RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE
To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multilayer printed board; a resin sheet provided with a subst...
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| creator | KUMAZAWA YUNE SUZUKI TAKUYA YOTSUYA SEIJI |
| description | To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multilayer printed board; a resin sheet provided with a substrate; and a multilayer printed board and a semiconductor device that employ them.SOLUTION: A resin composition contains a maleimide compound (A) represented by the general formula (1) in the figure, and a photocuring initiator (B) whose absorbance at the wavelength of 405 nm (h rays) is 0.1 or more. (In the formula (1), Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; nis a number equal to or greater than 1; and nis a number equal to or greater than 1.)SELECTED DRAWING: None
【課題】波長４０５ｎｍ（ｈ線）を含む活性エネルギー線で露光した場合に感光して、光硬化が可能であり、特に多層プリント配線板に用いた際に、光硬化性、耐熱性及び熱安定性に優れる樹脂組成物、支持体付き樹脂シート、それらを用いた多層プリント配線板、半導体装置の提供。【解決手段】本発明の樹脂組成物は、下記一般式（１）で表されるマレイミド化合物（Ａ）と、波長４０５ｎｍ（ｈ線）の吸光度が０．１以上である光硬化開始剤（Ｂ）と、を含有する。（式（１）中、Ｒaは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、Ｒbは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、ｎaの数は１以上であり、ｎbの数は１以上である。）【選択図】なし |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2020033472A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2020033472A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2020033472A3</originalsourceid><addsrcrecordid>eNqNyr0KwjAUQOEsDqK-w8U5QmgE55hc6ZXmh5tUcCpF4iRaqO-Pgz6A04GPsxTMmCmAjT7FTIVikPCl3CIWCb7vCnXmigyJKRR0cIyGnQQTHGT0ZGNwvS2RweGFLK7F4j4-5rr5dSW2Jyy23dXpNdR5Gm_1Wd_DOTWqUUrr_aEx-q_pAzKpL_Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>KUMAZAWA YUNE ; SUZUKI TAKUYA ; YOTSUYA SEIJI</creator><creatorcontrib>KUMAZAWA YUNE ; SUZUKI TAKUYA ; YOTSUYA SEIJI</creatorcontrib><description>To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multilayer printed board; a resin sheet provided with a substrate; and a multilayer printed board and a semiconductor device that employ them.SOLUTION: A resin composition contains a maleimide compound (A) represented by the general formula (1) in the figure, and a photocuring initiator (B) whose absorbance at the wavelength of 405 nm (h rays) is 0.1 or more. (In the formula (1), Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; nis a number equal to or greater than 1; and nis a number equal to or greater than 1.)SELECTED DRAWING: None
【課題】波長４０５ｎｍ（ｈ線）を含む活性エネルギー線で露光した場合に感光して、光硬化が可能であり、特に多層プリント配線板に用いた際に、光硬化性、耐熱性及び熱安定性に優れる樹脂組成物、支持体付き樹脂シート、それらを用いた多層プリント配線板、半導体装置の提供。【解決手段】本発明の樹脂組成物は、下記一般式（１）で表されるマレイミド化合物（Ａ）と、波長４０５ｎｍ（ｈ線）の吸光度が０．１以上である光硬化開始剤（Ｂ）と、を含有する。（式（１）中、Ｒaは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、Ｒbは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、ｎaの数は１以上であり、ｎbの数は１以上である。）