MANUFACTURING METHOD OF COMPONENT BUILT-IN SUBSTRATE

To uniformize a resin thickness in an inter-layer insulation layer on a core substrate.SOLUTION: A manufacturing method of an electron component built-in substrate, includes steps of: preparing a core substrate which has a first surface and a second surface opposite to the first surface, and is prov...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	IGAWA YUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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