HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER

To provide a sealed package having a device disposed on a wafer structure and a lid structure bonded to the device wafer.SOLUTION: A device wafer includes: a substrate; a metal ring disposed on a surface portion of the substrate around the device; and a bonding material disposed on the metal ring. A...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	STEPHEN H BLACK, GREGORY D TRACY, ADAM M KENNEDY, BUU Q DIEP, TSE E WONG, THOMAS ALLAN KOCIAN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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