【選択図】なし</description><language>eng ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200305&DB=EPODOC&CC=JP&NR=2020033472A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200305&DB=EPODOC&CC=JP&NR=2020033472A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUMAZAWA YUNE</creatorcontrib><creatorcontrib>SUZUKI TAKUYA</creatorcontrib><creatorcontrib>YOTSUYA SEIJI</creatorcontrib><title>RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE</title><description>To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multilayer printed board; a resin sheet provided with a substrate; and a multilayer printed board and a semiconductor device that employ them.SOLUTION: A resin composition contains a maleimide compound (A) represented by the general formula (1) in the figure, and a photocuring initiator (B) whose absorbance at the wavelength of 405 nm (h rays) is 0.1 or more. (In the formula (1), Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; nis a number equal to or greater than 1; and nis a number equal to or greater than 1.)SELECTED DRAWING: None
【課題】波長４０５ｎｍ（ｈ線）を含む活性エネルギー線で露光した場合に感光して、光硬化が可能であり、特に多層プリント配線板に用いた際に、光硬化性、耐熱性及び熱安定性に優れる樹脂組成物、支持体付き樹脂シート、それらを用いた多層プリント配線板、半導体装置の提供。【解決手段】本発明の樹脂組成物は、下記一般式（１）で表されるマレイミド化合物（Ａ）と、波長４０５ｎｍ（ｈ線）の吸光度が０．１以上である光硬化開始剤（Ｂ）と、を含有する。（式（１）中、Ｒaは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、Ｒbは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、ｎaの数は１以上であり、ｎbの数は１以上である。）【選択図】なし</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAUQOEsDqK-w8U5QmgE55hc6ZXmh5tUcCpF4iRaqO-Pgz6A04GPsxTMmCmAjT7FTIVikPCl3CIWCb7vCnXmigyJKRR0cIyGnQQTHGT0ZGNwvS2RweGFLK7F4j4-5rr5dSW2Jyy23dXpNdR5Gm_1Wd_DOTWqUUrr_aEx-q_pAzKpL_Y</recordid><startdate>20200305</startdate><enddate>20200305</enddate><creator>KUMAZAWA YUNE</creator><creator>SUZUKI TAKUYA</creator><creator>YOTSUYA SEIJI</creator><scope>EVB</scope></search><sort><creationdate>20200305</creationdate><title>RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE</title><author>KUMAZAWA YUNE ; SUZUKI TAKUYA ; YOTSUYA SEIJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020033472A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KUMAZAWA YUNE</creatorcontrib><creatorcontrib>SUZUKI TAKUYA</creatorcontrib><creatorcontrib>YOTSUYA SEIJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUMAZAWA YUNE</au><au>SUZUKI TAKUYA</au><au>YOTSUYA SEIJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE</title><date>2020-03-05</date><risdate>2020</risdate><abstract>To provide: a resin composition that can be photocured upon exposure to active energy rays including the wavelength of 405 nm (h rays) and is excellent in photocurability, heat resistance and thermal stability in particular when used in a multilayer printed board; a resin sheet provided with a substrate; and a multilayer printed board and a semiconductor device that employ them.SOLUTION: A resin composition contains a maleimide compound (A) represented by the general formula (1) in the figure, and a photocuring initiator (B) whose absorbance at the wavelength of 405 nm (h rays) is 0.1 or more. (In the formula (1), Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; Rrepresents a C1-16 linear or branched alkyl group or alkenyl group; nis a number equal to or greater than 1; and nis a number equal to or greater than 1.)SELECTED DRAWING: None
【課題】波長４０５ｎｍ（ｈ線）を含む活性エネルギー線で露光した場合に感光して、光硬化が可能であり、特に多層プリント配線板に用いた際に、光硬化性、耐熱性及び熱安定性に優れる樹脂組成物、支持体付き樹脂シート、それらを用いた多層プリント配線板、半導体装置の提供。【解決手段】本発明の樹脂組成物は、下記一般式（１）で表されるマレイミド化合物（Ａ）と、波長４０５ｎｍ（ｈ線）の吸光度が０．１以上である光硬化開始剤（Ｂ）と、を含有する。（式（１）中、Ｒaは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、Ｒbは、炭素数１〜１６の直鎖状若しくは分岐状のアルキル基、又はアルケニル基を表し、ｎaの数は１以上であり、ｎbの数は１以上である。）【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED BOARD, AND SEMICONDUCTOR DEVICE |
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