MEMS MICROPHONE
To provide an MEMS microphone where noise reduction is achieved.SOLUTION: In an MEMS microphone 10, a substrate 20 is made of a glass. The glass substrate 20 has an insulation resistance higher than that of a semiconductor substrate such as a silicon substrate. The MEMS microphone 10 can reduce floa...
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| creator | UEJIMA SATOSHI OSANAI KATSUNORI IIJIMA ATSUSHI |
| description | To provide an MEMS microphone where noise reduction is achieved.SOLUTION: In an MEMS microphone 10, a substrate 20 is made of a glass. The glass substrate 20 has an insulation resistance higher than that of a semiconductor substrate such as a silicon substrate. The MEMS microphone 10 can reduce floating capacitance by using the glass substrate 20, and can suppress noise ascribable to the floating capacitance. Also, with the MEMS microphone 10, it is not required to provide an insulation thin film between the glass substrate 20 and a conductor layer. Further, with the MEMS microphone 10, potential adjustment becomes unnecessary through usage of the glass substrate 20, and signal processing at an ASIC, a circuit design and the like can be simplified as compared with a case where a silicon substrate is used.SELECTED DRAWING: Figure 2
【課題】ノイズの低減が図られたＭＥＭＳマイクロフォンを提供する。【解決手段】ＭＥＭＳマイクロフォン１０においては、基板２０がガラスで構成されている。ガラス基板２０は、シリコン基板等の半導体基板に比べて高い絶縁抵抗を有する。ＭＥＭＳマイクロフォン１０は、ガラス基板２０を用いることで浮遊容量を低減することができ、浮遊容量に起因するノイズを抑制することができる。また、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０と導体層との間に絶縁薄膜を設ける必要がない。さらに、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０を用いることで、上記の電位調整が不要となり、ＡＳＩＣでの信号処理や回路デザインなどがシリコン基板を用いた場合よりも簡素化することができる。【選択図】図２ |
| format | Patent |
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【課題】ノイズの低減が図られたＭＥＭＳマイクロフォンを提供する。【解決手段】ＭＥＭＳマイクロフォン１０においては、基板２０がガラスで構成されている。ガラス基板２０は、シリコン基板等の半導体基板に比べて高い絶縁抵抗を有する。ＭＥＭＳマイクロフォン１０は、ガラス基板２０を用いることで浮遊容量を低減することができ、浮遊容量に起因するノイズを抑制することができる。また、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０と導体層との間に絶縁薄膜を設ける必要がない。さらに、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０を用いることで、上記の電位調整が不要となり、ＡＳＩＣでの信号処理や回路デザインなどがシリコン基板を用いた場合よりも簡素化することができる。【選択図】図２</description><language>eng ; jpn</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PUBLIC ADDRESS SYSTEMS ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200206&DB=EPODOC&CC=JP&NR=2020022038A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200206&DB=EPODOC&CC=JP&NR=2020022038A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UEJIMA SATOSHI</creatorcontrib><creatorcontrib>OSANAI KATSUNORI</creatorcontrib><creatorcontrib>IIJIMA ATSUSHI</creatorcontrib><title>MEMS MICROPHONE</title><description>To provide an MEMS microphone where noise reduction is achieved.SOLUTION: In an MEMS microphone 10, a substrate 20 is made of a glass. The glass substrate 20 has an insulation resistance higher than that of a semiconductor substrate such as a silicon substrate. The MEMS microphone 10 can reduce floating capacitance by using the glass substrate 20, and can suppress noise ascribable to the floating capacitance. Also, with the MEMS microphone 10, it is not required to provide an insulation thin film between the glass substrate 20 and a conductor layer. Further, with the MEMS microphone 10, potential adjustment becomes unnecessary through usage of the glass substrate 20, and signal processing at an ASIC, a circuit design and the like can be simplified as compared with a case where a silicon substrate is used.SELECTED DRAWING: Figure 2
【課題】ノイズの低減が図られたＭＥＭＳマイクロフォンを提供する。【解決手段】ＭＥＭＳマイクロフォン１０においては、基板２０がガラスで構成されている。ガラス基板２０は、シリコン基板等の半導体基板に比べて高い絶縁抵抗を有する。ＭＥＭＳマイクロフォン１０は、ガラス基板２０を用いることで浮遊容量を低減することができ、浮遊容量に起因するノイズを抑制することができる。また、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０と導体層との間に絶縁薄膜を設ける必要がない。さらに、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０を用いることで、上記の電位調整が不要となり、ＡＳＩＣでの信号処理や回路デザインなどがシリコン基板を用いた場合よりも簡素化することができる。【選択図】図２</description><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD3dfUNVvD1dA7yD_Dw93PlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBkYGBkZGBsYWjsZEKQIAHkQdlg</recordid><startdate>20200206</startdate><enddate>20200206</enddate><creator>UEJIMA SATOSHI</creator><creator>OSANAI KATSUNORI</creator><creator>IIJIMA ATSUSHI</creator><scope>EVB</scope></search><sort><creationdate>20200206</creationdate><title>MEMS MICROPHONE</title><author>UEJIMA SATOSHI ; OSANAI KATSUNORI ; IIJIMA ATSUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2020022038A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2020</creationdate><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>UEJIMA SATOSHI</creatorcontrib><creatorcontrib>OSANAI KATSUNORI</creatorcontrib><creatorcontrib>IIJIMA ATSUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UEJIMA SATOSHI</au><au>OSANAI KATSUNORI</au><au>IIJIMA ATSUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MEMS MICROPHONE</title><date>2020-02-06</date><risdate>2020</risdate><abstract>To provide an MEMS microphone where noise reduction is achieved.SOLUTION: In an MEMS microphone 10, a substrate 20 is made of a glass. The glass substrate 20 has an insulation resistance higher than that of a semiconductor substrate such as a silicon substrate. The MEMS microphone 10 can reduce floating capacitance by using the glass substrate 20, and can suppress noise ascribable to the floating capacitance. Also, with the MEMS microphone 10, it is not required to provide an insulation thin film between the glass substrate 20 and a conductor layer. Further, with the MEMS microphone 10, potential adjustment becomes unnecessary through usage of the glass substrate 20, and signal processing at an ASIC, a circuit design and the like can be simplified as compared with a case where a silicon substrate is used.SELECTED DRAWING: Figure 2
【課題】ノイズの低減が図られたＭＥＭＳマイクロフォンを提供する。【解決手段】ＭＥＭＳマイクロフォン１０においては、基板２０がガラスで構成されている。ガラス基板２０は、シリコン基板等の半導体基板に比べて高い絶縁抵抗を有する。ＭＥＭＳマイクロフォン１０は、ガラス基板２０を用いることで浮遊容量を低減することができ、浮遊容量に起因するノイズを抑制することができる。また、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０と導体層との間に絶縁薄膜を設ける必要がない。さらに、ＭＥＭＳマイクロフォン１０によれば、ガラス基板２０を用いることで、上記の電位調整が不要となり、ＡＳＩＣでの信号処理や回路デザインなどがシリコン基板を用いた場合よりも簡素化することができる。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PUBLIC ADDRESS SYSTEMS TRANSPORTING |
| title | MEMS MICROPHONE |
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