PICKUP DEVICE OF SEMICONDUCTOR CHIP, MOUNTING DEVICE OF THE SEMICONDUCTOR CHIP, AND MOUNTING METHOD
To stably peel off a semiconductor chip from an adhesive sheet.SOLUTION: A pickup device of a semiconductor chip, which pick-ups a semiconductor chip t adhered to and held by an adhesion sheet 11 from the adhesion sheet 11, includes: a pick-up mechanism picking-up the semiconductor chip t from the a...
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| creator | SHIGA KOICHI KONISHI NOBUAKI |
| description | To stably peel off a semiconductor chip from an adhesive sheet.SOLUTION: A pickup device of a semiconductor chip, which pick-ups a semiconductor chip t adhered to and held by an adhesion sheet 11 from the adhesion sheet 11, includes: a pick-up mechanism picking-up the semiconductor chip t from the adhesion sheet 11; and a plurality of push-up bodies 62a to 62d that are arranged while having the same shaft center and is movably set to an axial direction each other. A negative pressure is applied to a part where the semiconductor chip t picked up in the adhesion sheet 11 is positioned from the side opposite to the semiconductor chip t. When the semiconductor chip t is picked up by the pick-up mechanism, the pickup device of a semiconductor chip, comprises: a pushing-up mechanism 60 that pushes up the semiconductor chip t by the plurality of push-up bodies 62a to 62d; and a negative adjustment mechanism 63b in which the magnitude of the negative pressure is set to -85kPa or less as a gauge pressure.SELECTED DRAWING: Figure 3
【課題】半導体チップを粘着シートから安定して剥離する。【解決手段】粘着シート１１に貼着保持された半導体チップｔを粘着シート１１からピックアップする半導体チップのピックアップ装置であって、粘着シート１１から半導体チップｔをピックアップするピックアップ機構と、軸心を同じにして配置され互いに軸心方向に移動自在に設けられた複数の押し上げ体６２ａ〜６２ｄを有する。粘着シート１１においてピックアップされる半導体チップｔが位置する部分に、半導体チップｔとは反対側から負圧を作用させ、この半導体チップｔがピックアップ機構によってピックアップされるときに、この半導体チップｔを複数の押し上げ体６２ａ〜６２ｄによって突き上げる突き上げ機構６０と、負圧の大きさをゲージ圧で−８５ｋＰａ以下に設定する負圧調整機構６３ｂと、を備える。【選択図】図３ |
| format | Patent |
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【課題】半導体チップを粘着シートから安定して剥離する。【解決手段】粘着シート１１に貼着保持された半導体チップｔを粘着シート１１からピックアップする半導体チップのピックアップ装置であって、粘着シート１１から半導体チップｔをピックアップするピックアップ機構と、軸心を同じにして配置され互いに軸心方向に移動自在に設けられた複数の押し上げ体６２ａ〜６２ｄを有する。粘着シート１１においてピックアップされる半導体チップｔが位置する部分に、半導体チップｔとは反対側から負圧を作用させ、この半導体チップｔがピックアップ機構によってピックアップされるときに、この半導体チップｔを複数の押し上げ体６２ａ〜６２ｄによって突き上げる突き上げ機構６０と、負圧の大きさをゲージ圧で−８５ｋＰａ以下に設定する負圧調整機構６３ｂと、を備える。【選択図】図３</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190221&DB=EPODOC&CC=JP&NR=2019029650A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190221&DB=EPODOC&CC=JP&NR=2019029650A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIGA KOICHI</creatorcontrib><creatorcontrib>KONISHI NOBUAKI</creatorcontrib><title>PICKUP DEVICE OF SEMICONDUCTOR CHIP, MOUNTING DEVICE OF THE SEMICONDUCTOR CHIP, AND MOUNTING METHOD</title><description>To stably peel off a semiconductor chip from an adhesive sheet.SOLUTION: A pickup device of a semiconductor chip, which pick-ups a semiconductor chip t adhered to and held by an adhesion sheet 11 from the adhesion sheet 11, includes: a pick-up mechanism picking-up the semiconductor chip t from the adhesion sheet 11; and a plurality of push-up bodies 62a to 62d that are arranged while having the same shaft center and is movably set to an axial direction each other. A negative pressure is applied to a part where the semiconductor chip t picked up in the adhesion sheet 11 is positioned from the side opposite to the semiconductor chip t. When the semiconductor chip t is picked up by the pick-up mechanism, the pickup device of a semiconductor chip, comprises: a pushing-up mechanism 60 that pushes up the semiconductor chip t by the plurality of push-up bodies 62a to 62d; and a negative adjustment mechanism 63b in which the magnitude of the negative pressure is set to -85kPa or less as a gauge pressure.SELECTED DRAWING: Figure 3
【課題】半導体チップを粘着シートから安定して剥離する。【解決手段】粘着シート１１に貼着保持された半導体チップｔを粘着シート１１からピックアップする半導体チップのピックアップ装置であって、粘着シート１１から半導体チップｔをピックアップするピックアップ機構と、軸心を同じにして配置され互いに軸心方向に移動自在に設けられた複数の押し上げ体６２ａ〜６２ｄを有する。粘着シート１１においてピックアップされる半導体チップｔが位置する部分に、半導体チップｔとは反対側から負圧を作用させ、この半導体チップｔがピックアップ機構によってピックアップされるときに、この半導体チップｔを複数の押し上げ体６２ａ〜６２ｄによって突き上げる突き上げ機構６０と、負圧の大きさをゲージ圧で−８５ｋＰａ以下に設定する負圧調整機構６３ｂと、を備える。【選択図】図３</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgO8HT2Dg1QcHEN83R2VfB3Uwh29fV09vdzCXUO8Q9ScPbwDNBR8PUP9Qvx9HNHUhbi4YpVqaOfC0K5r2uIh78LDwNrWmJOcSovlOZmUHJzDXH20E0tyI9PLS5ITE7NSy2J9wowMjC0NDCyNDM1cDQmShEAXHk0bQ</recordid><startdate>20190221</startdate><enddate>20190221</enddate><creator>SHIGA KOICHI</creator><creator>KONISHI NOBUAKI</creator><scope>EVB</scope></search><sort><creationdate>20190221</creationdate><title>PICKUP DEVICE OF SEMICONDUCTOR CHIP, MOUNTING DEVICE OF THE SEMICONDUCTOR CHIP, AND MOUNTING METHOD</title><author>SHIGA KOICHI ; KONISHI NOBUAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019029650A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIGA KOICHI</creatorcontrib><creatorcontrib>KONISHI NOBUAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIGA KOICHI</au><au>KONISHI NOBUAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PICKUP DEVICE OF SEMICONDUCTOR CHIP, MOUNTING DEVICE OF THE SEMICONDUCTOR CHIP, AND MOUNTING METHOD</title><date>2019-02-21</date><risdate>2019</risdate><abstract>To stably peel off a semiconductor chip from an adhesive sheet.SOLUTION: A pickup device of a semiconductor chip, which pick-ups a semiconductor chip t adhered to and held by an adhesion sheet 11 from the adhesion sheet 11, includes: a pick-up mechanism picking-up the semiconductor chip t from the adhesion sheet 11; and a plurality of push-up bodies 62a to 62d that are arranged while having the same shaft center and is movably set to an axial direction each other. A negative pressure is applied to a part where the semiconductor chip t picked up in the adhesion sheet 11 is positioned from the side opposite to the semiconductor chip t. When the semiconductor chip t is picked up by the pick-up mechanism, the pickup device of a semiconductor chip, comprises: a pushing-up mechanism 60 that pushes up the semiconductor chip t by the plurality of push-up bodies 62a to 62d; and a negative adjustment mechanism 63b in which the magnitude of the negative pressure is set to -85kPa or less as a gauge pressure.SELECTED DRAWING: Figure 3
【課題】半導体チップを粘着シートから安定して剥離する。【解決手段】粘着シート１１に貼着保持された半導体チップｔを粘着シート１１からピックアップする半導体チップのピックアップ装置であって、粘着シート１１から半導体チップｔをピックアップするピックアップ機構と、軸心を同じにして配置され互いに軸心方向に移動自在に設けられた複数の押し上げ体６２ａ〜６２ｄを有する。粘着シート１１においてピックアップされる半導体チップｔが位置する部分に、半導体チップｔとは反対側から負圧を作用させ、この半導体チップｔがピックアップ機構によってピックアップされるときに、この半導体チップｔを複数の押し上げ体６２ａ〜６２ｄによって突き上げる突き上げ機構６０と、負圧の大きさをゲージ圧で−８５ｋＰａ以下に設定する負圧調整機構６３ｂと、を備える。【選択図】図３</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | PICKUP DEVICE OF SEMICONDUCTOR CHIP, MOUNTING DEVICE OF THE SEMICONDUCTOR CHIP, AND MOUNTING METHOD |
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