DIVISION DEVICE
To provide a division device comprising a function for re-adhering a chip floated from an adhesion tape due to an expansion of the adhesion tape in a division step to the adhesion tape.SOLUTION: Re-adhesion means 50 comprises a table 51 which can be heated with a heater 52 while sucking and holding...
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| creator | WATABE KOJI |
| description | To provide a division device comprising a function for re-adhering a chip floated from an adhesion tape due to an expansion of the adhesion tape in a division step to the adhesion tape.SOLUTION: Re-adhesion means 50 comprises a table 51 which can be heated with a heater 52 while sucking and holding a divided work W. After the division of the work W into chip C by expanding an adhesion tape T by division means 30, looseness is removed by heating the adhesion tape T by heating means 40, and the work W and the adhesion tape T are heated on the table 51 of the re-adhesion means 50 while sucking and holding the work W. Thus, the adhesion tape T which is soften by heating can be followed and re-adhered to the chips C floated from the adhesion tape T due to the expansion of the adhesion tape T at the division. The re-adhesion means 50 is comprised in a division device 1, and therefore, the adhesion tape T can be efficiently re-adhered to the chips C floated from the adhesion tape T without moving the work W to the other device.SELECTED DRAWING: Figure 1
【課題】分割工程での粘着テープの拡張により粘着テープから浮いてしまったチップを粘着テープに再度接着する機能を備えた分割装置を提供する。【解決手段】再接着手段５０は、分割されたワークＷを吸引保持しつつヒータ５２で加熱可能なテーブル５１を備える。分割手段３０により粘着テープＴを拡張してワークＷをチップＣに分割した後、加熱手段４０により粘着テープＴを加熱してその弛みを除去し、再接着手段５０のテーブル５１上でワークＷを吸引保持しつつワークＷ及び粘着テープＴを加熱することで、分割の際の粘着テープＴの拡張により粘着テープＴから浮いてしまったチップＣに加温によって柔らかくなった粘着テープＴを倣わせて再度接着することができる。再接着手段５０を分割装置１内に備えたことで、ワークＷを他の装置に移動させることなく、粘着テープＴから浮いたチップＣに粘着テープＴを効率的に再度接着することができる。【選択図】図１ |
| format | Patent |
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【課題】分割工程での粘着テープの拡張により粘着テープから浮いてしまったチップを粘着テープに再度接着する機能を備えた分割装置を提供する。【解決手段】再接着手段５０は、分割されたワークＷを吸引保持しつつヒータ５２で加熱可能なテーブル５１を備える。分割手段３０により粘着テープＴを拡張してワークＷをチップＣに分割した後、加熱手段４０により粘着テープＴを加熱してその弛みを除去し、再接着手段５０のテーブル５１上でワークＷを吸引保持しつつワークＷ及び粘着テープＴを加熱することで、分割の際の粘着テープＴの拡張により粘着テープＴから浮いてしまったチップＣに加温によって柔らかくなった粘着テープＴを倣わせて再度接着することができる。再接着手段５０を分割装置１内に備えたことで、ワークＷを他の装置に移動させることなく、粘着テープＴから浮いたチップＣに粘着テープＴを効率的に再度接着することができる。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190221&DB=EPODOC&CC=JP&NR=2019029604A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190221&DB=EPODOC&CC=JP&NR=2019029604A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WATABE KOJI</creatorcontrib><title>DIVISION DEVICE</title><description>To provide a division device comprising a function for re-adhering a chip floated from an adhesion tape due to an expansion of the adhesion tape in a division step to the adhesion tape.SOLUTION: Re-adhesion means 50 comprises a table 51 which can be heated with a heater 52 while sucking and holding a divided work W. After the division of the work W into chip C by expanding an adhesion tape T by division means 30, looseness is removed by heating the adhesion tape T by heating means 40, and the work W and the adhesion tape T are heated on the table 51 of the re-adhesion means 50 while sucking and holding the work W. Thus, the adhesion tape T which is soften by heating can be followed and re-adhered to the chips C floated from the adhesion tape T due to the expansion of the adhesion tape T at the division. The re-adhesion means 50 is comprised in a division device 1, and therefore, the adhesion tape T can be efficiently re-adhered to the chips C floated from the adhesion tape T without moving the work W to the other device.SELECTED DRAWING: Figure 1
【課題】分割工程での粘着テープの拡張により粘着テープから浮いてしまったチップを粘着テープに再度接着する機能を備えた分割装置を提供する。【解決手段】再接着手段５０は、分割されたワークＷを吸引保持しつつヒータ５２で加熱可能なテーブル５１を備える。分割手段３０により粘着テープＴを拡張してワークＷをチップＣに分割した後、加熱手段４０により粘着テープＴを加熱してその弛みを除去し、再接着手段５０のテーブル５１上でワークＷを吸引保持しつつワークＷ及び粘着テープＴを加熱することで、分割の際の粘着テープＴの拡張により粘着テープＴから浮いてしまったチップＣに加温によって柔らかくなった粘着テープＴを倣わせて再度接着することができる。再接着手段５０を分割装置１内に備えたことで、ワークＷを他の装置に移動させることなく、粘着テープＴから浮いたチップＣに粘着テープＴを効率的に再度接着することができる。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOB38QzzDPb091NwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaWBkaWZgYmjsZEKQIAG7wdoQ</recordid><startdate>20190221</startdate><enddate>20190221</enddate><creator>WATABE KOJI</creator><scope>EVB</scope></search><sort><creationdate>20190221</creationdate><title>DIVISION DEVICE</title><author>WATABE KOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019029604A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WATABE KOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WATABE KOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIVISION DEVICE</title><date>2019-02-21</date><risdate>2019</risdate><abstract>To provide a division device comprising a function for re-adhering a chip floated from an adhesion tape due to an expansion of the adhesion tape in a division step to the adhesion tape.SOLUTION: Re-adhesion means 50 comprises a table 51 which can be heated with a heater 52 while sucking and holding a divided work W. After the division of the work W into chip C by expanding an adhesion tape T by division means 30, looseness is removed by heating the adhesion tape T by heating means 40, and the work W and the adhesion tape T are heated on the table 51 of the re-adhesion means 50 while sucking and holding the work W. Thus, the adhesion tape T which is soften by heating can be followed and re-adhered to the chips C floated from the adhesion tape T due to the expansion of the adhesion tape T at the division. The re-adhesion means 50 is comprised in a division device 1, and therefore, the adhesion tape T can be efficiently re-adhered to the chips C floated from the adhesion tape T without moving the work W to the other device.SELECTED DRAWING: Figure 1
【課題】分割工程での粘着テープの拡張により粘着テープから浮いてしまったチップを粘着テープに再度接着する機能を備えた分割装置を提供する。【解決手段】再接着手段５０は、分割されたワークＷを吸引保持しつつヒータ５２で加熱可能なテーブル５１を備える。分割手段３０により粘着テープＴを拡張してワークＷをチップＣに分割した後、加熱手段４０により粘着テープＴを加熱してその弛みを除去し、再接着手段５０のテーブル５１上でワークＷを吸引保持しつつワークＷ及び粘着テープＴを加熱することで、分割の際の粘着テープＴの拡張により粘着テープＴから浮いてしまったチップＣに加温によって柔らかくなった粘着テープＴを倣わせて再度接着することができる。再接着手段５０を分割装置１内に備えたことで、ワークＷを他の装置に移動させることなく、粘着テープＴから浮いたチップＣに粘着テープＴを効率的に再度接着することができる。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DIVISION DEVICE |
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