POLISHING SHEET
To provide a polishing sheet suitable for mirror surface polishing capable of obtaining a mirror surface having high quality, namely high in-plane homogeneity in specularity and less surface defects in a silicon bare wafer, glass, a compound semiconductor substrate, a hard disk substrate and the lik...
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| creator | SHIRO KUNIYASU TERADA KOHEI WADA MASAHARU |
| description | To provide a polishing sheet suitable for mirror surface polishing capable of obtaining a mirror surface having high quality, namely high in-plane homogeneity in specularity and less surface defects in a silicon bare wafer, glass, a compound semiconductor substrate, a hard disk substrate and the like.SOLUTION: In a polishing sheet having a soft porous layer at a front surface side,: the soft porous layer has a plurality of openings on a surface and teardrop-shaped pores from the openings to insides; a plurality of groove groups made of a plurality of grooves exist in the range of the soft porous layer surface of the polishing sheet being in contact with a polishing substrate polished with the polishing sheet during polishing; (a) a groove group A being one of the groove groups is a nearly linear groove existing on the imaginary line of an imaginary mesh formed from a regular triangle or a regular hexagonal and the nearly linear grooves belonging to the groove group A are mutually arranged so as not to cross each other; and (b) a groove group B being one of the other groove groups is made of a nearly linear groove arranged in a matrix.SELECTED DRAWING: None
【課題】シリコンベアウエハ、ガラス、化合物半導体基板およびハードディスク基板等においてより品質の高い鏡面、すなわち鏡面性の面内均一性が高く、欠陥が少ない鏡面を得られる、鏡面研磨に好適な研磨シートの提供。【解決手段】軟質多孔層を表側に有する研磨シートであって、前記軟質多孔層は表面に複数の開口部を有し、前記開口部から内部に涙滴状の孔を有し、前記研磨シートが研磨する被研磨基板が研磨中に接触する研磨シートの軟質多孔層表面の範囲内には複数の溝からなる溝群が複数存在しており、（ａ）その一つである溝群Ａは、正三角形または正六角形から形成される想像網目の想像線上に存在する略直線状の溝であって、溝群Ａに属する略直線状の溝どうしは互いに交差しない配置となっており、（ｂ）別の溝群の一つである溝群Ｂは、格子状に配置されている略直線状の溝からなることを特徴とする研磨シート。【選択図】なし |
| format | Patent |
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【課題】シリコンベアウエハ、ガラス、化合物半導体基板およびハードディスク基板等においてより品質の高い鏡面、すなわち鏡面性の面内均一性が高く、欠陥が少ない鏡面を得られる、鏡面研磨に好適な研磨シートの提供。【解決手段】軟質多孔層を表側に有する研磨シートであって、前記軟質多孔層は表面に複数の開口部を有し、前記開口部から内部に涙滴状の孔を有し、前記研磨シートが研磨する被研磨基板が研磨中に接触する研磨シートの軟質多孔層表面の範囲内には複数の溝からなる溝群が複数存在しており、（ａ）その一つである溝群Ａは、正三角形または正六角形から形成される想像網目の想像線上に存在する略直線状の溝であって、溝群Ａに属する略直線状の溝どうしは互いに交差しない配置となっており、（ｂ）別の溝群の一つである溝群Ｂは、格子状に配置されている略直線状の溝からなることを特徴とする研磨シート。【選択図】なし</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200305&DB=EPODOC&CC=JP&NR=2020032469A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200305&DB=EPODOC&CC=JP&NR=2020032469A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIRO KUNIYASU</creatorcontrib><creatorcontrib>TERADA KOHEI</creatorcontrib><creatorcontrib>WADA MASAHARU</creatorcontrib><title>POLISHING SHEET</title><description>To provide a polishing sheet suitable for mirror surface polishing capable of obtaining a mirror surface having high quality, namely high in-plane homogeneity in specularity and less surface defects in a silicon bare wafer, glass, a compound semiconductor substrate, a hard disk substrate and the like.SOLUTION: In a polishing sheet having a soft porous layer at a front surface side,: the soft porous layer has a plurality of openings on a surface and teardrop-shaped pores from the openings to insides; a plurality of groove groups made of a plurality of grooves exist in the range of the soft porous layer surface of the polishing sheet being in contact with a polishing substrate polished with the polishing sheet during polishing; (a) a groove group A being one of the groove groups is a nearly linear groove existing on the imaginary line of an imaginary mesh formed from a regular triangle or a regular hexagonal and the nearly linear grooves belonging to the groove group A are mutually arranged so as not to cross each other; and (b) a groove group B being one of the other groove groups is made of a nearly linear groove arranged in a matrix.SELECTED DRAWING: None
