HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET AND HEAT INSULATION STRUCTURE BODY
To provide a high-frequency dielectric heating adhesive sheet capable of shortening a time for joining wood and a heat insulating material and improving workability during joining.SOLUTION: There is provided a high-frequency dielectric heating adhesive sheet 10 which contains a high-frequency dielec...
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| creator | TAYA NAOKI KAWARADA YUKI KAWADA TOMOHITO |
| description | To provide a high-frequency dielectric heating adhesive sheet capable of shortening a time for joining wood and a heat insulating material and improving workability during joining.SOLUTION: There is provided a high-frequency dielectric heating adhesive sheet 10 which contains a high-frequency dielectric adhesive layer and is used for joining wood 30 and a heat insulating material 20, wherein the high-frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B).SELECTED DRAWING: Figure 1
【課題】木材と断熱材とを接合するための時間を短縮でき、接合時の作業性も向上できる高周波誘電加熱接着シートを提供すること。【解決手段】高周波誘電接着剤層を含む高周波誘電加熱接着シート１０であって、前記高周波誘電接着剤層が、熱可塑性樹脂（Ａ）及び誘電フィラー（Ｂ）を含有し、木材３０と断熱材２０とを接合することに用いられる高周波誘電加熱接着シート１０。【選択図】図１ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2020070365A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2020070365A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2020070365A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQgOEuDqK-w-FeCC3qHJNr76SkmlwKnUqROIkW6vujiA_g9A__t8wCcU155fES0ZkeLGODRjwbINTCrgZtCQN3CIEQBbSz3wXsQmw-pHUQxEcj0SMcW9uvs8VtvM9p8-sq21YohvI0PYc0T-M1PdJrOJ0LVSh1UOV-p8u_0BtgSjBT</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET AND HEAT INSULATION STRUCTURE BODY</title><source>esp@cenet</source><creator>TAYA NAOKI ; KAWARADA YUKI ; KAWADA TOMOHITO</creator><creatorcontrib>TAYA NAOKI ; KAWARADA YUKI ; KAWADA TOMOHITO</creatorcontrib><description>To provide a high-frequency dielectric heating adhesive sheet capable of shortening a time for joining wood and a heat insulating material and improving workability during joining.SOLUTION: There is provided a high-frequency dielectric heating adhesive sheet 10 which contains a high-frequency dielectric adhesive layer and is used for joining wood 30 and a heat insulating material 20, wherein the high-frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B).SELECTED DRAWING: Figure 1
【課題】木材と断熱材とを接合するための時間を短縮でき、接合時の作業性も向上できる高周波誘電加熱接着シートを提供すること。【解決手段】高周波誘電接着剤層を含む高周波誘電加熱接着シート１０であって、前記高周波誘電接着剤層が、熱可塑性樹脂（Ａ）及び誘電フィラー（Ｂ）を含有し、木材３０と断熱材２０とを接合することに用いられる高周波誘電加熱接着シート１０。【選択図】図１</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200507&DB=EPODOC&CC=JP&NR=2020070365A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200507&DB=EPODOC&CC=JP&NR=2020070365A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAYA NAOKI</creatorcontrib><creatorcontrib>KAWARADA YUKI</creatorcontrib><creatorcontrib>KAWADA TOMOHITO</creatorcontrib><title>HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET AND HEAT INSULATION STRUCTURE BODY</title><description>To provide a high-frequency dielectric heating adhesive sheet capable of shortening a time for joining wood and a heat insulating material and improving workability during joining.SOLUTION: There is provided a high-frequency dielectric heating adhesive sheet 10 which contains a high-frequency dielectric adhesive layer and is used for joining wood 30 and a heat insulating material 20, wherein the high-frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B).SELECTED DRAWING: Figure 1
【課題】木材と断熱材とを接合するための時間を短縮でき、接合時の作業性も向上できる高周波誘電加熱接着シートを提供すること。【解決手段】高周波誘電接着剤層を含む高周波誘電加熱接着シート１０であって、前記高周波誘電接着剤層が、熱可塑性樹脂（Ａ）及び誘電フィラー（Ｂ）を含有し、木材３０と断熱材２０とを接合することに用いられる高周波誘電加熱接着シート１０。【選択図】図１</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEuDqK-w-FeCC3qHJNr76SkmlwKnUqROIkW6vujiA_g9A__t8wCcU155fES0ZkeLGODRjwbINTCrgZtCQN3CIEQBbSz3wXsQmw-pHUQxEcj0SMcW9uvs8VtvM9p8-sq21YohvI0PYc0T-M1PdJrOJ0LVSh1UOV-p8u_0BtgSjBT</recordid><startdate>20200507</startdate><enddate>20200507</enddate><creator>TAYA NAOKI</creator><creator>KAWARADA YUKI</creator><creator>KAWADA TOMOHITO</creator><scope>EVB</scope></search><sort><creationdate>20200507</creationdate><title>HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET AND HEAT INSULATION STRUCTURE BODY</title><author>TAYA NAOKI ; KAWARADA YUKI ; KAWADA TOMOHITO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020070365A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>TAYA NAOKI</creatorcontrib><creatorcontrib>KAWARADA YUKI</creatorcontrib><creatorcontrib>KAWADA TOMOHITO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAYA NAOKI</au><au>KAWARADA YUKI</au><au>KAWADA TOMOHITO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET AND HEAT INSULATION STRUCTURE BODY</title><date>2020-05-07</date><risdate>2020</risdate><abstract>To provide a high-frequency dielectric heating adhesive sheet capable of shortening a time for joining wood and a heat insulating material and improving workability during joining.SOLUTION: There is provided a high-frequency dielectric heating adhesive sheet 10 which contains a high-frequency dielectric adhesive layer and is used for joining wood 30 and a heat insulating material 20, wherein the high-frequency dielectric adhesive layer contains a thermoplastic resin (A) and a dielectric filler (B).SELECTED DRAWING: Figure 1
【課題】木材と断熱材とを接合するための時間を短縮でき、接合時の作業性も向上できる高周波誘電加熱接着シートを提供すること。【解決手段】高周波誘電接着剤層を含む高周波誘電加熱接着シート１０であって、前記高周波誘電接着剤層が、熱可塑性樹脂（Ａ）及び誘電フィラー（Ｂ）を含有し、木材３０と断熱材２０とを接合することに用いられる高周波誘電加熱接着シート１０。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; jpn |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET AND HEAT INSULATION STRUCTURE BODY |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T16%3A25%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAYA%20NAOKI&rft.date=2020-05-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2020070365A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |