LASER PEELING DEVICE, LASER PEELING METHOD, AND METHOD OF MANUFACTURING ORGANIC EL DISPLAY

To provide an excellent laser peeling device.SOLUTION: A laser peeling device according to one embodiment peels a peeling layer from a substrate by irradiating a work having the substrate and the peeling layer formed on the substrate with a laser beam. A spot of the laser beam with which the work is...

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Bibliographische Detailangaben
Hauptverfasser:	ODA TOMOYA, NAKATA YUICHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CRYPTOGRAPHY CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DISPLAY DISPLAYING EDUCATION ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To provide an excellent laser peeling device.SOLUTION: A laser peeling device according to one embodiment peels a peeling layer from a substrate by irradiating a work having the substrate and the peeling layer formed on the substrate with a laser beam. A spot of the laser beam with which the work is irradiated has a square shape, and a long axis width L of the spot is 10-200 mm, a short axis width S of the spot is 2-30 mm, and the ratio L/S of the long axis width L to the short axis width S of the spot is 1-20.SELECTED DRAWING: Figure 6 【課題】優れたレーザ剥離装置を提供すること。【解決手段】一実施の形態に係るレーザ剥離装置は、基板と当該基板上に形成された剥離層とを備えるワークにレーザビームを照射して剥離層を基板から剥離するものである。ワークに照射されるレーザビームのスポットが方形状であり、スポットの長軸幅Ｌが１０〜２００ｍｍであり、スポットの短軸幅Ｓが２〜３０ｍｍであり、スポットの短軸幅Ｓに対する長軸幅Ｌの比Ｌ／Ｓが１〜２０である。【選択図】図６