CONFORMAL IC DEVICES

CONFORMAL IC DEVICES

To provide encapsulated conformal electronic devices.SOLUTION: A conformal integrated circuit (IC) device has a housing 1300 including: a flexible substrate; electronic circuitry attached to the flexible substrate; and a flexible polymeric encapsulation layer attached to the flexible substrate, wher...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NICHOLAS MCMAHON, WANG XIANYAN, DAVID G GARLOCK, BRYAN D KEEN, BRIAN ELOLAMPI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:To provide encapsulated conformal electronic devices.SOLUTION: A conformal integrated circuit (IC) device has a housing 1300 including: a flexible substrate; electronic circuitry attached to the flexible substrate; and a flexible polymeric encapsulation layer attached to the flexible substrate, where the flexible polymeric encapsulation layer forms partially hollow, vaulted compartments 1302-1305 and encloses at least part of the electronic circuitry between the flexible substrate and the vaulted compartments 1302-1305 of the encapsulation layer.SELECTED DRAWING: Figure 13A 【課題】封入型コンフォーマル電子デバイスを提示する。【解決手段】コンフォーマル集積回路（ＩＣ）デバイスは、可撓な基板と、可撓な基板に装着された電子回路と、可撓な基板に装着された可撓なポリマーの封入層であって、可撓なポリマーの封入層は部分的に中空のアーチ形の区画室１３０２〜１３０５を形成しており、電子回路の少なくとも一部を、可撓な基板と封入層のアーチ形の区画室１３０２〜１３０５との間に包み込んでいる可撓なポリマーの封入層とを含むハウジング１３００を有する。【選択図】図１３Ａ