COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
To provide a component mounting device or the like, capable of notifying a state of a light emission part.SOLUTION: A component mounting device 1 crimping a component 3 to an optical transparency substrate 2 on which the component 3 is mounted via an optical modified resin material 4, comprises: a s...
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| creator | TSUJIKAWA TOSHIHIKO YAMADA AKIRA TSUBOI YASUTAKA |
| description | To provide a component mounting device or the like, capable of notifying a state of a light emission part.SOLUTION: A component mounting device 1 crimping a component 3 to an optical transparency substrate 2 on which the component 3 is mounted via an optical modified resin material 4, comprises: a support part 13 that supports a surface positioned at the side opposite to the component 3 in the substrate 2; a pressuring device 22 that presses the component 3 to the substrate 2 supported by the support part 13; an irradiation device 15a that irradiates a light to the optical modified resin material 4; a clock part 32 that measures a light irradiation time; and a control part 30a that detects that a cumulative irradiation time of the irradiation time exceeds a threshold value, and notifies a detection result.SELECTED DRAWING: Figure 4
【課題】発光部の状態を通知することを可能にする部品実装装置等を提供する。【解決手段】光変性樹脂材４を介して部品３が載置された光透過性の基板２に部品３を圧着する部品実装装置１は、基板２における部品３と反対側に位置する面を支持する支持部１３と、支持部１３により支持された基板２に部品３を押圧する押圧装置２２と、光変性樹脂材４に光を照射する照射器１５ａと、光の照射時間を計測する計時部３２と、照射時間の累積照射時間が閾値を超えたことを検出し、検出結果を通知する制御部３０ａとを備える。【選択図】図４ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2019201137A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2019201137A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2019201137A3</originalsourceid><addsrcrecordid>eNrjZDB39vcN8Pdz9QtR8PUP9Qvx9HNXcHEN83R2VXD0c1HAIuvrGuLh78LDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDC2B2NDY3NGYKEUApvYo0g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD</title><source>esp@cenet</source><creator>TSUJIKAWA TOSHIHIKO ; YAMADA AKIRA ; TSUBOI YASUTAKA</creator><creatorcontrib>TSUJIKAWA TOSHIHIKO ; YAMADA AKIRA ; TSUBOI YASUTAKA</creatorcontrib><description>To provide a component mounting device or the like, capable of notifying a state of a light emission part.SOLUTION: A component mounting device 1 crimping a component 3 to an optical transparency substrate 2 on which the component 3 is mounted via an optical modified resin material 4, comprises: a support part 13 that supports a surface positioned at the side opposite to the component 3 in the substrate 2; a pressuring device 22 that presses the component 3 to the substrate 2 supported by the support part 13; an irradiation device 15a that irradiates a light to the optical modified resin material 4; a clock part 32 that measures a light irradiation time; and a control part 30a that detects that a cumulative irradiation time of the irradiation time exceeds a threshold value, and notifies a detection result.SELECTED DRAWING: Figure 4
【課題】発光部の状態を通知することを可能にする部品実装装置等を提供する。【解決手段】光変性樹脂材４を介して部品３が載置された光透過性の基板２に部品３を圧着する部品実装装置１は、基板２における部品３と反対側に位置する面を支持する支持部１３と、支持部１３により支持された基板２に部品３を押圧する押圧装置２２と、光変性樹脂材４に光を照射する照射器１５ａと、光の照射時間を計測する計時部３２と、照射時間の累積照射時間が閾値を超えたことを検出し、検出結果を通知する制御部３０ａとを備える。【選択図】図４</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191121&DB=EPODOC&CC=JP&NR=2019201137A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191121&DB=EPODOC&CC=JP&NR=2019201137A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUJIKAWA TOSHIHIKO</creatorcontrib><creatorcontrib>YAMADA AKIRA</creatorcontrib><creatorcontrib>TSUBOI YASUTAKA</creatorcontrib><title>COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD</title><description>To provide a component mounting device or the like, capable of notifying a state of a light emission part.SOLUTION: A component mounting device 1 crimping a component 3 to an optical transparency substrate 2 on which the component 3 is mounted via an optical modified resin material 4, comprises: a support part 13 that supports a surface positioned at the side opposite to the component 3 in the substrate 2; a pressuring device 22 that presses the component 3 to the substrate 2 supported by the support part 13; an irradiation device 15a that irradiates a light to the optical modified resin material 4; a clock part 32 that measures a light irradiation time; and a control part 30a that detects that a cumulative irradiation time of the irradiation time exceeds a threshold value, and notifies a detection result.SELECTED DRAWING: Figure 4
【課題】発光部の状態を通知することを可能にする部品実装装置等を提供する。【解決手段】光変性樹脂材４を介して部品３が載置された光透過性の基板２に部品３を圧着する部品実装装置１は、基板２における部品３と反対側に位置する面を支持する支持部１３と、支持部１３により支持された基板２に部品３を押圧する押圧装置２２と、光変性樹脂材４に光を照射する照射器１５ａと、光の照射時間を計測する計時部３２と、照射時間の累積照射時間が閾値を超えたことを検出し、検出結果を通知する制御部３０ａとを備える。【選択図】図４</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB39vcN8Pdz9QtR8PUP9Qvx9HNXcHEN83R2VXD0c1HAIuvrGuLh78LDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDC2B2NDY3NGYKEUApvYo0g</recordid><startdate>20191121</startdate><enddate>20191121</enddate><creator>TSUJIKAWA TOSHIHIKO</creator><creator>YAMADA AKIRA</creator><creator>TSUBOI YASUTAKA</creator><scope>EVB</scope></search><sort><creationdate>20191121</creationdate><title>COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD</title><author>TSUJIKAWA TOSHIHIKO ; YAMADA AKIRA ; TSUBOI YASUTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019201137A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUJIKAWA TOSHIHIKO</creatorcontrib><creatorcontrib>YAMADA AKIRA</creatorcontrib><creatorcontrib>TSUBOI YASUTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUJIKAWA TOSHIHIKO</au><au>YAMADA AKIRA</au><au>TSUBOI YASUTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD</title><date>2019-11-21</date><risdate>2019</risdate><abstract>To provide a component mounting device or the like, capable of notifying a state of a light emission part.SOLUTION: A component mounting device 1 crimping a component 3 to an optical transparency substrate 2 on which the component 3 is mounted via an optical modified resin material 4, comprises: a support part 13 that supports a surface positioned at the side opposite to the component 3 in the substrate 2; a pressuring device 22 that presses the component 3 to the substrate 2 supported by the support part 13; an irradiation device 15a that irradiates a light to the optical modified resin material 4; a clock part 32 that measures a light irradiation time; and a control part 30a that detects that a cumulative irradiation time of the irradiation time exceeds a threshold value, and notifies a detection result.SELECTED DRAWING: Figure 4
【課題】発光部の状態を通知することを可能にする部品実装装置等を提供する。【解決手段】光変性樹脂材４を介して部品３が載置された光透過性の基板２に部品３を圧着する部品実装装置１は、基板２における部品３と反対側に位置する面を支持する支持部１３と、支持部１３により支持された基板２に部品３を押圧する押圧装置２２と、光変性樹脂材４に光を照射する照射器１５ａと、光の照射時間を計測する計時部３２と、照射時間の累積照射時間が閾値を超えたことを検出し、検出結果を通知する制御部３０ａとを備える。【選択図】図４</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD |
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