MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT AND SHEET EXPANSION DEVICE

To provide a technique capable of favorably expanding an adhesive sheet on which a plurality of laminated chips are arranged in a manufacturing method of a laminated ceramic electronic component.SOLUTION: In a manufacturing method of laminated ceramic electronic components, a sheet extention device...

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SUZUKI SATOSHI
description To provide a technique capable of favorably expanding an adhesive sheet on which a plurality of laminated chips are arranged in a manufacturing method of a laminated ceramic electronic component.SOLUTION: In a manufacturing method of laminated ceramic electronic components, a sheet extention device 200 includes a plurality of ceramic layers stacked in one axial direction, a plurality of internal electrodes located between the plurality of ceramic layers, and a pair of side surfaces that are opposed to each other in a second axis direction orthogonal to the first axis and that expose the plurality of internal electrodes, and a plurality of laminated chips 116 arranged on the first main surface M1 of an adhesive sheet E having first and second main surfaces orthogonal to the first axis are prepared. An array area where the plurality of laminated chips are arranged is expanded by swelling the adhesive sheet toward the first main surface while holding a holding area surrounding the entire array area of the adhesive sheet.SELECTED DRAWING: Figure 20 【課題】積層セラミック電子部品の製造方法において複数の積層チップが配列された粘着シートを良好に拡張可能な技術を提供する。【解決手段】積層セラミック電子部品の製造方法では、シート拡張装置200において、第1軸方向に積層された複数のセラミック層と、複数のセラミック層の間に位置する複数の内部電極と、第1軸と直交する第2軸方向に相互に対向し、複数の内部電極が露出する一対の側面と、を有し、第1軸と直交する第1及び第2主面を有する粘着シートEの第1主面M1に配列された複数の積層チップ116が用意される。粘着シートにおける複数の積層チップが配列された配列エリアの外側を全周にわたって囲む保持エリアを保持した状態で、粘着シートを第1主面側に膨出させることにより、配列エリアが拡張される。【選択図】図20
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subjects BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
ELECTRICITY
title MANUFACTURING METHOD OF LAMINATED CERAMIC ELECTRONIC COMPONENT AND SHEET EXPANSION DEVICE
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