PLATING JIG FOR RESIN MOLDED BODY AND PLATING METHOD FOR MOLDED BODY USING THE JIG
To provide a plating jig which is free from plating deposition on the jig itself and does not require replacement of a plating jig for plating a resin molded body.SOLUTION: The jig for plating a resin molded body and the method for plating a resin molded body using the jig are characterized in that...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ISHIZUKA HIROSHI KURAMOCHI YASUYUKI IZUMIYA MIYOKO |
| description | To provide a plating jig which is free from plating deposition on the jig itself and does not require replacement of a plating jig for plating a resin molded body.SOLUTION: The jig for plating a resin molded body and the method for plating a resin molded body using the jig are characterized in that a plasticizer is coated on the surface of the plating jig having an insulating coating part.SELECTED DRAWING: None
【課題】樹脂成形体のめっきにおいて、治具自体へのめっき析出がなく、めっき治具の交換も必要のない、めっき治具を提供する。【解決手段】絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆したことを特徴とする樹脂成形体めっき用治具およびこれを用いた樹脂成形体のめっき方法。【選択図】なし |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2019183260A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2019183260A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2019183260A3</originalsourceid><addsrcrecordid>eNrjZAgK8HEM8fRzV_DydFdw8w9SCHIN9vRT8PX3cXF1UXDyd4lUcPRzUYCp8nUN8fB3AStEVhIaDJIM8XAFGcPDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDC0NLYyNzAwcjYlSBADTeC9P</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PLATING JIG FOR RESIN MOLDED BODY AND PLATING METHOD FOR MOLDED BODY USING THE JIG</title><source>esp@cenet</source><creator>ISHIZUKA HIROSHI ; KURAMOCHI YASUYUKI ; IZUMIYA MIYOKO</creator><creatorcontrib>ISHIZUKA HIROSHI ; KURAMOCHI YASUYUKI ; IZUMIYA MIYOKO</creatorcontrib><description>To provide a plating jig which is free from plating deposition on the jig itself and does not require replacement of a plating jig for plating a resin molded body.SOLUTION: The jig for plating a resin molded body and the method for plating a resin molded body using the jig are characterized in that a plasticizer is coated on the surface of the plating jig having an insulating coating part.SELECTED DRAWING: None
【課題】樹脂成形体のめっきにおいて、治具自体へのめっき析出がなく、めっき治具の交換も必要のない、めっき治具を提供する。【解決手段】絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆したことを特徴とする樹脂成形体めっき用治具およびこれを用いた樹脂成形体のめっき方法。【選択図】なし</description><language>eng ; jpn</language><subject>APPARATUS THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191024&DB=EPODOC&CC=JP&NR=2019183260A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191024&DB=EPODOC&CC=JP&NR=2019183260A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISHIZUKA HIROSHI</creatorcontrib><creatorcontrib>KURAMOCHI YASUYUKI</creatorcontrib><creatorcontrib>IZUMIYA MIYOKO</creatorcontrib><title>PLATING JIG FOR RESIN MOLDED BODY AND PLATING METHOD FOR MOLDED BODY USING THE JIG</title><description>To provide a plating jig which is free from plating deposition on the jig itself and does not require replacement of a plating jig for plating a resin molded body.SOLUTION: The jig for plating a resin molded body and the method for plating a resin molded body using the jig are characterized in that a plasticizer is coated on the surface of the plating jig having an insulating coating part.SELECTED DRAWING: None
【課題】樹脂成形体のめっきにおいて、治具自体へのめっき析出がなく、めっき治具の交換も必要のない、めっき治具を提供する。【解決手段】絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆したことを特徴とする樹脂成形体めっき用治具およびこれを用いた樹脂成形体のめっき方法。【選択図】なし</description><subject>APPARATUS THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgK8HEM8fRzV_DydFdw8w9SCHIN9vRT8PX3cXF1UXDyd4lUcPRzUYCp8nUN8fB3AStEVhIaDJIM8XAFGcPDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDC0NLYyNzAwcjYlSBADTeC9P</recordid><startdate>20191024</startdate><enddate>20191024</enddate><creator>ISHIZUKA HIROSHI</creator><creator>KURAMOCHI YASUYUKI</creator><creator>IZUMIYA MIYOKO</creator><scope>EVB</scope></search><sort><creationdate>20191024</creationdate><title>PLATING JIG FOR RESIN MOLDED BODY AND PLATING METHOD FOR MOLDED BODY USING THE JIG</title><author>ISHIZUKA HIROSHI ; KURAMOCHI YASUYUKI ; IZUMIYA MIYOKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019183260A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>ISHIZUKA HIROSHI</creatorcontrib><creatorcontrib>KURAMOCHI YASUYUKI</creatorcontrib><creatorcontrib>IZUMIYA MIYOKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ISHIZUKA HIROSHI</au><au>KURAMOCHI YASUYUKI</au><au>IZUMIYA MIYOKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLATING JIG FOR RESIN MOLDED BODY AND PLATING METHOD FOR MOLDED BODY USING THE JIG</title><date>2019-10-24</date><risdate>2019</risdate><abstract>To provide a plating jig which is free from plating deposition on the jig itself and does not require replacement of a plating jig for plating a resin molded body.SOLUTION: The jig for plating a resin molded body and the method for plating a resin molded body using the jig are characterized in that a plasticizer is coated on the surface of the plating jig having an insulating coating part.SELECTED DRAWING: None
【課題】樹脂成形体のめっきにおいて、治具自体へのめっき析出がなく、めっき治具の交換も必要のない、めっき治具を提供する。【解決手段】絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆したことを特徴とする樹脂成形体めっき用治具およびこれを用いた樹脂成形体のめっき方法。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; jpn |
| recordid | cdi_epo_espacenet_JP2019183260A |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | PLATING JIG FOR RESIN MOLDED BODY AND PLATING METHOD FOR MOLDED BODY USING THE JIG |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T10%3A01%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ISHIZUKA%20HIROSHI&rft.date=2019-10-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2019183260A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |