SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

To provide a substrate processing apparatus which prevents adherence of a particle on a wafer at the time of opening/closing a pod lid.SOLUTION: A substrate processing apparatus 100 comprises: a placement part where a substrate container 110 housing a substrate is placed; a guide part 121 which comp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IWAKI HIROTO, AIZAWA SATOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!