PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
To provide a printed wiring board improved in flatness thereof and a method of manufacturing the same.SOLUTION: In a wiring substrate 20 of a printed wiring board 1, wiring 40 and a conductor post 30 including a wiring part 32 are embedded in an insulating resin film 22. Therefore, the thickness of...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TAJIMA MORIKAZU KARIYA TAKASHI MORITA TAKAAKI |
| description | To provide a printed wiring board improved in flatness thereof and a method of manufacturing the same.SOLUTION: In a wiring substrate 20 of a printed wiring board 1, wiring 40 and a conductor post 30 including a wiring part 32 are embedded in an insulating resin film 22. Therefore, the thickness of the wiring substrate 20 is not increased even in a region where the wiring part 32 is formed. In addition, even in a region where the wiring 40 is formed, the thickness of the wiring substrate 20 is not increased. Accordingly, the printed wiring board 1 having high flatness can be obtained by stacking a plurality of wiring substrates 20 to constitute the printed wiring board 1.SELECTED DRAWING: Figure 2
【課題】平坦性の向上が図られたプリント配線板およびその製造方法を提供する。【解決手段】プリント配線板１の配線基体２０においては、配線部３２を含む導体ポスト３０および配線４０が絶縁樹脂フィルム２２に埋設されている。そのため、配線部３２が形成された領域においても、配線基体２０の厚さが増加していない。また、配線４０が形成された領域においても、配線基体２０の厚さが増加していない。したがって、配線基体２０を複数積層してプリント配線板１を構成することで、高い平坦性を有するプリント配線板１を得ることができる。【選択図】図２ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2019207928A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2019207928A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2019207928A3</originalsourceid><addsrcrecordid>eNrjZLAMCPL0C3F1UQj3BDLcFZz8HYNcFBz9XBR8XUM8_F0U_N0UfB39Qt0cnUNCwSpCPFwVgh19XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBoaWRgbmlkYWjMVGKAL5zKPY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>TAJIMA MORIKAZU ; KARIYA TAKASHI ; MORITA TAKAAKI</creator><creatorcontrib>TAJIMA MORIKAZU ; KARIYA TAKASHI ; MORITA TAKAAKI</creatorcontrib><description>To provide a printed wiring board improved in flatness thereof and a method of manufacturing the same.SOLUTION: In a wiring substrate 20 of a printed wiring board 1, wiring 40 and a conductor post 30 including a wiring part 32 are embedded in an insulating resin film 22. Therefore, the thickness of the wiring substrate 20 is not increased even in a region where the wiring part 32 is formed. In addition, even in a region where the wiring 40 is formed, the thickness of the wiring substrate 20 is not increased. Accordingly, the printed wiring board 1 having high flatness can be obtained by stacking a plurality of wiring substrates 20 to constitute the printed wiring board 1.SELECTED DRAWING: Figure 2
【課題】平坦性の向上が図られたプリント配線板およびその製造方法を提供する。【解決手段】プリント配線板１の配線基体２０においては、配線部３２を含む導体ポスト３０および配線４０が絶縁樹脂フィルム２２に埋設されている。そのため、配線部３２が形成された領域においても、配線基体２０の厚さが増加していない。また、配線４０が形成された領域においても、配線基体２０の厚さが増加していない。したがって、配線基体２０を複数積層してプリント配線板１を構成することで、高い平坦性を有するプリント配線板１を得ることができる。【選択図】図２</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191205&DB=EPODOC&CC=JP&NR=2019207928A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191205&DB=EPODOC&CC=JP&NR=2019207928A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAJIMA MORIKAZU</creatorcontrib><creatorcontrib>KARIYA TAKASHI</creatorcontrib><creatorcontrib>MORITA TAKAAKI</creatorcontrib><title>PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME</title><description>To provide a printed wiring board improved in flatness thereof and a method of manufacturing the same.SOLUTION: In a wiring substrate 20 of a printed wiring board 1, wiring 40 and a conductor post 30 including a wiring part 32 are embedded in an insulating resin film 22. Therefore, the thickness of the wiring substrate 20 is not increased even in a region where the wiring part 32 is formed. In addition, even in a region where the wiring 40 is formed, the thickness of the wiring substrate 20 is not increased. Accordingly, the printed wiring board 1 having high flatness can be obtained by stacking a plurality of wiring substrates 20 to constitute the printed wiring board 1.SELECTED DRAWING: Figure 2
【課題】平坦性の向上が図られたプリント配線板およびその製造方法を提供する。【解決手段】プリント配線板１の配線基体２０においては、配線部３２を含む導体ポスト３０および配線４０が絶縁樹脂フィルム２２に埋設されている。そのため、配線部３２が形成された領域においても、配線基体２０の厚さが増加していない。また、配線４０が形成された領域においても、配線基体２０の厚さが増加していない。したがって、配線基体２０を複数積層してプリント配線板１を構成することで、高い平坦性を有するプリント配線板１を得ることができる。【選択図】図２</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAMCPL0C3F1UQj3BDLcFZz8HYNcFBz9XBR8XUM8_F0U_N0UfB39Qt0cnUNCwSpCPFwVgh19XXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBoaWRgbmlkYWjMVGKAL5zKPY</recordid><startdate>20191205</startdate><enddate>20191205</enddate><creator>TAJIMA MORIKAZU</creator><creator>KARIYA TAKASHI</creator><creator>MORITA TAKAAKI</creator><scope>EVB</scope></search><sort><creationdate>20191205</creationdate><title>PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME</title><author>TAJIMA MORIKAZU ; KARIYA TAKASHI ; MORITA TAKAAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019207928A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAJIMA MORIKAZU</creatorcontrib><creatorcontrib>KARIYA TAKASHI</creatorcontrib><creatorcontrib>MORITA TAKAAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAJIMA MORIKAZU</au><au>KARIYA TAKASHI</au><au>MORITA TAKAAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME</title><date>2019-12-05</date><risdate>2019</risdate><abstract>To provide a printed wiring board improved in flatness thereof and a method of manufacturing the same.SOLUTION: In a wiring substrate 20 of a printed wiring board 1, wiring 40 and a conductor post 30 including a wiring part 32 are embedded in an insulating resin film 22. Therefore, the thickness of the wiring substrate 20 is not increased even in a region where the wiring part 32 is formed. In addition, even in a region where the wiring 40 is formed, the thickness of the wiring substrate 20 is not increased. Accordingly, the printed wiring board 1 having high flatness can be obtained by stacking a plurality of wiring substrates 20 to constitute the printed wiring board 1.SELECTED DRAWING: Figure 2
【課題】平坦性の向上が図られたプリント配線板およびその製造方法を提供する。【解決手段】プリント配線板１の配線基体２０においては、配線部３２を含む導体ポスト３０および配線４０が絶縁樹脂フィルム２２に埋設されている。そのため、配線部３２が形成された領域においても、配線基体２０の厚さが増加していない。また、配線４０が形成された領域においても、配線基体２０の厚さが増加していない。したがって、配線基体２０を複数積層してプリント配線板１を構成することで、高い平坦性を有するプリント配線板１を得ることができる。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2019207928A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T15%3A49%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAJIMA%20MORIKAZU&rft.date=2019-12-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2019207928A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |