PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

To provide a package substrate having a structure suitable for realizing the mounting space (cavity) of a relatively deep chip, and to provide a manufacturing method thereof.SOLUTION: A package substrate comprises: a support member having first and second faces located oppositely, containing a cavit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KO YOUNG-KUK, OH YOONG, KIM SANG HUN, KIM GYU MOOK
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!