ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
To hinder variation in joining strength of solder.SOLUTION: A first member 10 is prepared, which has a first insulation film 41 on a surface 10a side and also has a first solder 31 disposed in a first opening 41a of the first insulation film 41. A second member 20 is prepared, which has a second ins...
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| creator | MIZUTANI KOJI INAGAKI YUUKI ASAMI KAZUSHI OHARA YUKI |
| description | To hinder variation in joining strength of solder.SOLUTION: A first member 10 is prepared, which has a first insulation film 41 on a surface 10a side and also has a first solder 31 disposed in a first opening 41a of the first insulation film 41. A second member 20 is prepared, which has a second insulation film 42 on a surface 20a side and also has a second solder 32 disposed in a second opening 42a of the second insulation film 42. Then, after the first insulation film 41 of the first member 10 and the second insulation film 42 of the second member 20 are joined, the first solder 31 and the second solder 32 are fused by application of heat, thereby providing a fused solder 30a. Thereafter, the first member 10 and the second member 20 are cooled from one direction of a layering direction of these members, thereby solidifying the fused solder 30a from the one direction and forming a monocrystal solder 30.SELECTED DRAWING: Figure 2E
【課題】はんだの接続強度がばらつくことを抑制する。【解決手段】一面１０ａ側に第１絶縁膜４１が形成され、第１絶縁膜４１の第１開口部４１ａに第１はんだ３１が配置された第１部材１０を用意する。一面２０ａ側に第２絶縁膜４２が形成され、第２絶縁膜４２の第２開口部４２ａに第２はんだ３２が配置された第２部材２０を用意する。そして、第１部材１０の第１絶縁膜４１と第２部材２０の第２絶縁膜４２とを接合した後、加熱して第１はんだ３１および第２はんだ３２を溶融して溶融はんだ３０ａを構成する。その後、第１部材１０と第２部材２０との積層方向における一方向側から冷却することにより、溶融はんだ３０ａを一方向側から固化して単結晶とされたはんだ３０を形成する。【選択図】図２Ｅ |
| format | Patent |
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【課題】はんだの接続強度がばらつくことを抑制する。【解決手段】一面１０ａ側に第１絶縁膜４１が形成され、第１絶縁膜４１の第１開口部４１ａに第１はんだ３１が配置された第１部材１０を用意する。一面２０ａ側に第２絶縁膜４２が形成され、第２絶縁膜４２の第２開口部４２ａに第２はんだ３２が配置された第２部材２０を用意する。そして、第１部材１０の第１絶縁膜４１と第２部材２０の第２絶縁膜４２とを接合した後、加熱して第１はんだ３１および第２はんだ３２を溶融して溶融はんだ３０ａを構成する。その後、第１部材１０と第２部材２０との積層方向における一方向側から冷却することにより、溶融はんだ３０ａを一方向側から固化して単結晶とされたはんだ３０を形成する。【選択図】図２Ｅ</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191024&DB=EPODOC&CC=JP&NR=2019186499A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191024&DB=EPODOC&CC=JP&NR=2019186499A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIZUTANI KOJI</creatorcontrib><creatorcontrib>INAGAKI YUUKI</creatorcontrib><creatorcontrib>ASAMI KAZUSHI</creatorcontrib><creatorcontrib>OHARA YUKI</creatorcontrib><title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR</title><description>To hinder variation in joining strength of solder.SOLUTION: A first member 10 is prepared, which has a first insulation film 41 on a surface 10a side and also has a first solder 31 disposed in a first opening 41a of the first insulation film 41. A second member 20 is prepared, which has a second insulation film 42 on a surface 20a side and also has a second solder 32 disposed in a second opening 42a of the second insulation film 42. Then, after the first insulation film 41 of the first member 10 and the second insulation film 42 of the second member 20 are joined, the first solder 31 and the second solder 32 are fused by application of heat, thereby providing a fused solder 30a. Thereafter, the first member 10 and the second member 20 are cooled from one direction of a layering direction of these members, thereby solidifying the fused solder 30a from the one direction and forming a monocrystal solder 30.SELECTED DRAWING: Figure 2E
