SCRIBING METHOD AND SCRIBING APPARATUS
To form a scribe line on a glass substrate by one scan laser processing even when the glass substrate has a large thickness.SOLUTION: A scribing method for scribing a glass substrate G includes a scribe line formation step of forming a scribe line 31 by intermittently processing the inside of the gl...
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| creator | HAYASHI HIROYOSHI NAKATANI FUMIYOSHI |
| description | To form a scribe line on a glass substrate by one scan laser processing even when the glass substrate has a large thickness.SOLUTION: A scribing method for scribing a glass substrate G includes a scribe line formation step of forming a scribe line 31 by intermittently processing the inside of the glass substrate G in a plane direction by emitting a laser beam. A plurality of focal points lined on the optical axis of the laser beam are positioned at the inside of the glass substrate G. Among the plurality of focal points, the beam intensity of a first focal point closest to a surface on the side opposite to a surface irradiated with the laser is higher than those of the other plurality of focal points.SELECTED DRAWING: Figure 4
【課題】厚みの大きいガラス基板であっても、１スキャンのレーザ加工によってガラス基板にスクライブラインを形成できるようにする。【解決手段】スクライブ加工方法は、ガラス基板Ｇをスクライブ加工する方法であって、レーザ光を照射することによるガラス基板Ｇの内部加工を平面方向に断続的に行うことでスクライブライン３１を形成するスクライブライン形成工程を備えている。レーザ光の光軸上に並んだ複数の集光点がガラス基板Ｇの内部に位置している。複数の集光点のうち、レーザが照射される面とは反対側の面に最も近い第１の集光点のビーム強度が、複数の他の集光点のビーム強度よりも高い。【選択図】図４ |
| format | Patent |
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【課題】厚みの大きいガラス基板であっても、１スキャンのレーザ加工によってガラス基板にスクライブラインを形成できるようにする。【解決手段】スクライブ加工方法は、ガラス基板Ｇをスクライブ加工する方法であって、レーザ光を照射することによるガラス基板Ｇの内部加工を平面方向に断続的に行うことでスクライブライン３１を形成するスクライブライン形成工程を備えている。レーザ光の光軸上に並んだ複数の集光点がガラス基板Ｇの内部に位置している。複数の集光点のうち、レーザが照射される面とは反対側の面に最も近い第１の集光点のビーム強度が、複数の他の集光点のビーム強度よりも高い。【選択図】図４</description><language>eng ; jpn</language><subject>CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; GLASS ; MACHINE TOOLS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190425&DB=EPODOC&CC=JP&NR=2019064863A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190425&DB=EPODOC&CC=JP&NR=2019064863A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAYASHI HIROYOSHI</creatorcontrib><creatorcontrib>NAKATANI FUMIYOSHI</creatorcontrib><title>SCRIBING METHOD AND SCRIBING APPARATUS</title><description>To form a scribe line on a glass substrate by one scan laser processing even when the glass substrate has a large thickness.SOLUTION: A scribing method for scribing a glass substrate G includes a scribe line formation step of forming a scribe line 31 by intermittently processing the inside of the glass substrate G in a plane direction by emitting a laser beam. A plurality of focal points lined on the optical axis of the laser beam are positioned at the inside of the glass substrate G. Among the plurality of focal points, the beam intensity of a first focal point closest to a surface on the side opposite to a surface irradiated with the laser is higher than those of the other plurality of focal points.SELECTED DRAWING: Figure 4
【課題】厚みの大きいガラス基板であっても、１スキャンのレーザ加工によってガラス基板にスクライブラインを形成できるようにする。【解決手段】スクライブ加工方法は、ガラス基板Ｇをスクライブ加工する方法であって、レーザ光を照射することによるガラス基板Ｇの内部加工を平面方向に断続的に行うことでスクライブライン３１を形成するスクライブライン形成工程を備えている。レーザ光の光軸上に並んだ複数の集光点がガラス基板Ｇの内部に位置している。複数の集光点のうち、レーザが照射される面とは反対側の面に最も近い第１の集光点のビーム強度が、複数の他の集光点のビーム強度よりも高い。【選択図】図４</description><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>GLASS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFALdg7ydPL0c1fwdQ3x8HdRcPRzUYCLOQYEOAY5hoQG8zCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwNDSwMzEwszY0djohQBAP8RI_Y</recordid><startdate>20190425</startdate><enddate>20190425</enddate><creator>HAYASHI HIROYOSHI</creator><creator>NAKATANI FUMIYOSHI</creator><scope>EVB</scope></search><sort><creationdate>20190425</creationdate><title>SCRIBING METHOD AND SCRIBING APPARATUS</title><author>HAYASHI HIROYOSHI ; NAKATANI FUMIYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019064863A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>GLASS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>HAYASHI HIROYOSHI</creatorcontrib><creatorcontrib>NAKATANI FUMIYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAYASHI HIROYOSHI</au><au>NAKATANI FUMIYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SCRIBING METHOD AND SCRIBING APPARATUS</title><date>2019-04-25</date><risdate>2019</risdate><abstract>To form a scribe line on a glass substrate by one scan laser processing even when the glass substrate has a large thickness.SOLUTION: A scribing method for scribing a glass substrate G includes a scribe line formation step of forming a scribe line 31 by intermittently processing the inside of the glass substrate G in a plane direction by emitting a laser beam. A plurality of focal points lined on the optical axis of the laser beam are positioned at the inside of the glass substrate G. Among the plurality of focal points, the beam intensity of a first focal point closest to a surface on the side opposite to a surface irradiated with the laser is higher than those of the other plurality of focal points.SELECTED DRAWING: Figure 4
【課題】厚みの大きいガラス基板であっても、１スキャンのレーザ加工によってガラス基板にスクライブラインを形成できるようにする。【解決手段】スクライブ加工方法は、ガラス基板Ｇをスクライブ加工する方法であって、レーザ光を照射することによるガラス基板Ｇの内部加工を平面方向に断続的に行うことでスクライブライン３１を形成するスクライブライン形成工程を備えている。レーザ光の光軸上に並んだ複数の集光点がガラス基板Ｇの内部に位置している。複数の集光点のうち、レーザが照射される面とは反対側の面に最も近い第１の集光点のビーム強度が、複数の他の集光点のビーム強度よりも高い。【選択図】図４</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | SCRIBING METHOD AND SCRIBING APPARATUS |
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