 or more; the total of d and k is smaller than the number of substitutes which ring Acan have; and X represents a n-valent group.SELECTED DRAWING: None 【課題】耐久性に優れた硬化膜を形成可能な組成物を提供する。【解決手段】下記一般式（Ａ）で表される化合物と、硬化性成分と、を含む組成物。（式中、環Ａ１は、五員環又は六員環の炭化水素環及び複素環等を表し、Ｒ１０１は、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、脂肪族基、芳香族炭化水素環含有基又は複素環含有基を表し、Ｒ１０２は、脂肪族基、芳香族炭化水素環含有基、複素環含有基又はシリル基を表し、複数のＲ１０１同士は結合してベンゼン環又はナフタレン環を形成している場合があり、ｎは、１〜１０の整数を表し、ｄは、０〜４の整数を表し、ｋは、１以上の整数を表し、ｄ及びｋの合計は、環Ａ１が取り得る置換基の数より少なく、Ｘは、ｎ価の基を表す。）【選択図】なし