SUBSTRATE PROCESSING DEVICE

PROBLEM TO BE SOLVED: To prevent the pollution in a device owing to dummy dispensed process liquid.SOLUTION: A substrate processing device according to an embodiment comprises: a holding part; a nozzle; a nozzle bath; and a moving mechanism . The holding part serves to hold a substrate. The nozzle i...

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Hauptverfasser: TANIGUCHI HIROKI, IKEDA YOSHIKANE, KOBAYAKAWA AKIRA, SHINOHARA KAZUYOSHI
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creator TANIGUCHI HIROKI
IKEDA YOSHIKANE
KOBAYAKAWA AKIRA
SHINOHARA KAZUYOSHI
description PROBLEM TO BE SOLVED: To prevent the pollution in a device owing to dummy dispensed process liquid.SOLUTION: A substrate processing device according to an embodiment comprises: a holding part; a nozzle; a nozzle bath; and a moving mechanism . The holding part serves to hold a substrate. The nozzle is arranged to emit a process liquid toward the substrate held by the holding part from above the substrate. The nozzle bath is disposed at a retreat position to which the nozzle is retrieved from above the substrate. The nozzle bath receives the process liquid emitted from the nozzle retrieved to the retreat position, and discharges the process liquid to outside. The moving mechanism horizontally moves the nozzle between a processing position and the retreat position over the substrate. In addition, the nozzle emits the process liquid toward the nozzle bath from a position of the same height as that of the nozzle when it is moved horizontally. The nozzle bath has a side wall and a cleaning liquid-supplying part. The side wall extends to a position higher than the height of a process liquid discharge port of the nozzle which is retrieved to the retreat position. The cleaning liquid-supplying part serves to supply the cleaning liquid to the side wall.SELECTED DRAWING: Figure 5 【課題】ダミーディスペンスされた処理液による装置内部の汚染を防止すること。【解決手段】実施形態に係る基板処理装置は、保持部と、ノズルと、ノズルバスと、移動機構とを備える。保持部は、基板を保持する。ノズルは、保持部に保持された基板の上方から基板に処理液を吐出する。ノズルバスは、ノズルを基板の上方から退避させた退避位置に配置され、退避位置に退避させたノズルから吐出された処理液を受けて外部へ排出する。移動機構は、基板の上方における処理位置と退避位置との間でノズルを水平移動させる。また、ノズルは、水平移動時と同一の高さ位置からノズルバスに対して処理液を吐出する。また、ノズルバスは、側壁と、洗浄液供給部とを備える。側壁は、退避位置に退避させたノズルにおける処理液の吐出口の高さ位置よりも高い位置まで延在する。洗浄液供給部は、側壁に洗浄液を供給する。【選択図】図5
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The holding part serves to hold a substrate. The nozzle is arranged to emit a process liquid toward the substrate held by the holding part from above the substrate. The nozzle bath is disposed at a retreat position to which the nozzle is retrieved from above the substrate. The nozzle bath receives the process liquid emitted from the nozzle retrieved to the retreat position, and discharges the process liquid to outside. The moving mechanism horizontally moves the nozzle between a processing position and the retreat position over the substrate. In addition, the nozzle emits the process liquid toward the nozzle bath from a position of the same height as that of the nozzle when it is moved horizontally. The nozzle bath has a side wall and a cleaning liquid-supplying part. The side wall extends to a position higher than the height of a process liquid discharge port of the nozzle which is retrieved to the retreat position. The cleaning liquid-supplying part serves to supply the cleaning liquid to the side wall.SELECTED DRAWING: Figure 5 【課題】ダミーディスペンスされた処理液による装置内部の汚染を防止すること。【解決手段】実施形態に係る基板処理装置は、保持部と、ノズルと、ノズルバスと、移動機構とを備える。保持部は、基板を保持する。ノズルは、保持部に保持された基板の上方から基板に処理液を吐出する。ノズルバスは、ノズルを基板の上方から退避させた退避位置に配置され、退避位置に退避させたノズルから吐出された処理液を受けて外部へ排出する。移動機構は、基板の上方における処理位置と退避位置との間でノズルを水平移動させる。また、ノズルは、水平移動時と同一の高さ位置からノズルバスに対して処理液を吐出する。また、ノズルバスは、側壁と、洗浄液供給部とを備える。側壁は、退避位置に退避させたノズルにおける処理液の吐出口の高さ位置よりも高い位置まで延在する。洗浄液供給部は、側壁に洗浄液を供給する。