【課題】はんだの接続強度がばらつくことを抑制する。【解決手段】一面１０ａ側に第１絶縁膜４１が形成され、第１絶縁膜４１の第１開口部４１ａに第１はんだ３１が配置された第１部材１０を用意する。一面２０ａ側に第２絶縁膜４２が形成され、第２絶縁膜４２の第２開口部４２ａに第２はんだ３２が配置された第２部材２０を用意する。そして、第１部材１０の第１絶縁膜４１と第２部材２０の第２絶縁膜４２とを接合した後、加熱して第１はんだ３１および第２はんだ３２を溶融して溶融はんだ３０ａを構成する。その後、第１部材１０と第２部材２０との積層方向における一方向側から冷却することにより、溶融はんだ３０ａを一方向側から固化して単結晶とされたはんだ３０を形成する。【選択図】図２Ｅ</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB29XF1Dgny9_N0VnBxDfN0dlVw9HNR8HX0C3VzdA4JDfL0c1fwdQ3x8HdRCPFwDXJ18w_iYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaWhhZmJpaWjsZEKQIA7pwnrw</recordid><startdate>20191024</startdate><enddate>20191024</enddate><creator>MIZUTANI KOJI</creator><creator>INAGAKI YUUKI</creator><creator>ASAMI KAZUSHI</creator><creator>OHARA YUKI</creator><scope>EVB</scope></search><sort><creationdate>20191024</creationdate><title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR</title><author>MIZUTANI KOJI ; INAGAKI YUUKI ; ASAMI KAZUSHI ; OHARA YUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019186499A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MIZUTANI KOJI</creatorcontrib><creatorcontrib>INAGAKI YUUKI</creatorcontrib><creatorcontrib>ASAMI KAZUSHI</creatorcontrib><creatorcontrib>OHARA YUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIZUTANI KOJI</au><au>INAGAKI YUUKI</au><au>ASAMI KAZUSHI</au><au>OHARA YUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR</title><date>2019-10-24</date><risdate>2019</risdate><abstract>To hinder variation in joining strength of solder.SOLUTION: A first member 10 is prepared, which has a first insulation film 41 on a surface 10a side and also has a first solder 31 disposed in a first opening 41a of the first insulation film 41. A second member 20 is prepared, which has a second insulation film 42 on a surface 20a side and also has a second solder 32 disposed in a second opening 42a of the second insulation film 42. Then, after the first insulation film 41 of the first member 10 and the second insulation film 42 of the second member 20 are joined, the first solder 31 and the second solder 32 are fused by application of heat, thereby providing a fused solder 30a. Thereafter, the first member 10 and the second member 20 are cooled from one direction of a layering direction of these members, thereby solidifying the fused solder 30a from the one direction and forming a monocrystal solder 30.SELECTED DRAWING: Figure 2E
【課題】はんだの接続強度がばらつくことを抑制する。【解決手段】一面１０ａ側に第１絶縁膜４１が形成され、第１絶縁膜４１の第１開口部４１ａに第１はんだ３１が配置された第１部材１０を用意する。一面２０ａ側に第２絶縁膜４２が形成され、第２絶縁膜４２の第２開口部４２ａに第２はんだ３２が配置された第２部材２０を用意する。そして、第１部材１０の第１絶縁膜４１と第２部材２０の第２絶縁膜４２とを接合した後、加熱して第１はんだ３１および第２はんだ３２を溶融して溶融はんだ３０ａを構成する。その後、第１部材１０と第２部材２０との積層方向における一方向側から冷却することにより、溶融はんだ３０ａを一方向側から固化して単結晶とされたはんだ３０を形成する。【選択図】図２Ｅ</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR |
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