COOLER

PROBLEM TO BE SOLVED: To provide a cooler in which the temperature of the heat receiving surface of a heat receiving section can be made uniform.SOLUTION: A cooler (100) has a cooling structure (5) and a connection pipe structure (11) for connecting more than one cooling structures (5). The cooling...

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Bibliographische Detailangaben
1. Verfasser:	OTAKA MIKIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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