【選択図】図5</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180823&amp;DB=EPODOC&amp;CC=JP&amp;NR=2018133429A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180823&amp;DB=EPODOC&amp;CC=JP&amp;NR=2018133429A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANIGUCHI HIROKI</creatorcontrib><creatorcontrib>IKEDA YOSHIKANE</creatorcontrib><creatorcontrib>KOBAYAKAWA AKIRA</creatorcontrib><creatorcontrib>SHINOHARA KAZUYOSHI</creatorcontrib><title>SUBSTRATE PROCESSING DEVICE</title><description>PROBLEM TO BE SOLVED: To prevent the pollution in a device owing to dummy dispensed process liquid.SOLUTION: A substrate processing device according to an embodiment comprises: a holding part; a nozzle; a nozzle bath; and a moving mechanism . The holding part serves to hold a substrate. The nozzle is arranged to emit a process liquid toward the substrate held by the holding part from above the substrate. The nozzle bath is disposed at a retreat position to which the nozzle is retrieved from above the substrate. The nozzle bath receives the process liquid emitted from the nozzle retrieved to the retreat position, and discharges the process liquid to outside. The moving mechanism horizontally moves the nozzle between a processing position and the retreat position over the substrate. In addition, the nozzle emits the process liquid toward the nozzle bath from a position of the same height as that of the nozzle when it is moved horizontally. The nozzle bath has a side wall and a cleaning liquid-supplying part. The side wall extends to a position higher than the height of a process liquid discharge port of the nozzle which is retrieved to the retreat position. The cleaning liquid-supplying part serves to supply the cleaning liquid to the side wall.SELECTED DRAWING: Figure 5 【課題】ダミーディスペンスされた処理液による装置内部の汚染を防止すること。【解決手段】実施形態に係る基板処理装置は、保持部と、ノズルと、ノズルバスと、移動機構とを備える。保持部は、基板を保持する。ノズルは、保持部に保持された基板の上方から基板に処理液を吐出する。ノズルバスは、ノズルを基板の上方から退避させた退避位置に配置され、退避位置に退避させたノズルから吐出された処理液を受けて外部へ排出する。移動機構は、基板の上方における処理位置と退避位置との間でノズルを水平移動させる。また、ノズルは、水平移動時と同一の高さ位置からノズルバスに対して処理液を吐出する。また、ノズルバスは、側壁と、洗浄液供給部とを備える。側壁は、退避位置に退避させたノズルにおける処理液の吐出口の高さ位置よりも高い位置まで延在する。洗浄液供給部は、側壁に洗浄液を供給する。【選択図】図5</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAODnUKDglyDHFVCAjyd3YNDvb0c1dwcQ3zdHblYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoYWhsbGJkaWjsZEKQIApRMhIg</recordid><startdate>20180823</startdate><enddate>20180823</enddate><creator>TANIGUCHI HIROKI</creator><creator>IKEDA YOSHIKANE</creator><creator>KOBAYAKAWA AKIRA</creator><creator>SHINOHARA KAZUYOSHI</creator><scope>EVB</scope></search><sort><creationdate>20180823</creationdate><title>SUBSTRATE PROCESSING DEVICE</title><author>TANIGUCHI HIROKI ; IKEDA YOSHIKANE ; KOBAYAKAWA AKIRA ; SHINOHARA KAZUYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2018133429A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TANIGUCHI HIROKI</creatorcontrib><creatorcontrib>IKEDA YOSHIKANE</creatorcontrib><creatorcontrib>KOBAYAKAWA AKIRA</creatorcontrib><creatorcontrib>SHINOHARA KAZUYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANIGUCHI HIROKI</au><au>IKEDA YOSHIKANE</au><au>KOBAYAKAWA AKIRA</au><au>SHINOHARA KAZUYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING DEVICE</title><date>2018-08-23</date><risdate>2018</risdate><abstract>PROBLEM TO BE SOLVED: To prevent the pollution in a device owing to dummy dispensed process liquid.SOLUTION: A substrate processing device according to an embodiment comprises: a holding part; a nozzle; a nozzle bath; and a moving mechanism . The holding part serves to hold a substrate. The nozzle is arranged to emit a process liquid toward the substrate held by the holding part from above the substrate. The nozzle bath is disposed at a retreat position to which the nozzle is retrieved from above the substrate. The nozzle bath receives the process liquid emitted from the nozzle retrieved to the retreat position, and discharges the process liquid to outside. The moving mechanism horizontally moves the nozzle between a processing position and the retreat position over the substrate. In addition, the nozzle emits the process liquid toward the nozzle bath from a position of the same height as that of the nozzle when it is moved horizontally. The nozzle bath has a side wall and a cleaning liquid-supplying part. The side wall extends to a position higher than the height of a process liquid discharge port of the nozzle which is retrieved to the retreat position. The cleaning liquid-supplying part serves to supply the cleaning liquid to the side wall.SELECTED DRAWING: Figure 5 【課題】ダミーディスペンスされた処理液による装置内部の汚染を防止すること。【解決手段】実施形態に係る基板処理装置は、保持部と、ノズルと、ノズルバスと、移動機構とを備える。保持部は、基板を保持する。ノズルは、保持部に保持された基板の上方から基板に処理液を吐出する。ノズルバスは、ノズルを基板の上方から退避させた退避位置に配置され、退避位置に退避させたノズルから吐出された処理液を受けて外部へ排出する。移動機構は、基板の上方における処理位置と退避位置との間でノズルを水平移動させる。また、ノズルは、水平移動時と同一の高さ位置からノズルバスに対して処理液を吐出する。また、ノズルバスは、側壁と、洗浄液供給部とを備える。側壁は、退避位置に退避させたノズルにおける処理液の吐出口の高さ位置よりも高い位置まで延在する。洗浄液供給部は、側壁に洗浄液を供給する。【選択図】図5</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE PROCESSING DEVICE
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