POLYSILOXANE-BASED COMPOSITION

To provide a polysiloxane-based composition which has high heat resistance and light resistance, is excellent in gas barrier property, thermal shock resistance, and electrification reliability, and has good handleability when sealing an optical semiconductor element.SOLUTION: The polysiloxane-based...

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Bibliographische Detailangaben
Hauptverfasser:	TANIKAWA TOMOKO, TAKAGI NAOTO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a polysiloxane-based composition which has high heat resistance and light resistance, is excellent in gas barrier property, thermal shock resistance, and electrification reliability, and has good handleability when sealing an optical semiconductor element.SOLUTION: The polysiloxane-based composition comprises as essential components: (A) a polyhedron-structured polysiloxane modified body which is a hydrosilylation reaction product of a polyhedron-structured polysiloxane-based compound (a) having an alkenyl group, a compound (b) having a hydrosilyl group, and an organic silicon compound (a') having one alkenyl group in one molecule; and (B) a compound having two or more alkenyl groups in the molecule.SELECTED DRAWING: None 【課題】高い耐熱性、耐光性を有し、ガスバリア性、耐冷熱衝撃性および通電信頼性に優れ、光半導体素子を封止する際のハンドリング性が良好なポリシロキサン系組成物を提供することを目的とする。【解決手段】（Ａ）アルケニル基を有する多面体構造ポリシロキサン系化合物（ａ）と、ヒドロシリル基を有する化合物（ｂ）と、１分子中にアルケニル基を１個有する有機ケイ素化合物（ａ'）とのヒドロシリル化反応物である多面体構造ポリシロキサン変性体、（Ｂ）分子内にアルケニル基を二個以上有する化合物を必須成分とするとするポリシロキサン系組成物により、上記課題を解決することができる。【選択図】なし