LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device, by which the displacement is automatically corrected when a plurality of light-emitting elements are disposed on a common substrate and then, a junction layer is fused to bond each light-emitting element to a common substrate.SOLUTION: A method for manufacturing a light-emitting device comprises: the steps of: preparing a common substrate 20 on which a plurality of isosceles triangle-shaped conductive pads 21 are disposed so that their width-decreasing directions alternate; and mounting a plurality of light-emitting elements 24 each having a backside conductive layer through a bonding material so as to overlap with the conductive pads of the common substrate. The light-emitting elements and backside conductive layers each have a two-dimensional shape corresponding to the conductive pads. The backside conductive layers have a shape of which the width decreases along the same direction as the light-emitting element; the bottom of the backside conductive layer is disposed so as to be at least partially displaced outside the conductive pad; and a width-decreasing portion of the backside conductive layer is placed at a position in a direction from a width-decreasing portion of the conductive pad toward its bottom. The method further comprises the step of heating and fusing the bonding material with the plurality of light-emitting elements mounted thereon to correct displacement by a surface tension of the fused bonding material and then, cooling and solidifying the bonding material in this state.SELECTED DRAWING: Figure 2 【課題】共通基板上に複数の発光素子を配置し、接合層を溶融して発光素子を共通基板に結合する際、自動的に位置のずれが修正される発光装置の製造方法を提供する。【解決手段】複数の２等辺３角形形状の導電性パッド２１は幅が狭くなる方向が互い違いになって配置されている共通基板２０を準備する工程と、共通基板の導電性パッドに重ねて、裏面導電層を備えた複数の発光素子２４を接合材料を介して搭載する工程と、を含み、発光素子及び裏面導電層は導電性パッドに対応する平面形状を有し、裏面導電層は発光素子と同一方向に沿って幅が狭くなる形状を備え、裏面導電層の底部は少なくとも一部導電性パッド外に位置ずれして配置され、裏面導電層の幅狭部は導電性パッドの幅狭部から底部に向った位置に搭載され、複数の発光素子を搭載した状態で接合材料を加熱、溶融し、溶融した接合材料の表面張力により位置ずれを修正し、この状態で冷却、固化する工程を含む。【選択図】図２