【課題】シリコンベアウエハ、ガラス、化合物半導体基板およびハードディスク基板等においてより品質の高い鏡面、すなわち鏡面性の面内均一性が高く、欠陥が少ない鏡面を得られる、鏡面研磨に好適な研磨シートの提供。【解決手段】軟質多孔層を表側に有する研磨シートであって、前記軟質多孔層は表面に複数の開口部を有し、前記開口部から内部に涙滴状の孔を有し、前記研磨シートが研磨する被研磨基板が研磨中に接触する研磨シートの軟質多孔層表面の範囲内には複数の溝からなる溝群が複数存在しており、（ａ）その一つである溝群Ａは、正三角形または正六角形から形成される想像網目の想像線上に存在する略直線状の溝であって、溝群Ａに属する略直線状の溝どうしは互いに交差しない配置となっており、（ｂ）別の溝群の一つである溝群Ｂは、格子状に配置されている略直線状の溝からなることを特徴とする研磨シート。【選択図】なし</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAP8PfxDPbw9HNXCPZwdQ3hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkYGBsZGJmaWjsZEKQIAIPcdqA</recordid><startdate>20200305</startdate><enddate>20200305</enddate><creator>SHIRO KUNIYASU</creator><creator>TERADA KOHEI</creator><creator>WADA MASAHARU</creator><scope>EVB</scope></search><sort><creationdate>20200305</creationdate><title>POLISHING SHEET</title><author>SHIRO KUNIYASU ; TERADA KOHEI ; WADA MASAHARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020032469A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIRO KUNIYASU</creatorcontrib><creatorcontrib>TERADA KOHEI</creatorcontrib><creatorcontrib>WADA MASAHARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIRO KUNIYASU</au><au>TERADA KOHEI</au><au>WADA MASAHARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING SHEET</title><date>2020-03-05</date><risdate>2020</risdate><abstract>To provide a polishing sheet suitable for mirror surface polishing capable of obtaining a mirror surface having high quality, namely high in-plane homogeneity in specularity and less surface defects in a silicon bare wafer, glass, a compound semiconductor substrate, a hard disk substrate and the like.SOLUTION: In a polishing sheet having a soft porous layer at a front surface side,: the soft porous layer has a plurality of openings on a surface and teardrop-shaped pores from the openings to insides; a plurality of groove groups made of a plurality of grooves exist in the range of the soft porous layer surface of the polishing sheet being in contact with a polishing substrate polished with the polishing sheet during polishing; (a) a groove group A being one of the groove groups is a nearly linear groove existing on the imaginary line of an imaginary mesh formed from a regular triangle or a regular hexagonal and the nearly linear grooves belonging to the groove group A are mutually arranged so as not to cross each other; and (b) a groove group B being one of the other groove groups is made of a nearly linear groove arranged in a matrix.SELECTED DRAWING: None
【課題】シリコンベアウエハ、ガラス、化合物半導体基板およびハードディスク基板等においてより品質の高い鏡面、すなわち鏡面性の面内均一性が高く、欠陥が少ない鏡面を得られる、鏡面研磨に好適な研磨シートの提供。【解決手段】軟質多孔層を表側に有する研磨シートであって、前記軟質多孔層は表面に複数の開口部を有し、前記開口部から内部に涙滴状の孔を有し、前記研磨シートが研磨する被研磨基板が研磨中に接触する研磨シートの軟質多孔層表面の範囲内には複数の溝からなる溝群が複数存在しており、（ａ）その一つである溝群Ａは、正三角形または正六角形から形成される想像網目の想像線上に存在する略直線状の溝であって、溝群Ａに属する略直線状の溝どうしは互いに交差しない配置となっており、（ｂ）別の溝群の一つである溝群Ｂは、格子状に配置されている略直線状の溝からなることを特徴とする研磨シート。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | POLISHING SHEET |
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